TECHNICAL/BUSINESS PROGRAMS

The following technical and business programs will be offered during the week of Semicon Southwest 98. All scheduled events take place at the Austin Convention Center unless otherwise noted. The IEMT sessions are listed first, followed by other technical and business programs of interest. For a complete listing, log onto SEMI's Web site, http://www.semi.org.

International Electronics Manufacturing Technology (IEMT) Symposium

MONDAY, OCTOBER 19

8:30 a.m.—noon

Flip Chip, BGA, and Packaging I
Chairs: Deborah Patterson, Flip Chip; and George Riley, Hycomp

Performance of Evaporated and Plated Bumps on Organic and Ceramic Substrates

Addi Mistry, Jim Kleffner, John Czarnowski, Tim Scanlon, Jerry Lozano, James Guajardo, Dave Wontor, Ken Rhyner, and Kevin Scott, Motorola

Integration of Flip Chip Assembly in the SMY Process: Manufacturing and Productivity Issues

Joachim Kloeser, Katrin Heinricht, and Liane Lauter, Technical University of Berlin; Lutz Richter, Rolf Aschenbrenner, and Herbert Reichl, Fraunhofer Institute FhG/IZM-Berlin

Flip-Chip Manufacturing Using Wafer-Applied Multilayer Encapsulants

M. Albert Capote, Sherry Zhu, and Ligui Zhou, Aguila Technologies; and R. Wayne Johnson, Auburn University

Flux-Free Process for Placement and Attach of Solder Balls to Wafers, Flip Chips, and All BGA Packages

Richard Ramos, Scientific Sealing Technology

Zincation Characterization for Electroless Ni/Au UBM of Low Cost Bumping Technology

Qing Tan, Leo Higgins, Craig Beddingfield, and Addi Mistry, Motorola

Squeegee Bump Technology

Jong-Kai Lin, Treliant Fang, and Rajiv Bajaj, Motorola

Manufacturing Process and Product Improvement
Chairs: Paul Conway, Loughborough University; and Qing Tan, Motorola

Cycle Time Estimation for Printed Circuit Board Assemblies

Katherine Haberle and Robert Graves, Rensselaer Polytechnic Institute

Implementation of a "Perfect Launch" Process in a Semiconductor Fab to Improve the Effectiveness of Automotive New Product Ramps

Gary L. Hempleman, Harris Semiconductor

Analysis of Factors Affecting Component Placement Accuracy in SMT Electronics Assembly

Edward Kamen, Dan Creveling, Alex Goldstein, and Erin Sahinci, Georgia Institute of Technology

Investigation of the Correlation of Peel Strength and Pad Adhesion Measurements Using Different Printed Circuit Board Base Materials

Steffen Mueller and Sylvia Ehrler, Hewlett-Packard GmbH, PRCO

Accompanying Quality Assurance for High Level Processing of Advanced Packages

Klaus Feldmann and Robert Feuerstein, University Erlangen

Analysis and Application of Vibration Behavior for Wire-Bonding Capillary by Transmission Laser Vibrometer

Yoshinari Tamura, Yuichi Miyahara, and Hiromi Suzuki, Toshiba

Noon—1:00 p.m.

Luncheon Address
Speaker: David J. Williams, professor of manufacturing engineering, Loughborough University

1:30—5:30 p.m.

Reliability and Test
Chairs: Achyuta Achari, Ford/Visteon; and Scott Popelar, IC Interconnect

Real-Time Popcorn Measurement of a Plastic Ball Grid Array Package during Solder Reflow

John Lau, Ray Chen, and Chris

Chang, Express Packaging Systems

Effect of Solder Reflow Temperature Profile on Plastic Package Delamination

Yizhe "Elisa" Huang, Debbie Hagen, Glenn Dody, and Terry Burnette, Motorola

Designed Experiment to Assess Flip-Chip-On-Board (FCOB) Reliability

S. Yegnasubramanian, R. Deshmukh, R. Fanucci, J. Gannon, and J.R. Morris, Lucent Technologies

Manufacturing Test and Measurement Technology for Wideband Interconnects Using Transient Thermal Pulses

Anthony Wong, John Biskup, and Robert Flake, University of Texas at Austin

Nondestructive Detection of Defects in Multilayer Ceramic Capacitors Using an Improved Digital Speckle Correlation Method with Wavelet Packet Noise Reduction Processing

K.C. Hung and Y.C. Chan, City University of Hong Kong

The Implementation of an In-Scribe Product Test Strategy to Optimize Manufacturing Constraints and Improve Yield (metric) Performance

