INDUSTRY NEWS

Novellus debuts integrated copper system, signs strategic alliances with Lam, IPEC

SAN FRANCISCO—In a move aimed directly at archcompetitor Applied Materials, Novellus Systems introduced its Damascus copper damascene production system at a press conference here in early June. The announcement followed news of a multicompany strategic alliance for copper processing, which links Novellus with CMP toolmaker IPEC and etch equipment manufacturer Lam Research and its cleaning tool division, OnTrak Systems.

The linchpin of the integrated system is Novellus's latest deposition tool, named Sabre, which provides void-free copper electrofill of interconnects in very-narrow-geometry, high-aspect-ratio structures. Performance specifications touted by the company include 5:1 aspect ratios; film uniformity of 3 sigma, <5% within a wafer; large reductions in backside wafer contamination; and throughputs of at least 50 wafers per hour. A key enabling technology in the Sabre package is a proprietary bath chemistry and automatic chemistry control, which allows copper fills in deep, narrow trenches without any gaps or voids.

The linchpin of the Novellus copper system is the Sabre electrofill deposition tool.

The full Damascus equipment set combines Sabre with the company's recently launched Inova PVD tool and its existing Speed and Sequel CVD lines as well as with Lam's 4520XLE dual-damascene etch system, IPEC's Avant Gaard copper polisher, and OnTrak's Synergy Performa post-CMP cleaning tool. Heralding the tool set as "a fully integrated process solution," the alliance partners have said they will work together to develop complementary methods and technologies for advanced copper damascene interconnect structures, with the collective goal of reducing their customers' costs and development times. The entire module will be shown at the Novellus "Metalmorphosis" exhibit in the Yerba Buena Center, across the street from the Moscone Center, during Semicon West.

"Copper is inevitable. The main question regarding copper is not whether it will be used, but when," said Peter Hanley, Novellus's executive vice president of worldwide operations. In a video aired during the press conference, semiconductor industry experts from Sematech, Intel, AMD, IBM, Texas Instruments, Motorola, VLSI Research, and Novellus talked about how the use of copper interconnects will, in the words of one of the speakers, "expand Moore's Law." Smaller, faster, higher-density chips that consume 30% less power and cost 20—30% less to manufacture than aluminum-based devices will result from the adoption of copper-based technologies, according to Hanley.

Hanley said Novellus has already shipped several Sabres to customers in the United States, with volume shipments expected to begin in the fourth quarter of this year. The company's Wilsonville, OR, facility is the development site for the Damascus venture. "There are 50 dedicated employees working on the project," he continued, with another 25 or so expected to be added to the team in the next few months.

In an exclusive interview following the news conference, Hanley told MICRO that the IPEC polisher is the only alliance tool in place at the Wilsonville plant other than Novellus's own equipment set. He said his company is open to expanding the coalition, pointing out the presence of an executive from KLA-Tencor at the press conference. He credited the "mutual trust and respect" between CEOs Bill Bagley of Lam and Rick Hill of Novellus as critical to the success of the cooperative agreement between the two companies. "You can't partner with someone who covets your business."

When questioned whether he believes chipmakers will initially segregate copper process modules from the rest of their fabs, as was the case when CMP was introduced to production areas, Hanley opined they would have to be isolated. "You don't want copper to touch any other wafers," because of the potential for new or unforeseen types of defects and contamination. "You have to treat those wafers like they're covered with radioactivity."

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