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Back Issues of MICRO magazine
1999 Back Issues | 1998 Back Issues | 1997 Back Issues
November/December 2000 | October
2000 | September 2000
July/August 2000 | June
2000 | May 2000 | April
2000 |
March 2000 | February 2000 | January 2000
November/December
2000
Selected Contents
EDITOR’S PAGE
MICRO R&D ROUNDUP
- The R&D Roundup
provides a glimpse of the university and governmental research being
conducted internationally in the semiconductor field. Issues addressed
in this special year-end section include interconnect, environmentally
friendly processes, low-k, copper, the role of partnerships, and
the status of mentors and students.
TOP 40 PRODUCT ALLSTARS
- MICRO
readers have chosen the 40 most popular products of 2000, including
wafer shipping boxes, transport robots, lithography tools, copper-cleaning
products, mass-flow controllers, wafer dryers, copper-stripping
systems, and an array of valves, regulators, sensors, pumps, and
detectors.
October
2000 - Selected Contents
EDITOR’S
PAGE
INDUSTRY NEWS
- Lead Story: Silicon Valley
plugs away to cope with region's ongoing power pinch
- Lefty: Not feeling chipper
- Breakout: European chip
equipment initiative succeeds in putting region's toolmakers on
world map
- World Beat:
Asia: Motorola invests more in China; Cymer opens center
in Hsinchu; Philips expands in Shanghai
Middle East: Tower chooses M+W Zander to build Israeli fab
Europe: LGInternational signs ITS as European distributor
- 300-mm Imperative: Japanese
firm orders Entegris FOUPs; 300-mm wafer toolmakers to see eightfold
jump in revenues; FEI inspection tools installed at pilot facility;
electronics manufacturer buys Axcelis dry resist removal tools
- What’s Going On:
Electronica 2000, Semicon Japan, and more
- 'Round the Circuit:
Corning to focus on ULE glass for lithography; FSI to close two
California facilities; SEMI sponsors EHS award; Kinetics buys itself
out from USFilter; ICE publishes report on 400 IC makers and suppliers
- Expansions and Acquisitions:
GaSonics enlarges plant, moves HQ; DPI begins production on new
mask lines; Corning ups calcium fluoride production; General Chemical
installs IPA unit; Air Liquide opens oxygen site; Photronics takes
majority stake in Precision Semiconductor Mask
- On Display: Team to
develop passive-driven polymer organics LEDs
TECHNICAL ARTICLES
PRODUCT TECHNOLOGY NEWS
- Products: Inspection microscopes,
fiber-optic amplifier, residue remover, quartz cleaning tool, plasma
doping system, fabwide wafer-transport system, plasma impedance
monitor, evaporation system, mass-flow controller, film metrology
software, wafer treatment systems, heat exchangers, and more
- Product Extra! Supplier
offers advanced CMP slurry characterization; vendor's filter capsule
expedites changeouts in photoresist applications; manufacturer expands
sensor line; components maker enhances CMP retainer rings; ESD firm
converts ionizing blowers; instrument maker reports on proximal
probe technology, and more
September
2000 - Selected Contents
EDITOR’S
PAGE
INDUSTRY NEWS
- Lead Story: Metrology sector
seeks methods to measure up to new challenges
- Lefty: Only a wee bit
Moore?