George H. McAfee, Steven Brim, and Greg Matthews, Harris Semiconductor

Test Head Scheduling in a Semiconductor Test Facility

Sudhanshu Badahur, Motorola; Sundarakrishna Mohanraj, and Devanath Tirupati, University of Texas at Austin

Semiconductor Processing I
Chairs: Gerold Neudeck, Purdue University; and Malcolm Grief, SpeedFam

The Reliability Improvement on Self-Aligned Contact CMOS by Optimizing Poly Etching

C. D.Chang, C. Y. Chu, and D. E. Lin, TSMC

Atmospheric Downstream Plasma Etching of Si Wafers

Oleg Siniaguine, Tru-Si Technologies

In-Situ Nitride Mask Open

Scott Williams, Xikun Wang, Pu Ye, Nallan Padmapani, and Shaoher Pan, Applied Materials

In Situ Shallow Trench Isolation Etch with Clean Chemistry

Xikun Wang, Scott Williams, Nallan Padmapani, and Shaoher Pan, Applied Materials

Stabilization of Alumina Slurries in Presence of Oxidizers for Tungsten Chemical Mechanical Polishing

B.J. Palla, D.O. Shah, M. Bielmann, and R.K. Singh, University of Florida

Evaluation of Manufacturing Handling Properties of Hydrogen Peroxide—Based Tungsten CMP Slurry

John P. Bare and Budge Johl, FSI International

Emerging Technologies in Electronics Manufacturing
Chairs: Hassan Hashemi, Rockwell; and Kazumi Allen, Shindo

Solderability Testing in Nitrogen Atmosphere of Plasma Treated HASL Finish PCBs for Fluxless Soldering

G. Takyi, J. D. Philpott, N. N. Ekere, G. K. Snowden, and C. C. Tanner, University of Salford

New Epoxy Molding Compound for SMT Packaging with PPF Lead Frame

Akira Yoshizumi, Kazuhiro Sawai, Ken Uchida, Hirokazu Ibuki, Mototake Andoh, and Isao Yamamoto, Toshiba Chemical

Surface Contamination of Bonding Pads Incapable of Au Wire Bonding

M. Watanabe, Advantest Analysis Laboratory

The Research University as a Place to Develop Manufacturable Niche Photonic Products

Jerry M. Woodall, Purdue University

Low-Cost Manufacturing Strategy for Miniature Packaging

L. Nguyen, S. Lee, and H. Takiar, National Semiconductor

Packaging Requirements and Solutions for CMOS Imaging Sensors

R. Sundahl, K. Sengupta, S. Kawashima, R. Arellano, C. Sklenicka, and D. Thompson, Intel

Development of High-K Composites for Embedded Capacitors

Satoshi Ogitani, Sue Ann Bidstrup Allen, and Paul Kohl, Georgia Institute of Technology

TUESDAY, OCTOBER 20

8:30 a.m.—noon

Flip Chip, BGA, and Packaging II
Chairs: Lahki Goenka, Ford/Visteon; and E. Jan Vardaman, TechSearch International

Evaluation of Process Parameters for Flip Chip Stencil Printing

T. A. Nguty and N. N. Ekere, University of Salford

Cost Analysis: Solder Bumped Flip Chip on Board Versus Wire Bonding Chip on Board

John H. Lau, Express Packaging Systems

A Parametric Study of the Design Constraints and Manufacturing Tolerances for Controlled Impedance TBGA Designs

P. M. Harvey, 3M

A Novel MCM Package for RF Applications

Y. Degani, T. D. Dudderar, J. Jacala, D. P. Kossives, J. Gregus, M.Y. Lau, R. C. Frye, Y. Low, and K. L. Tai, Lucent Technologies

Failure Modes and Effects Analysis (FMEA) of Flip Chip Devices Attached to Printed Wiring Boards (PWB)

Melinda Kennedy, Medtronic

Reliability Performance Assessment and Characterization of Fine Pitch Mold Array BGAs

Trent Thompson, Motorola SPS

Environmentally Conscious Manufacturing
Chairs: Laura Mendicino and Paul Thomas Brown, Motorola

Development, Implementation and Verification of a Design for Environment (DFE) Methodology on a Notebook Computer Case

Craig White, Kevin Lo, and Jeff Janert, University of Texas at Austin

Remote Microwave Technology for Chamber Clean to Reduce PFC Emissions

Laura Mendicino, Paul Thomas Brown, and Stan Filipiak, Motorola; Alan Atherton, Applied Materials; John Langan, Rick Pierce, and Andrew Johnson, Air Products & Chemicals

A Strategy for Reducing PFC Emissions

Laurie Beu and Paul Thomas Brown, Motorola

Waste Treatment Options for Advanced Semiconductor Operations

Paul Thomas Brown and Brian Raley, Motorola

Implications of EPA's Risk Management Program to Semiconductor Manufacturers

Brett Jay Davis, Motorola

A Comparison of Chilled Ozone and CO^₂-Based Supercritical Fluids as Replacements for Photoresist-Stripping Solvents

J. B. Rubin, L.B. Davenhall, J. Barton, and C.M.V. Taylor, Los Alamos National Laboratory; and K. Tiefert, Hewlett-Packard

1:30 —5:00 p.m.

