Product Extra!

The Titan Head polishing head designed for Applied Materials' Mirra CMP system evenly planarizes all areas of the substrate by distributing pressure uniformly across the front of the wafer. The head conforms to the wafer's back side. Featuring four independent polishing heads and three platens, the Mirra can process 2000 wafers per head before maintenance is required. The system's in situ rate monitor stops the polishing process when the desired amount of material is removed, thus avoiding wafer scraping caused by overpolishing. Information: 408/563-0647.

Venmark's English/metric converter slide rule quickly converts fractional inches to decimal inches to millimeters without the need for manual calculations. The slide rule's windows line up particular units and their corresponding values by sliding a scale. The instrument also converts length, area, mass, and volume. The converter measures 81/2 * 3 * 1/8 in. An accompanying chart lists 29 miscellaneous conversions such as square miles to acres and imperial and U.S. gallons to liters. Information: 617/237-5860.

YieldUp International has received a U.S. patent for the wafer support and gas delivery techniques used in its Surface Tension Gradient cleaning and drying technology. The technology prevents wafers from touching each other, and it delivers nonsaturated polar organic vapor and carrier gas to the wafer. The gas is used to displace ultraclean DI water in the vendor's Omega wafer-cleaning systems. Three additional U.S. patents have also been awarded to the vendor for its rinsing and drying technology. The Omega system uses minute amounts of IPA in a nitrogen carrier gas that is introduced to wafers submerged in DI water. The tool emits fewer VOCs than standard IPA dryers, YieldUp says. Information: 415/964-0100.

The Total Chemical Management capital lease program from Ashland Chemical's electronic chemicals division is designed to help chipmakers finance the chemical-distribution system best suited for their productivity requirements. The new program offers flexible financing to meet specific business needs, the company says. Information: 614/790-4652.

Laser Light Technologies is offering its excimer-based patterning system for contract services. The system performs patterning for MEMS devices, flex circuits, thin metal films, and ball grid arrays. The company uses 20 Nd:YAG, CO₂, and green lasers for etching, engraving, and micromachining applications. Information: 573/486-5500.

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