- Breakout: Opening start-up's
first plant, outsourcing veteran sees vindication and consolidation
- 300-mm Imperative: Applied
claims 21-tool launch; Selete approves FSI tool
- International Sematech
Watch: IMEC, Sematech enter R&D gate project; workshop agrees
on soft pellicles
- World Beat:
Asia: Siemens, Intel, Macronix to build Thai fab; Mitsubishi,
Honeywell form wet-process chemical alliance; Komatsu, Ushio launch
excimer laser business
Europe: Motorola opens Romanian center; Lytron hires AMS
Thermotech as UK distributor
Africa: BOC Edwards, Pelchem to build plant in South Africa
- Fab Forecast: DRAM
production, 300-mm fab growth to spur tool sales
- Supply Chain Update:
SemiSales.com debuts at Semicon West
- Expansions and Acquisitions:
Advanced Energy buys EMCO; ATMI purchases ESCA; BOC, ISinc form
strategic design tool alliance; MKS acquires Spectra International;
Sitek becomes Prodéo
- What’s Going On:
Ultrapure Water Asia, Semicon Southwest, and more
- 'Round the Circuit:
NIST wafer improves RTP; ASTM issues new wiper standard; SEMI hosts
FPD show with EIAJ and JEIDA; ANSI okays IEST to write standards;
MRS issues call for papers
TECHNICAL ARTICLES
PRODUCT TECHNOLOGY NEWS
- Products: CMP system,
dry pumps, inspection systems, lithography platform, birefringence
measurement, SIMS tool, feedthrough actuator, XRF elemental analyzer,
CMP slurry cleaning systems, particle detection system, silicon-on-quartz
wafers, yield management software, linear motion guide, flame detector,
brushless linear motors, Teflon bellows, rapid thermal processing
tool, poly etch system, critical dimension SEMs, flow switches,
web-enabled tool connectivity, metrology tool, plasma etch tool
- Product Extra!
July/August 2000 - Selected
Contents
EDITOR’S
PAGE
INDUSTRY NEWS
- Lead Story: Meeting continues
industry drive to chip in on economic model
- Lefty: Self-assembly required
- Dept. of Corrections
- Breakout: Increased response
rate expected as SEMI introduces electronic standards balloting
- Breakout II: Infineon,
Intel announce 300-mm expansion plans
- World Beat:
Asia: SEZ opens Singapore office; AMD, Fujitsu to build flash
memory plant
Europe: Infineon joins EUV effort; Micronas to extend fab
- 300-mm Imperative: Sematech,
Selete publish on-line info; Soitec to make SOI wafers
- Expansions and Acquisitions:
Timbre, Tokyo Electron vets launch software start-up; O¹Brien buys
Cardinal; KLA-Tencor to build new plant
- Photo Gallery In the bag
- Supply Chain Update Adept
backs e-biz
- What’s Going On:
FPD Expo Korea, Diskcon, and more
- 'Round the Circuit:
FSI teams on green project; Novellus claims low-k success
TECHNICAL ARTICLES
PRODUCT TECHNOLOGY NEWS
- Products: Copper-stripping
service, nylon tubing, chemical delivery system, process control
software, RTP system, quartz heater modules, flow control valve,
data-mining tools, fluid-handling components, gas purifier, IPA
drying system, spin processor, thick-film photoresists, electro-copper
deposition system, wafer-testing probe, high-purity piping, nanoscale
profilometer, flowmeters, CMP metrology system, process management
systems, and more
- Product Extra!
- Products in Action:
Automating slurry delivery reduces labor, improves data collection,
increases yields
Products in Action
II: Design of experiments software helps clear wafer transport
traffic jams
June 2000
- Selected Contents
EDITOR’S
PAGE
INDUSTRY NEWS
- Lead Story: New standards
give chipmakers the power to maintain their yields
- Lefty: VCs back ICs
- Breakout: ASMC 2000
reaches past process issues to target range of semiconductor manufacturing
topics
- Breakout II: NEC says
Internet advances led chipmaker to build "world¹s most-advanced"
LSI fab
- World Beat:
Asia: SCP builds lab in Singapore; Boin wants
Nanyang for wafer map distribution
Europe: Applied expands in Europe; Oxford opens
cleanroom lab in UK
- Photo Gallery Application
specific
- Supply Chain Update
The Supply.com, NexPrise link suppliers, buyers; SEMI forms e-biz
board
- Expansions and Acquisitions:
Eaton expands; QAM completes buyout; Tower to make ICs for National;
partners create Mosaic
- Photo Gallery II
Bavarian interlude
- 300-mm Imperative: STMicroelectronics,
Philips to build pilot line; SEZ to deliver spin processors to
Semiconductor300
- What’s Going On:
Semicon Taiwan, BACUS, and more
- 'Round the Circuit:
FSI teams on green project; Novellus claims low-k success
TECHNICAL ARTICLES
-
Technical Viewpoint
Formulating scientifically based specifications to control floor
and tool vibration in IC fabs
-
Behind the
Mask Comparing software and hardware simulation tools on an embedded-attenuated
PSM
-
-
-
Extreme Silicon
Investigating optical metrology issues specific to SIMOX-SOI wafers
-
PRODUCT TECHNOLOGY NEWS
- Products: Overlay metrology
tool, cleanroom boot, wafer transport robot, XRF analyzer, height-adjustable
workbench, etch manometer, power supplies, airflow measurement
system, computer workstations, and more
- Product Extra!
