Resist Removal Tool

GaSonics International

San Jose, CA

The PEP Iridia can perform both photoresist and residue removal operations in a single chamber without damaging chips or leaving residue. The dry-plasma process offers a lower cost of ownership than wet chemistries for such applications as postimplant resist and postetch residue removal. Using the Iridia module on the multichamber PEP platform can reduce the costs of chemicals, water, and waste disposal as well as lessen environmental impact. One configuration option is the Iridia DL, which features an overhead lamp tray that rapidly heats the wafer to facilitate bulk and implanted photoresist removal. This option provides closed-loop temperature control that can speed process steps for increased throughput. (Semicon West, San Francisco, South Hall, Booth 1316)

Compound Molecular Pumps

Osaka Vacuum

San Jose, CA

Designed for low-k dielectric and CVD processes, Mag-Lev compound molecular pumps use optimal hydrogen and argon pumping speeds for rugged operation. Pumps operate from 700 to 3400 L/sec. They accommodate both

200- and 300-mm wafer processes. (Semicon West, San Francisco, South Hall, Booth 1330)

Curing Oven

Specialty Coating Systems

Indianapolis, IN

The Model 7406 XR oven can be used to cure both air- and heat-cure conformal coatings. The infrared convection heating system features four heating zones and controllable temperature ramp-up and ramp-down. The oven has a 500-mm-wide pin-chain conveyor. The conveyor speed and temperature settings can be called up from memory to suit requirements of coated assemblies. Oven dwell times are selectable between 31/2 and 35 minutes, as are temperatures up to 125°C. The standard heater rating is 16 kW, but further capacity of 8 kW can be added. Offering stainless-steel internal construction and explosion-resistant design, the oven can be integrated with the manufacturer's Model 4398 selective coating system. (Semicon West, San Francisco, South Hall, Booth 2706)

300-mm FOUP

Incam Solutions

Grenoble, France

A front-opening unified pod (FOUP) stores, handles, and transports single test wafers in complete compatibility with fab transportation systems and fab materials execution systems. The FOUP for One is a microenvironmental box that prevents cross- and backside contamination, improves storage density, minimizes problems associated with wafer sorting, and prevents exposure to airborne molecular contamination when moving wafers within the fab as well as between test and manufacturing facilities. The module is made from a noncontaminating polycarbonate-based material that dissipates electrostatic charge, and has transparent backside flanges for visual inspection. A frontside radio-frequency tag facilitates single-wafer tracking. Top and bottom kinematic couplings permit up to seven pods to be stacked. (Semicon West, San Francisco, South Hall, Booth 3125)

Parts-Cleaning System

Forward Technology

Minneapolis, MN

The PA-series aqueous cleaning and drying system removes particles and organic films from both simple and complex parts. Its constant flow recirculation feature monitors flow rates of tank liquid and compensates for filter loading. The basic system includes a wash station, a two-stage cascade rinse station, and a hot-air dryer. An automated transport mechanism moves parts from station to station. Available ultrasonic frequencies range from 25 to 120 kHz. Part transport, ultrasonics, liquid level, and temperature are PLC controlled. Tanks and plumbing are made of passivated 316 stainless steel. The high-throughput system can be used to wash disk drives, high-vacuum components, optical components, and ultrapure gas valves.

O-Ring—Free Union

Furon

Laguna Niguel, CA

A PFA coupling for fluid-handling systems, the 2-in. No-O-Ring union provides leak-free sealing without O-rings. Problems caused by O-ring compression set are thus avoided. Offering maintenance-free operation and the ability to open and close indefinitely without leakage, the union is suited for many applications in high-purity and corrosive chemical environments, including pumps and valves that are welded in but require routine access. Its single-material construction allows the coupling to expand and contract at the same rate so that it can operate within a wide range of ambient temperatures. Construction and design eliminate elastomer contamination and entrapment areas. The recently introduced 2-in. union is available from stock, as are 1/2-, 3/4- , and 1-in. versions. All components are tested, assembled, and double-bagged in a Class 100 cleanroom. (Semicon West, San Francisco, South Hall, Booth 1510)