Electronic Systems Reliability Panel
Chairs: Bob Munroe, Motorola; and Claude Hilbert, MCC

Board Level Reliability for a Laminate CSP

Akito Yoshida, Toshiba; and Curtis Hart, XeTel

Reliability Performance and Failure Mode of High I/O Thermally Enhanced Ball Grid Array Packages

R. J. Coyle, T. I. Ejim, and A. Holliday, Lucent Technologies Bell Laboratories

Semiconductor Processing II
Chairs: Dave Kayton, Harris Semiconductor; and Walt Trybula, Sematech

Effects of Epitaxial Silicon Technology on the Manufacturing Performance of Wafer Fabrication Lines

John Hughes, Gerold Neudeck, and Reha Uzsoy, Purdue University

Integration of Non Photo Sensitive Polyimide into an Existing Photoresist Process

Alvin S. Rhorer and Larry Larson, Medtronic/Micro-Rel

Statistical Process Control in a Wafer Fabrication Environment

Dayna Aston, Medtronic; and Doug Scott, Promis Systems

Using the Theory of Constraints' Production Application in a Semiconductor Fab with a Reentrant Bottleneck

Dave Kayton, Harris Semiconductor

Methodology for Optimization of Zone Control for Multiple-Lamp Wafer-Heating Systems

A. Janos and A. Cardoso, Eaton

Analysis of Copper Plating Baths

Beverly Newton, Dionex

WEDNESDAY, OCTOBER 21

8:00 a.m.—noon

Interconnect
Chairs: Tom Goodman, TechSearch International; and Marnie Knadler, Abpac

Lab Sessions and Prototyping in Interconnection and Packaging Education

Zs. Illyefalvi-Vitez, M. Ruszinku, J. Pinkola, and G. Harsnyi, Technical University of Budapest

The Viscoelastic Characteristics of Solder Paste Under High Frequency Oscillatory Shear

A. Adebayo and N. N. Ekere, University of Salford

Evaluation of Conductive Adhesives for Industrial SMT Assemblies

M. G. Perichaud, J. Y. Deletage, H. Fremont, and Y. Danto, IXL; and C. Faure and M. Salagoity, Solectron

A Method of Heatsink Fabrication for Millimeter Wave High-Power Gunn Devices

D. Choudhury, J. Foschaar, and D. B. Rensch, Hughes Research Laboratories

Thermosonic Bonding of High-Power Semiconductor Devices for Integration with Planar Microstrip Circuitry

P. H. Lawyer, D. Choudhury, M. D. Wetzel, and D. B. Rensch, Hughes Research Laboratories

70-Micron Fine-Pitch Wire Bonding

L. Nguyen, I. Singh, C. Murray, and J. Jackson, National Semiconductor

Modeling
Chairs: Ken Keys, Cleveland State University; and John Konopka, IBM

Modeling via Formation in Photosensitive MCM Dielectric Materials Using Sequential Neural Networks

G. May and T. Kim, Georgia Institute of Technology

Reducing Costs and Increasing Throughput Using Model-Based Process Control on Sputtering Systems

Linda Sattler, University College Cork; Philip Hecker, Rangesh Raghavan, and He Lin, Texas Instruments

Fatigue Reliability of Solder Interconnects for First- and Second-Level Packaging

Giulio Di Giacomo and Li Li, IBM Microelectronics

As Outdiffusion from Arsenosilicate Glass (ASG) Structures

Cheruvu S. Murthy and Laertis Economikos, IBM Microelectronics

New Generation Thin Plastic Packages Deliver Higher Levels of Power and Reliability Performance

Mohammed Kasem, Siliconix

Neural Network—Based Real-Time Thermal Design Expert

S. Vikram, L. Nguyen, N. Jeeves, and H. Takiar, National Semiconductor

Performance-Enhanced Design Using C2BGA Substrate

Paul Wu and Kevin Chen, ProLinx; and Manoj Nachnani, Enabling Solutions

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Other Programs of Interest

SUNDAY, OCTOBER 18

8:00 a.m.—5:00 p.m.

