Product Technology News

Thin-Film Metrology System

Nanometrics

Sunnyvale, CA

The NanoSpec 5500L thin-film metrology system was specifically developed to monitor key production steps in the manufacturing of FPDs up to 650 × 550 mm. The system precisely measures film thickness at any site on a substrate in a 20-µm spot and generates a map of film thickness. Operating parameters and substrate-measurement locations can be preprogrammed. The results are displayed on the touch-screen monitor or transferred to a host computer in the fab. The system's fully integrated robot can interface with automatic guided vehicles to transport batches of substrates from one processing inspection step to another with minimal operator involvement.

Cleanroom Window Film

Madico

Woburn, MA

An amber film for cleanroom windows prevents transmission of up to 99% of harmful blue and UV light under 500 nm. The pressure-sensitive film, available in rolls of various widths, can be professionally installed to fit any size cleanroom window. The film does not significantly reduce brightness levels and does not interfere with necessary interior lighting. The film is recommended for use in photolithography cleanrooms, where unwanted light can affect pattern accuracy. It also protects portable cleanrooms located near a hallway, passage door, or outer building windows.

Cassette-Transport System

Shuttleworth

Huntington, IN

The Clean Passage transport system for FPD and semiconductor fabs enables manufacturers to route work-in-process from any point to another. The system is constructed from Slip-Trak conveyors in a minienvironment suspended above the ceilings of both clean and dirty areas. Clean vertical conveyors deliver cassettes and pods to and from either cleanroom bays or tool clusters within the bays. The conveyors can be in chases or hallways with airlock ports opening into each bay, or they can be completely within the bays. Each conveyor has airlocks at the overhead transport conveyor level and at the operator or tool-cluster working level in the bay. Local random-access buffering of cassettes and pods directly on the conveyor surface minimizes the number of discrete stockers required in the fab and eliminates the throughput and reliability problems associated with discrete vehicle transport. The Class 1–compatible minienvironment is equipped with its own filters and connects directly to an HVAC system.

Intermetal Dielectric Processing

Fairchild Technologies USA

Fremont, CA

The Falcon system for sub-0.35-µm processing employs a specialized coating technique for intermetal dielectric applications. An alternative to spin-on-glass technologies, the coating process is based on a closed-bowl technique that can enhance processing results for low-K dielectric applications, including high-speed logic and memory devices. The technique is characterized by a low rate of solvent evaporation. Ambient airflow is controlled to minimize turbulence, eliminate particle generation, and decrease sensitivity to variations in temperature and humidity. The technology improves gap fill and planarization while maintaining uniformity across the wafer substrate, and it also serves to reduce wafer defects and increase throughput.

Face Protector

Space Face Shield

Caldwell, TX

An alternative to standard curved face shields, a wraparound shield covers the forehead, eyes, nose, mouth, chin, and ears for maximum protection against splashes, flying particles, and impact hazards. The one-size-fits-all design combines optically clear fog-free goggles and a face cover in one unit. The shield meets various OSHA and ANSI regulations. Made of a soft vinyl frame with an adjustable headband, the shield is Class 1 compatible and can be worn with eyeglasses and hard hats.

Deep-UV Photoresists

Hoechst AZ Photoresist Products

Somerville, NJ

Two positive-tone, chemically amplified photoresists are recommended for use in aggressive 0.25-µm deep-UV lithography processes. AZ DX-1300P is designed for high-resolution line and space patterns. The product has a sensitivity of 20 mJ/cm² or lower and exhibits low isolated-to-dense bias. Linear resolution is 0.2 µm on a 0.55 NA stepper, and depth of focus is >1.05 µm for 0.25-µm lines and spaces. The product also has a high thermal stability. AZ DX-1200P is designed for contact-hole patterns. Sensitivity is rated at 40 mJ/cm² or lower, and depth of focus is >1.25 µm for 0.25-µm contact holes on silicon. Both resists offer thick-film performance to 3.0 µm.

Texture Measurement Systems

Veeco Instruments

Plainview, NY

The Dektak TMS-2000W and TMS-3000W systems provide noncontact analysis of wafer surface roughness, measuring up to 50 test points per second at a resolution of 0.01 Å. The TMS-2000W is designed for automated measurements on 150- and 200-mm wafers, while the TMS-3000W can handle 300-mm wafers. Both units determine microroughness in preselected areas or over the entire wafer surface. Measurements are rendered in rms or Ra with a repeatability of ±0.2 Å. The laser-based tools can be used in cleanrooms without vibration isolation.