200-mm Track System

Rite Track

West Chester, OH

An enhanced addition to the 88-series of track systems, the 88e 200-mm system includes low-k dielectric coater and oxygen-free dielectric bake modules for use with spin-on low-k dielectric chemistries. The coater features resist temperature control, a catch-cup rinse, bottom-side edge-bead removal, and programmable topside edge-bead removal. Options with this module are a air temperature and humidity controller and integrated ULPA hoods. Hot plates and chill plates have an integrated design for optimal wafer-to-wafer repeatability; the hot plate offers nominal uniformity of ±0.15°C and true temperature control in ranges extending from 50° to more than 425°C. Design changes in the vapor prime and bake modules offer process capability improvements designed to reduce system cost of ownership. The system's low-contact transfer arms and optional proximity hot and chill plates, along with its incorporation of low-contact spin chucks, minimize backside contamination. (Semicon West, San Francisco, North Hall, Booth 6752)

Defect Characterization Tools

FEI

Hillsboro, OR

A family of defect characterization tools accommodates both 200- and 300-mm wafers while offering imaging and navigational capabilities for design rules down to 0.13 µm. The wafer SEM and DualBeam FIB/SEM share software and a user interface, thus enhancing cross-training efficiency, and offer the same sample geometry and imaging performance. The DualBeam system provides fully automated defect cross-sectioning and sample preparation. It features delineation etch beam gas chemistry that offers oxide layer delineation equivalent to wet etches without attacking silicon or polysilicon and without the hazardous materials used in other gas-etch chemistries. All wafer-level instruments in the product series are fully fab compatible. (Semicon West, San Francisco, South Hall, Booth 2725; San Jose, McEnery Hall, Booth 9706)

Visible Reflectometer

Rudolph Technologies

Flanders, NJ

The addition of a visible reflectometer enhances the analytical and characterization power of SpectraLaser film-thickness metrology systems, enabling one metrology tool to cover the thickness range of 180—940 nm. The reflectometer and laser-spectroscopic ellipsometer together provide the measurement speed and thin-film performance necessary for CMP and etch applications, including CMP polish rate and endpoint monitoring, etch-rate characterization, and interlayer dielectric, photoresist, and low-k dielectric thickness analysis. Polysilicon can be measured in the range of 100 Å to >2 µm with a single measurement protocol, while polysilicon thinner than 100 Å can be measured with the laser ellipsometer. The 2-µm-diam spot size enables measurements within a 10-µm site. Both the reflectometer and the ellipsometer can analyze more than 110 wafers per hour. The visible reflectometer is designed for integration with the manufacturer's Vanguard platform, which accepts 200-mm wafers and can be upgraded to accommodate 300-mm technology. (Semicon West, San Francisco, South Hall, Booth 2140)

Spin Processor

SEZ America

Phoenix, AZ

The multichamber 4200 spin processor is designed for high-throughput, high-yield treatment of single wafers. Optional capabilities include process temperatures of 85°C, minienvironments, DI-ozone processing, SMIF load-ports, endpoint detection systems, buffering systems, and a choice of pin or pinless chucks. Used with special chemical formulas, these options permit the system to perform wafer operations applicable at both the front and back ends of the line. Process applications include polymer removal, diluted-HF etching, highly selective oxide removal, and nonselective oxide nitride removal. The processor demonstrates ±1% uniformity, high selectivity, particle contamination levels of <30 particles measuring >0.16 µm, and heavy metal/ion contaminant levels measured at 10¹⁰ atoms/cm². The system has a small footprint and is designed for quick installation, low consumption of chemicals and DI water, and low disposal costs. (Semicon West, San Francisco, North Hall, Booth 6161)

