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Back Issues of MICRO Magazine
December
2004 | October/November
2004 | August/September
2004
July 2004 | June
2004 | May
2004
April
2004 | March 2004 | January/February
2004
December
2004
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
October/November 2004
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: New
report examines challenges of CMOS extension and beyond
- Breakout: Intel
ramps up EUV litho development, installs exposure tool,
sets up mask line
- Lefty: Chip-scale
clock
- Japan Beat: Suppliers
boost regional efforts
- 'Round
the Circuit: SIA
seeks help for epidemiological study; TEL, LETI collaborate;
flexible display R&D funded; Trikon lands MRAM funds;
MuGFET shows process capability
- Expansions, Acquisitions
& Alliances:
Litho leads partnering parade; ASMI sets Singapore plant;
AMAT buys Metron; Kodak snaps up National unit
-
E-manufacturing:
Interface A deployment, automated decision-making
tools essential for full fab automation
-
Columnist
Bijan Moslehi says roadmap must combine
technology, business factors
TECHNICAL
ARTICLES
-
Special
Apps: Advancing real-time DRIE silicon
trench etch-depth monitoring in MEMS applications
- Materials
Integration: Using an ICP-based strip system to
perform resist and barrier-layer removal in copper low-k
processes
- APC/AEC:
Eliminating scrap through process and equipment
control based on interactive learning
- Defect/Yield
Analysis: Using an E-beam method and line monitoring
to perform in-line inspection
- Tool/Fab
Support Strategies: Maximizing tool uptime and process
stability through an RF system upgrade
PRODUCT
TECHNOLOGY NEWS
-
Products:
Photomask
repair system, gas-flow calibrator, ion implanter,
electron probe microanalyzer, thin-film deposition
controller, aqueous develop/etch tool, excimer
laser micromachining, sample-preparation platform,
stainless-steel gas springs, wireless autoleveling
sensor, wireless maskmaking sensor, linear
CD source, FPD measurement tools, mask metrology
system
-
Product
Extra!: Vendor
offers RF atom source/RF ion source conversion
kit; enhanced litho software enables n-point
alignment of multiple points on different
layers; particle measurement products include
dual air-filtration system; software package
allows users to set up and monitor controllers;
supplier modifies inorganic purification media
to include CO filtration capabilities
August/September
2004
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: Semicon
West wrap-up:
New materials, 300-mm tool
changeover test industry mettle
- Sidebar: Semiconductor
industrial park set for California-Mexico border
- Lefty: A
chip and a prayer
- The MICRO Interview:
MEMC's
Nabeel Gareeb
- Market Outlook
: China
tool market booms
- 'Round
the Circuit: Cypress opens tech center; Soitec, ASM
push sSOI; CD-ROM explores MEMS; ULSI metrology conference
issues call
- Expansions, Acquisitions
& Alliances:
Immersion picks up steam; M&A activity continues; Samsung
expands Austin fab; Siltronic opens 300-mm plant; Micron
to fab NAND; BOC, IMEC get supercritical
-
Alan
Weber: Facing the challenges of
APC's second decade
THE HOT
BUTTON
-
Interconnect:
Etch, deposition, cleaning, and materials
challenges line the road to 45 nm
-
Columnist
Bijan Moslehi comments on full fab automation
TECHNICAL
ARTICLES
-
TechEmergent:
Combining thermal waves and a signal-processing
algorithm to characterize USJs
- Behind
the Mask: Using
OASIS to contain the size of data files in the manufacture
of photomasks
- Tool/Fab
Support Strategies: Purging
FOUPs that open to front-end minienvironments using
an inert-gas curtain
PRODUCT
TECHNOLOGY NEWS
-
Products:
RTP
system, electro CMP tool, capacitance vacuum
gauge, ultrathin wafer backgrinding, gas-cluster
ion-beam system, single-wafer electroplater,
3-D surface analysis instrument, lithography
filter system, CMP platform, sputtering system,
optical digital profilometry system, moisture
analyzers, rotary actuator, excimer laser,