Mass-Flow Controller

MKS Instruments

Andover, MA

The Type 1153 mass-flow controller maintains precise delivery of vapors from complex solids and liquids with vapor pressure as low as 2.5 torr at temperatures <=200°C. The unit controls vapor flow via a pressure-based technique involving two Baratron pressure transducers, a choke-style flow nozzle, and a high-temperature solenoid valve. An onboard cpu regulates flow from the choked to the nonchoked flow regions, providing a wide usable control range. Full-scale flows up to 10 std L/min are possible, depending on the process. Both flow and temperature are controlled through 0–5-V analog signals or RS-232 communications. The MFC can be used by semiconductor and FPD manufacturers to deliver liquid and solid precursors with low vapor pressure to a CVD chamber for depositing barrier, high-K, and low-K dielectric films.

Sputtering Target

Tosoh SMD

Grove City, OH

Designed for use with the Coherent TTN cathode from Applied Materials, the Prelude target assembly offers high power and high throughput for Ti or TiN sputtering processes involving trenches and vias of high aspect ratio. The assembly is manufactured using a diffusion bonding process for joining the aluminum backing plate to the titanium target. The final assembly can operate at high power without the risk of debonding. High thermal conductivity permits cool operation with low deflection at all power levels. Automated bead blasting and roughness control on critical target surfaces help to reduce flaking. Proprietary nondestructive testing methods ensure consistent, fine grains. The Prelude has a target life of 250 usable microns of titanium on wafers using a 1:1 collimator, or 800 kWh.

300-mm Cassette Elevator

Brooks Automation

Chelmsford, MA

The VCE 5 loads and unloads 300-mm wafers into vacuum process tools. The modular unit can be configured to operate with both cluster and stand- alone tools. Fully integrated interfaces contribute to a fast throughput, small footprint, high reliability, low particle count, and reduced cost of ownership. The elevator enables manufacturers to standardize the tool end of the transport-to-tool interface, obviating a frequent source of delay in bringing toolson-line. Units can be specified with manual or automatically actuated doors, 13- or 25-wafer capacity, and stationary cassette platforms for open-cassette production environments. Versions are also available with a cassette-transfer arm and single-cassette load station for automated exchange; a minienvironment and bottom-opening carrier interface; and a wafer-batch transfer arm, minienvironment, and front-opening cassetteless carrier interface.

In Situ Metrology

Low Entropy Systems

Boston, MA

The 1000-IS metrology system for monitoring wafer state comprises a CCD camera, specialized optics, and a PC running proprietary software for camera control and data analysis. Working in real-time, the system records video images of the wafer during processing and uses the images to calculate etching or deposition rate, uniformity, end point, and selectivity. It is suitable for all plasma processes.

Sterile Cabinet

Hemco

Independence, MO

Specifically designed for particulate-sensitive processes, a sterile cabinet presents a chemical-resistant work surface bathed by a horizontal flow of Class 100 air. The HEPA filter forms an integral part of the plenum and is dynamically balanced with noise and vibration arrestors. The design prevents leakage, provides smooth operation, and preserves the integrity of the clean airflow. Clear acrylic side panels permit unobstructed viewing. Filter efficiency is rated at 99.99% at 0.03 µm. The cabinet is shipped completely assembled. Optional accessories include UV lighting, pressure gauges, and electrical receptacles.

POU Scrubber

Misonix

Farmingdale, NY

The XGC system uses three abatement stages to thoroughly scrub highly toxic and pyrophoric gases from process effluent gas streams. The three stages are a spray chamber, an Eductor venturi stage, and the Waterweb mesh. The mesh system comprises thousands of microventuri passages for maximum scrubbing efficiency. The system's blowerless construction is designed to safely handle hydrogen carrier gas, and an inlet humidity arrestor prevents backstreaming of gas and humidity to inlet piping. The low-energy system can be used in CVD, PECVD, RIE, and plasma-etch applications.

Mass-Flow Controller

Unit Instruments

Yorba Linda, CA

The Model 1661 metal-sealed high-purity mass-flow controller achieves an accuracy of ±1% of set point >30% full scale at ±3 sigma. The MFC features digital electronics and a GUI that allow users to perform diagnostics and real-time data tracking from a personal computer or a laptop. Flow can be adjusted from the software program while the controller is in the process tool. The instrument has a projected Weibull characteristic life of >350,000 hours MTBF and accommodates flow rates from 3 std cm³/min to 30 std L/min. A miniature transverse sensor that can be vertically mounted produces almost no thermal siphoning effects. Equipped with multiple gas-calibration tables, the unit can be used with gases across several ranges.