Wafer Stepper

Ultratech Stepper

San Jose, CA

The Model 1500MVS wafer stepper adds to the 1500 platform the alignment flexibility of a machine-vision system. As a pattern-recognition alignment technique, machine vision eliminates the need for large scribe lines to accommodate dedicated alignment targets. It can be taught to recognize virtually any distinctive feature as a target, thus possibly increasing yields. The stepper is designed for easy integration into fabs with a wide variety of equipment. (Semicon West, San Francisco, South Hall, Booth 238; San Jose, McEnery Hall, Booth 12023)

Failure Analysis Software

Knights Technology

Santa Clara, CA

LogicMap translates functional test data for logic devices into x-y coordinates for yield and failure analysis, providing fab engineers with critical information in hours. The system enables design engineers to distinguish design errors from process defects and to debug designs quickly. The program translates bin-sort functional test-fail data into defect traces, distinguishes defect-driven yield issues from device-integration issues, and establishes a clear link for large populations of failed die. FA engineers can test die on the wafer level rather than on packaged devices. Merlin's Framework software cross-maps the net list with the design layout once failure addresses have been established as x-y coordinates. After translation of data to a standard defect file format, YieldManager software can be used to analyze failures. (Semicon West, San Francisco, North Hall, Booth 5760; San Jose, McEnery Hall, Booth 11221)

Scanning Probe Microscope

ThermoMicroscopes

Sunnyvale, CA

Capacitance, thermal, and pulsed-force imaging modes have been added to the AutoProbe M5 scanning probe microscope, supplementing the original contact, noncontact, tunneling, magnetic, and lateral-force modes. The new capabilities are suited for detecting and measuring dopant levels, hot spots, and buried defects in semiconductors. Pulsed-force imaging measures mechanical properties such as adhesion and compliance, which are critical in device packaging as well as fabrication. Special features of the microscope include closed-loop scanner feedback, 16-in. sample capacity, and 8-in. motorized stage travel. Automated stage positioning and an on-axis optical microscope are also featured. (Semicon West, San Francisco, North Hall, Booth 5408)

Integration Tester

GW Associates

Sunnyvale, CA

The FIT300 factory integration tester is an automated script-driven test tool for the SEMI E84 carrier-handoff enhanced parallel link. The tool is used in 300-mm fabs for front-opening unified pod handoff between automated material-handling systems and process or metrology equipment. The test unit includes an electronics component that provides standard E84 signals and attaches to the parallel printer port of any PC running Windows or the manufacturer's SECSIM Pro software. It can test an E84 link or a SECS/GEM link independently or together, checking for proper interaction between the links. (Semicon West, San Francisco, South Hall, Booth 930; San Jose, McEnery Hall, Booth 12061)

Etching System

Tru-Si Technologies

Sunnyvale, CA

The Tru-Etch 3000 isotropic etching system eliminates backside wafer damage and provides a smooth, stress-free surface for bumped wafers. Based on proprietary atmospheric downstream plasma (ADP) etching and noncontact wafer-handling technologies, the system operates at ambient pressure and does not require frontside wafer protection. Highly repeatable, isotropic ADP removes a uniform layer of silicon from the wafer. It exhibits high etch rates for materials commonly present on the backside of processed wafers, including silicon, silicon oxide, silicon nitride, polysilicon, and BPSG. The downstream process avoids plasma-induced electrical and ion damage. The system removes postgrind stress and thins wafers to < 2 mil at high uniformity and high production volumes. (Semicon West, San Francisco, East Hall, Booth 7109; San Jose, The Tent, Booth 16116)

Post-CMP Cleaner

Silicon Valley Chemlabs

Sunnyvale, CA

CMC-475 cleaning solution can be used for post-CMP cleaning of slurry particles and planarization by-products from wafers that incorporate copper interconnect and low-k dielectric technologies. The buffered, slightly acidic solvent dissolves CMP slurry without corroding copper, aluminum, or tungsten thin films or Ti, TiN, Ta, or TaN barrier films. Additives in the cleaner create a negative zeta potential, facilitating repulsion of planarization by-products from the wafer. The solution also minimizes PVA brush loading from copper oxides and polishing slurry. The nontoxic, biodegradable, high-flash-point chemical can be used in all post-CMP wafer-cleaning equipment at process temperatures ranging from 20° to 75°C. (Semicon West, San Francisco, Esplanade, Booth 4226)