TOC analyzers, thin-film measurement tool,
silicon wafers, photomask CD measurement tool,
copper electroplate filter cartridges, front-opening
unified pod
-
Product
Extra!: COO
software line adds metrology analysis module;
supplier awarded patents for nanolayer deposition
of conformal thin films; brochure spotlights
HPLC front ends for mass spectrometry; high-resolution
module performs automated macrodefect inspection
on CMP tools; vendor granted patent for silane
flash arrestor
July 2004
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: Service,
spares management deals extend Applied's global fab reach
- Lefty: Fab
pit crew
- The MICRO Interview:
Texas
Instruments' Hans Stork
- Market Outlook
: Metrology
measures up
- 'Round
the Circuit: Semicon West reunifies in 2005; spintronics
center formed; SPIE Microlithography, ASMC call for papers
- Photo
Gallery: High Tech U
- Expansions, Acquisitions
& Alliances:
IC manufacturers expand 300-mm-based capacity; Nantero, LSI
go nano; three alliances bolster membership; STMicro, Si Auto
sign control agreement; Sematech, Zeiss to develop AIMS for
193-nm masks; Surface Technology Systems, Jobin Yvon claim
MEMS etch control advances; Integrated Materials scores funds
-
Metrology:
Starting-material, engineered-substrate
demands put
added pressure on wafer suppliers, metrology
providers
-
Columnist Bijan Moslehi looks
at 300-mm manufacturing
TECHNICAL
ARTICLES
-
Special
Apps: Introducing wide-band-gap silicon
carbide production into a silicon fab
- Dry
Surface Technologies: Using a tungsten plasma clean
process to reduce metal shorts caused by CMP microscratches
- Critical
Materials: Understanding the new SEMI standards
for stainless-steel welding applications
- Green
Manufacturing : Achieving closed-loop process
control of DI-water replenishment
- Failure
Analysis : Adopting low-voltage STEM and automated
sample prep to perform IC failure analysis
- AEC/APC:
Solving process issues at an ASIC fab using design of
experiments
PRODUCT
TECHNOLOGY NEWS
-
Products:
Analysis tool, differential pressure
controller, benchtop weld head, atomic-layer
deposition system, fab data integration package,
deposition bath control system, conductive AFM
module, ball valves, miniature guideway module,
manufacturing execution system, fluorine dry
pumps, micromachining laser system, and more
-
Product
Extra!: ALD module boosts deposition
rates; vendor rents out e-diagnostics suite;
technology measures copper overburden thickness
on platers; Internet site offers wafer foundry
marketplace; metrology system shipped on MOCVD
reactors
June 2004
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story:
ALD maps out its place in the nanometer-scale world
- Lefty: Edge
cutters
- Breakout: New
photomask facility in Dresden combines R&D, pilot, and
production lines
- Breakout: Rudolph,
SCP Global grab first-to-market honors with new product launches
- 'Round
the Circuit: Crolles2,
LETI ink R&D pact; Singapore Economic Development Board,
KLA-Tencor partner; Qcept scores funds and O'Neill; NanoVance
launches
- Expansions, Acquisitions
& Alliances:
Infineon expands Virginia fab; Entegris finds FOSB partners;
TEL, Mattson collaborate; Air Products wheels, deals; AMD
opens innovation centers
-
Lithography:
Complexity, costs, infrastructure, and
data-file size among challenges facing
photomask community
-
Columnist
Bijan Moslehi examines integrated metrology
TECHNICAL
ARTICLES
-
TechEmergent:
Measuring Young's modulus of low-k dielectrics
using surface acoustic waves
- APC/AEC:
Optimizing STI etch process control using optical
digital profilometry
- Defect
Yield Analysis, Metrology: Using an in-line defect-analysis
tool to provide real-time root-cause knowledge of yield
loss
- Thermal
Processing: Using a noncontact stacked-hot-plate system
to cure spin-on dielectrics
- Materials
Integration: Evaluating the use of single-wafer wet
cleans with organic spin-on dielectric materials
SEMICON WEST 2004
- The
special section features a rundown of show activities.