Fab Automation
Instructors: Gerald T. Mackulak, Arizona State University; and Theron Colvin, PRI Automation

MONDAY, OCTOBER 19

9:00 a.m.—4:30 p.m.

A Partnership for PFC Emissions Reductions (cosponsored by SEMI, SIA, SSA, and Sematech)
Program Chairs: Laurie Beu, Motorola; and Mike Mocella, DuPont

International Cooperative Efforts Towards PFC Emissions Reduction

Chuck Fraust, Lucent Technologies

An Analysis of International and U.S. PFC Emissions Estimating Methods

Laurie Beu and Paul Thomas Brown, Motorola

Results From Texas Instruments' Evaluation of Praxair's PFC Recycling System

Tina Gilliland, Texas Instruments; and Cynthia Hoover, Praxair

Evaluation of Various NF^₃ Clean Solutions for Applied Materials Dielectric CVD Equipment

Laura Mendicino, Jeff Chan, and Mary Tiemessen, Motorola; and Alan Atherton, Applied Materials

Assessment of Alternative Oxide Etching Gases for Semiconductor Processing: Process and EHS Issues

Robert Duffin, Sematech; Michael Mocella, DuPont; and Tony Kaushal, Applied Materials

Evaluation of a Surface Wave Plasma Device for Abatement of Perfluorocompounds in an Etch Application at Motorola

Victor Vartanian, Motorola; and Bill Wofford, RF Environmental Systems

Novellus Progress in Reduced Emission Chamber Clean Processes

Ken Aitchison, Novellus

PFC Emissions Reduction Partnership Update

Sally Rand, U.S. EPA

Industry Overview

SEMI and SIA

Results of Dilute NF^₃ Process Development Efforts on Applied Materials CVD Platforms

Brian Lent, Intel

Semiconductor Industry Short- and Long-Term PFC Emissions Reduction Targets

Shaunna Sowell, Texas Instruments

9:00 a.m.—5:00 p.m.

Software Inspections
Instructors: Dwayne L. Knirk and Patricia A. Trellue, Sandia National Laboratories

1:00—5:30 p.m.

The Second SEMI All-Industry Forum: Setting New Goals for Global Cooperation

This special event brings together leaders of the global semiconductor manufacturing industry to identify the most critical challenges facing the industry and to explore opportunities for global cooperative programs to address the challenges. The participants will address current issues, explore recommendations for cooperative programs to deal with them, and formulate specific objectives for new initiatives.

TUESDAY, OCTOBER 20

8:00—9:30 a.m.

SEMI Enabling Products and Services Section (EPSS) Meeting , Four Seasons Hotel

8:30—9:30 a.m.

Equipment and Materials Market Briefing
(Presentation includes microelectronics market outlook, wafer processing equipment—deposition, etch, lithography, ion implantation; assembly and packaging equipment; test equipment; regional trends; etc.)

9:00 a.m.—5:00 p.m.

Software Testing
Instructors: Dwayne L. Knirk and Patricia A. Trellue, Sandia National Laboratories

Overall Equipment Effectiveness: Improving Equipment Productivity
Sheraton Austin Hotel
Instructors: John Fowler, Arizona State University; and Jose Padillo, Tefen USA

1:00—5:00 p.m.

The Global 300-mm Transition: Status, Update, and Key Issues
(Trying to make sense of the confusing 300-mm mess, from materials to tools to fabs and more.)

2:00—3:30 p.m.

SEMI Chemical and Gas Manufacturers Group (CGMG)
Four Seasons Hotel

WEDNESDAY, OCTOBER 21

8:00 a.m.—noon

STEP: SEMI CIM Framework—MES Standards for the Semiconductor Industry
Chair: Robert Hodges, International Sematech

8:00 a.m.—5:00 p.m.

Surface Cleaning (with emphasis on post-CMP cleaning)
Instructor: Ahmed A. Busnaina, Clarkson University

9:00 a.m.—5:00 p.m.

Understanding and Using Cost of Ownership
Sheraton Austin Hotel
Instructors: Wright Williams & Kelly

1:00—5:00 p.m.

Workshop on the Year 2000: Legal and Practical Perspectives
Chair: Karen K. Williams, Gray Cary Ware & Freidenrich

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Exhibit Hall Hours

Tuesday, Oct. 20
10 a.m.—6 p.m.

Wednesday, Oct. 21
10 a.m.—5 p.m.

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