INDUSTRY NEWS

300-mm Imperative

SEZ Group and Samsung say their new joint project to develop alternative wafer-cleaning methods will speed the chipmaker's transition to 300-mm wafer processing. The project's goal is to improve process capability, yield, and throughput. The partners plan to develop etch and cleaning technologies to replace some of Samsung's batch wafer processes with less costly and more effective single-wafer applications. The project will focus on front-side polysilicon etchback, removal of metal and nonmetal films, and wafer cleaning. SEZ has installed its Spin-Processor 303 at a Samsung site, and the tool manufacturer is performing 300-mm wafer reclaim processes for the chipmaker. SEZ Group says its tools reduce failures and process steps, paving the way to 300-mm wafer processing.

M+W to build TI cleanroom

Texas Instruments has hired M+W Zander to build a new cleanroom inside its 300-mm DMOS-6 fab, located at TI's headquarters in Dallas. M+W also designed the $50-million project, which is scheduled for completion in the first half of 2000.

Entegris scores FOUP win

Entegris will supply several hundred front-opening unified pods to Semiconductor 300, the joint chipmaking venture between Infineon and Motorola. The FOUPs have a 25-wafer capacity and comply with SEMI specifications. The functioning 300-mm pilot line is located in Dresden, Germany. The Chaska, MN—based vendor will help Semiconductor 300 integrate the pods into its front-end processes and wafer-shipping plans.

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