Automated CD-SEM

Opal

Santa Clara, CA

The Model 7830i CD-SEM system provides automated measurement of critical dimensions for precise submicron linewidths. By eliminating operator errors, the system permits stable metrology and tight fab control. High linearity is achieved through two separate E-beam scanners optimized for imaging and measurement. The instrument's ChromaCorrected final lens achieves a high resolution of 5 nm at 600 V using complementary magnetic and electrostatic lenses to eliminate chromatic aberration. An efficient spatial detector in the lens can measure the bottoms of contact holes of high aspect ratio. The high voltage within the column strongly attracts low-energy secondary electrons from the bottoms of deep structures. A patented multidetector gathers spatial 3-D information to attain pattern recognition with a 99% success rate. Throughput of 25 wafers/hr increases fab productivity and reduces overall cost of ownership.

Substrate Washer

Interlab

Danbury, CT

The Sonicscan 9-5 can be used for both debonding and cleaning prior to vacuum coating. The system combines hot ultrasonically agitated organic-solvent washing with secondary ultrasonic cleaning and high-purity rinsing and drying. The washer is compatible with various nonflammable organic solvents. The cleaning process can be used independently or in sequence with the pitch removal. Both ultrasonic wash stages involve filtered recirculation and vertical work oscillation. The rinse design allows complete closed-loop operation. Designed to reduce cycle time, two-stage drying begins as a hot-DI capillary drying process in the final rinse and ends in the HEPA-filtered laminar-flow chamber.

Flowmeters

Universal Flow Monitors

Hazel Park, MI

A line of variable-area flowmeters in vane and piston styles accurately measure liquid flow rates from 5 gal/hr to 1500 gal/min. Operating on the variable-orifice principle, the meters permit direct linkage between the sensor and the pointer, allowing switch actuation without magnets. A vortex-shedding flowmeter for ultrapure liquids has no moving parts. Constructed entirely of plastics such as PVDF, the instrument comes in threaded, flanged, and flange-mounted wafer end models. Line sizes ranging up to 8 in. can accommodate flow rates up to 2500 gal/min.

Trace Oxygen Analyzer

Advanced Instruments

San Dimas, CA

A continuous on-line analyzer for monitoring trace levels of oxygen offers a sensitivity of 5 ppb across a range of 0–1 ppm full scale. An LED display provides a resolution of 1 ppb. The device can recover from air to low-parts-per-million levels in minutes. A precision metal sensor housing and enhanced temperature-compensation circuitry impart an accuracy and repeatability of ±0.5% full scale. A galvanic sensor maintains high performance in inert gases, gaseous hydrocarbons, acid gases, and mixed gases; service life is 24 months. Response is linear over all six ranges, and an electronic zero offset function ensures accuracy for analyses near 0 ppm. Integral flow control and bypass and isolation valves help to minimize downtime. Additional features include two alarms with nonlatching relays and a universal 100–240-V-ac power module.

Portable Flowmeter

EIT

Exton, PA

Incorporating intelligent Doppler signal recognition technology, the Model 2450 portable flowmeter can analyze closed-pipe conditions, discriminate between flow and nonflow patterns, and detect very small particles within a stream. The flowmeter can be used to monitor clean flows, pipes with surges or other anomalies, diaphragm pumps, and piston pumps. A handheld programmer presents a graphic spectral profile of system conditions, enabling optimal location of the sensor. Clamp-on transducers and a menu-driven program simplify setup and operation. A gel-cell battery and three operating modes enable automatic data collection for up to 18 days.

High-Resolution Profiler

Tencor Instruments

Mountain View, CA

The automated HRP-200 high-resolution profiler monitors the planarization of wafers that have device geometries >=0.25 µm. The in-line me- trology system was specially designed to monitor the metal CMP process. Fine-resolution capabilities optimize CMP processes by measuring tungsten-plug recesses, pattern-induced erosion, dishing of metal features, and scratching of interlayer dielectric films. The HRP-200 uses both sensor and sample imaging stages, which extend its imaging capability from 50 mm to 0.25 µm. A lateral-scanning resolution of 1 nm enables the system to capture a high level of surface detail between scans. The system's UltraLight sensor scans wafers with a constant force as low as 0.05 mg to prevent damage to the wafer surface, making the unit suitable for use on the production floor.

Plasma-Etch System

Beta Squared

Allen, TX

The Beta 150 plasma-etch system offers a variety of processing capabilities. The main chamber of the single-wafer, cassette-to-cassette system can be configured for plasma or RIE etch processing and accommodates wafers from 100 to 200 mm. The chamber contains a minimum of parts, all made of materials chosen to reduce particle contamination. Entrance and exit loadlocks offer additional process capability. The system has a color touch-screen interface and is equipped for real-time endpoint-trace display and analysis. An endpoint-monitoring system compares each endpoint trace to a reference trace stored in memory for each process. An optional downstream Microwave Asher Module can be installed on the exit loadlock chamber for rapid photoresist removal.

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