Excimer Laser

Cymer

San Diego, CA

An excimer-type production laser for geometries 0.18 µm, the ELS-6000 is designed to achieve high throughput. Performance features include an FWHM bandwidth of 0.6 pm, a 95% integrated energy integral of 2 pm, and energy dose stability of ±0.5% based on a 32-pulse window. The repetition rate is 2000 Hz. Its modular design positions it to accommodate future performance enhancements. (Semicon West, San Francisco, North Hall, Booth 5382)

Gas Purifier

NuPure

Manotick, Ontario, Canada

The UltraPure Eliminator is a room-temperature gas purifier capable of removing multiple contaminants to achieve sub-parts-per-billion levels of purity. THC can be reduced to 0.5 ppb. Available in dual- and triple-stage versions, the purifier can be regenerated for years of use and a low cost of ownership. (Semicon West, San Francisco, Esplanade, Booth 4225)

Elastomeric Seal

DuPont Dow Elastomers

Wilmington, DE

The Kalrez TriLobe perfluoroelastomer seal features high chemical, thermal, and plasma resistance. It is suited for semidynamic sealing applications that use a dovetail-groove configuration, such as slit-valve door seals and gate valves. A distinctive cross section and molded notch for simple snap-in eliminate rolling, twisting, and other installation problems that can cause premature seal wear or particle generation. A second notch on the bottom of the installed seal helps alleviate potential overcompression caused by thermal seal expansion at high temperatures. The seal resists pullout and movement during use. Parting lines are maintained below the flange surface to eliminate direct exposure to aggressive plasma or process chemicals. Available in a variety of compounds, the seal comes in several configurations. All seals for semiconductor applications are cleaned in an ultrapure process and double packaged. (Semicon West, San Francisco, North Hall, Booth 5686A)

Tube Cutter

E. H. Wachs

Wheeling, IL

The portable TQ 1.0 tube saw can be used to cut stainless-steel tubes with outside diameters of 1/8 to 1 in. With two-axis cutting capability, the tool enables weld sampling or coupon cutting of high-purity stainless tubing. The saw does not deform tube ends. Features include a clamping vise, a built-in vacuum port, rack-and-pinion feed, a motor with dial speed control, and a removable bench stand. The cutter comes with hand tools and saw blade in a custom-fitted storage case. The system is available in 110- and 220-V versions.

Pressure Transducer

Parker Hannifin, Veriflo Div.

Richmond, CA

A flow-through version of the Exact series ultra-high-purity pressure transducer is available in a wide variety of standard gas pressure ranges from 50 to 5000 psig. Outputs are 4—20 mA, 0—5 V dc, 0—10 V dc, and 1—5 V dc. With a solid-state sensor element, the transducer offers drop-in calibration for installation in most applications without further adjustment. Long-term stability of better than 0.25% and accuracy of 0.1% are standard. Parts are NEMA 4 rated for use in harsh environments. Hastelloy wetted surfaces have a smoothness of 5 Ra or better. The transducer is available with various face-seal or weld-in-tube stub process connections and cable- or bayonet-style electrical contacts. (Semicon West, San Francisco, South Hall, Booth 734)

Endpoint Detection

Advanced Energy Industries

Fort Collins, CO

Radio-frequency endpoint detection for CVD clean processes is provided by the RFEP-OEM-LC measurement system. RF measurement offers short cleaning cycles, minimal gas consumption and emission of greenhouse gases, long system life, and long run times between wet cleans. Free return-on-investment software analysis is available to prospective purchasers, to assist in the determination of needs. The system requires little downtime for installation. (Semicon West, San Francisco, South Hall, Booth 2202)