PRODUCT
TECHNOLOGY NEWS
-
Products:
Equipment
control system, air diaphragm valve, diamond
CMP pad conditioners, atomic-force line monitor,
dry/wet lithography system, x-ray metrology
tool, PVD cluster tool, ozonated-water delivery
system, high-purity arsine, HEPA filter, single-wafer
cleaner, 300-mm wafer/carrier handler, real-time
factory cost model, dc plasma power supply,
flare connectors, decentralized control system,
cleanroom wipers, Ethernet/IP gateway, front-end
module, metrology tool
-
Product
Extra!: Vacuum
chuck stage accommodates large samples; slide
chart links potential lost revenue to inaccurate
gas mixtures; vendor awarded patent for multilayer
composite dielectric film concept; supplier
offers assured shipping time program; catalog
summarizes electronic switches, sensors, transducers
May
2004
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story:
SIA backs fab cancer study critics have long demanded
- Lefty: It's,
uh, Small World
- Market Moves: M&A
activity escalates
- Breakout: Enhanced
TEM tool used to break subangstrom image-resolution barrier
- Breakout: SevenStar
to contract manufacture Aviza systems for Chinese domestic
market
- 'Round
the Circuit: Advanced
Materials Research Center plan unveiled; Varian, ISE enter
joint-development pact; China scholarships launched by SEMI;
Mallinckrodt Baker expands stripper recovery program; FSA
issues design kit guide; HCL showcases e-diagnostics framework
- Expansions, Acqusitions
& Alliances:
Chartered ramps 300-mm fab; Fujitsu, NEC to build 300-mm facilities;
Sony, Samsung join LCD forces; IMT builds gas sensors for
Ion Optics
-
Fab
Automation/Integration: Flexibility, interoperability,
contamination control among keys to highly
automated factories
-
Columnist
Bijan Moslehi concludes his examination
of the wafer-cleaning market
TECHNICAL
ARTICLES
PRODUCT TECHNOLOGY NEWS
-
Products:
Multiple
metrology tool, dry pump system, high-torque
stepping motors, trace-moisture analyzer, vision
sensors, vibration-isolation workstation, support
bearing units, day tanks, mass-flow controller,
GC-MS vacuum upgrade kit, confocal laser microscope,
humidifier, bar code tool, arsine purifier,
direct-drive rotary tables
-
Product
Extra!: ICP-MS tool offers reliable method
for measuring ultratrace metallics; liquid-level,
flow, and pressure sensors catalog issued; immersion
lithography simulation software updated; vendor
provides UV excimer laser refurbishment services
April 2004
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story:
Metrology start-ups, spin-offs turned up business in downturn
- Lefty: Mirror,
mirror
- Market Outlook:
Smooth
growth for slurry
- Breakout: Infineon
builds nanotube-based power transistor using standard processes
- 'Round
the Circuit: Nikon
ups ArF ante; Microfabrica scores funds; ASMC returns to Boston;
IC video training course released; UPW standard under review
- Expansions, Acqusitions
& Alliances:
Sony/Toshiba,
Samsung/IBM/Chartered/Infineon form chip alliances; Fairchild
invests in PA fab; ASM buys NuTool; groups of suppliers join
hands; X Initiative gains momentum
-
Interconnect:
Concerns about low-k integration, extendability
dominate debate
-
Columnist
Bijan Moslehi examines the wafer-cleaning
market
TECHNICAL
ARTICLES
PRODUCT TECHNOLOGY NEWS
-
Products:
Defect-detection
system, CMP monitor, atomic layer deposition valve,
spray-coating tool, FTIR moisture analyzers, ArF
excimer light source, miniature linear stage,
ozonated-water delivery system, videographic recorder,
dual-output pressure sensor, TOC analyzer, pressure
transmitters, wide miniature linear guides, LED
lift-off system, filtration capsules, FPD process-optimization
sensors, panel-mount controllers
-
Product
Extra!: Adapter allows lithographers to use filter
capsule with filter media; Spanish-language Web site
for membrane contactors launched; nanopositioning
stage offers enhanced scanning control mode; x-ray
diffraction software packages adopt XRDML data platform;
vendor provides cost-modeling e-zine
March
2004
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story:
Liquid lithography technology waits for defect data to surface
- Lefty: Strength
in numbers
- Lead Sidebar: Water
treatment is 'nontrivial', says researcher
- The MICRO
Interview: Applied
Materials' Mike Splinter
- Breakout: Applied
touts low-k progress
- World
Beat:
Asia: Axcelis, Varian, Ionics, Thomas West, Entegris
score Taiwan biz; Samsung awards contracts to Air Products,
Praxair; Fujitsu, Sumitomo partner up
Europe: ASM moves operations; Infineon unit taps Suss
- Market Outlook:
Tool
market heat wave
- 'Round
the Circuit: IC
sector ranks high in safety; static charge RP issued; Albany
lands ALD program; Intel funds EUV source work; NanoForum
to debut; ICP-MS textbook released
- Expansions, Acqusitions
& Alliances:
Dow
Corning joins litho fray; MEMC strengthens hand in wafer supply
arena; SCP inks JDA with Korean DRAM manufacturer; Rockwood
buys Isiltec; litho research center opens at North Carolina
State
-
Metrology:
Pressures build on tool performance
-
Columnist
Bijan Moslehi examines the dawn of the
e-manufacturing era
-
The
show section features a preview of the
AEC/APC Europe conference and a list of
Semicon Europa programs.