Plug-and-Socket Set

Nitto Kohki

Hanover Park, IL

The Hi Cupla Ace plug-and-socket set is suitable for use in water, air, and inert-gas applications. Made of engineering plastic, the coupler weighs between 27 and 35 g and features a proof pressure equal to 285 psi. A push of the plug into the socket is all that is necessary to achieve a secure connection, facilitating connection and disconnection in hard-to-reach places. A sleeve-locking mechanism prevents untimely disconnections. Both the Hi Cupla Ace and standard Hi Cupla sets offer bidirectional fluid flow from the plug or the socket.

Liquid Flow Sensors

McMillan

Georgetown, TX

Series 102 and 102T liquid flow sensors precisely measure flow rates from 5 L/min to as low as 13 ml/min and can be used with low-viscosity fluids. Rated for operation at pressures to 500 psig, the sensors feature an accuracy of ±3% full scale and repeatability of ±0.2%. Both models provide a linear 0—5-V-dc output signal. Turndown ratio is up to 50:1. The Series 102T sensor offers dual output signals consisting of the 0—5-V-dc linear and a buffered 7.5-V pulse output proportional to the flow rate. The pulse output signal can be connected to an optionally available rate meter/totalizer panel for totalizing applications. (Semicon West, San Francisco, Yerba Buena, Booth 8203)

Product Extra!

An advanced data management and analysis tool from Busch Semiconductor Vacuum Group helps users minimize pump repair costs and maximize equipment uptime. InstaTrack's bar coding feature logs inventory, process chemistry, average run times, and the location of every pump throughout the service cycle. The information can be used to schedule preventive maintenance, allowing users to reduce unscheduled downtime. Based on MS Access, the system converts data to Excel files. InstaTrack provides an historical record of daily activity for each pump. Information: 970/472-8646. (Semicon West, San Francisco, South Hall, Booth 2805)

Optra has added large-format grids to its family of NanoGrid encoders. The encoders accurately cover a range 380 x 380 mm. The range of motion makes them suitable for use with 300-mm wafer stages and other large x-y calibration or positioning systems. The encoders measure a pure absolute position directly under the point of action on the wafer. Repeatability is higher than an interferometer's, and resolution is in the subnanometer range, according to the manufacturer. Maximum error rate is ±1 µm for 300 mm of motion. Grids are available on soda-lime glass, and a kinematic mounting option lessens thermal and mechanical stresses. Information: 978/887-6600; fax, 978/887-0022. (Semicon West, San Jose, McEnery Hall, Booth 15116)

A disposable purifier from Millipore is designed to minimize defects associated with metal ion contamination. The Rinsegard HPX contains a hydrophilic ultrahigh-molecular-weight polyethylene membrane and a negatively charged surface to remove metal ions and particles >=0.05 µm. Available in both cartridge and disposable versions, the purifiers require no flushing or prewetting. Information: 800/645-5476. (Semicon West, San Francisco, South Hall, Booth 210)

SELA's new on-line users group supports the exploration of new uses for the company's microcleaving systems. The first topic for discussion was cross-sectioning of wafer samples containing copper layers. The new group complements SELA's on-line newsletter as a customer service vehicle for the company's installed base of MC series systems. Information: 408/988-5151; fax, 408/988-3322. (Semicon West, San Francisco, North Hall, Booth 5774)

General Chemical's electronic chemicals group is offering UHP acetic acid as part of its Class 1 semiconductor chemical product line. The new grade of acetic acid meets sub-parts-per-billion specifications. The acid is made in lined distillation tanks and packaged in a cleanroom. Statistical process control helps reduce contamination levels and variability between lots. The acetic acid is part of the business unit's MAE mixed acid etchant and PAE aluminum etchant products. Information: 800/247-4519. (Semicon West, San Francisco, North Hall, Booth 6068)

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