TECHNICAL
ARTICLES
-
Special
Apps: Investigating the use of spray-coating
technology in MEMS application
- AEC/APC:
Applying a simple statistical process control approach
to defect monitoring
- Materials
Integration: Reducing costs in spin-on-glass deposition
applications
- Green
Manufacturing: Using
dissolved ozone in semiconductor cleaning applications
PRODUCT TECHNOLOGY NEWS
-
Products:
Large-area stepper, FOUP cleaner, micromachining
system, substrate etch tool, nonstandard thermocouple,
dry strip platform, e-beam litho modeling software,
HEPA and ULPA filters, RF delivery system, gasket
filter, high-purity pressure sensor, particle-detection
system, postash-residue remover, ultrastiff
platforms, wet process tool, flex cable heaters,
turbomolecular pumps, data-access software,
air-filtration system
-
Product
Extra!: DUV coating process improved; patent
granted for high-purity quartz electric resistive
heater technology; fluid-handling vendor redesigns
Web site; supplier receives patent for system
that reduces boundary layer thicknessin DIO3
fluid-flow field; fab connectivity system offers
new features
January/February 2004
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story:
ITRS Update: Revised roadmap shows hard work ahead
for yield drivers
- Lefty: A
good worm
- Breakout: Chip
outsourcing to accelerate
- World
Beat:
Asia: TSMC, ASML jump into immersion litho; NEC, SVA
ink FPD deal, Meiden, AMAT retool in China; KLA-Tencor goes
on-line in Japan; BOC scores big in Shanghai
Europe: AMD chooses Dresden for 300-mm fab
- Photo Gallery: The
art of nanoscience
- 'Round
the Circuit: Sematech forms new subsidiary; software simulates
EUVL process; NIST uses SAXS to x-ray defects; Chipworks discovers
true low-k
- Expansions, Acqusitions
& Alliances:
SOI metrology targeted; GEM3 plans AZ chem plant; Molecular
Imprints scores funds; NSF signs Actinix; Tegal buys Simplus;
TWI upgrades lab; ISMT chooses Technovision
-
New
feature presents excerpts of discussion
about the challenges facing advanced lithography
-
New
columnist Bijan Moslehi examines an industry
in transformation
TECHNICAL
ARTICLES
-
Tech
Emergent: Developing superficial carbon
dioxide processing in microelectronics applications
- Defect/Yield
Analysis: Lowering magnetic fields in metal dry-etch
recipes to reduce MOS leakage levels
- Behind
the Mask: Meeting airborne molecular contamination
challenges in laser pattern generators
- Wet
Surface Technologies: Investigating
the role of gas cavitation in megasonic nanoparticle removal
PRODUCT TECHNOLOGY NEWS
-
Products:
E-beam inspection tool, x-ray diffraction tool,
laser rotary encoder, annealing system, automated
in-line SEM/FIB system, tantalum sputtering
targets, and more
-
Product
Extra!: Wafer-cleaning tool enhanced, metrology
system software updated, motor catalog published,
scan-field i-line stepper updated, and more
MicroHome |
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Questions/comments about MICRO Magazine? E-mail us at cheynman@gmail.com.
© 2007 Tom Cheyney
All rights reserved.
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