- Products in Action:
Control system speeds start-up and stabilizes process air in DUV
litho tool clusters
SEMICON West 2000
May 2000 - Selected Contents
EDITOR’S
PAGE
INDUSTRY NEWS
- Lead Story: IBM announcement
may boost fortunes of low-k spin-on method
- Lefty: Doing their homework
- Breakout: Trend to Web-based
suppliers continues; new e-commerce parts firm sets July launch
- Breakout II: Toshiba
transfers "robust" submicron process technology to Tower
for new foundry in Israel
- World Beat:
Asia: TSMC opens world¹s largest fab; DPI adds
mask lines; Photronics buys PSMC; Powerchip to build fab in Hsinchu
Europe: French atomic energy agency to explore
EUV lithography
- Photo Gallery Capacity
boost
- Expansions and Acquisitions:
Novellus, GaSonics to develop photoresist and residue removal techniques
for copper structures; Veeco buys CVC, parts of IBM AFM product
line; SEZ, Ashland partner on polymer-cleaning chemistries; Solkatronic
expands two sites
- 300-mm Imperative: Sematech,
Selete to develop 300-mm software; UMC, Hitachi form Trecenti
- What’s Going On:
Semicon Kansai, CleanTech 2000, and more
- 'Round the Circuit:
Sematech completes first-phase evaluations of low-k films; Motorola,
EVG make mask-coating technology available; NIST agrees to offer
Productivity¹s lean manufacturing course; Vortek claims breakthrough
with annealing technology
TECHNICAL ARTICLES
PRODUCT TECHNOLOGY NEWS
-
Products:
Lithography scanner, ESD-event monitors, bulk-chemical control system,
flat-panel monitors, static-dissipative linear slides, temperature
probes, in-line batch sputtering system, liquid-level sensors, wafer
dryer, surface-measurement sensor, interferometric camera, copper-cleaning
products, pressure transducer
-
Return to the top of this page
April 2000 -
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: New ESH report
details ways to cut fab water, energy costs
- Lefty: Spare the rod
- The Micro Interview
Green research center's Shadman: "ESH has to be at the heart of process
development"
- Breakout: MIT lab makes world's
smallest gate length transistors using direct optical lithography
- Photo Gallery The next
step down
- World Beat:
Asia: UMC, IBM, Infineon collaborate on  0.10-µm
tech; Adept chooses Marketech to sell in Taiwan
Europe: SEMY signs Teltec as rep
Middle East: Jon Goldman provides Israeli fab with
software upgrades
- 300-mm SUNY thin-film tech
center gets more funding from NY; 300-mm fab push boosts tool sales
- Expansions and Acquisitions:
Steag purchases CuTek; Honeywell Electronic Materials to enlarge California
research center; Semifab expands plant, signs agreement with Lucid;
BOC to buy Kachina; Cintas acquires Mission Industries; August moves
to new site; Air Systems expands
- What’s Going On: MRS, Cleanrooms
2000, and more
- 'Round the Circuit: International
Sematech reports copper successes; SEMI president heralds golden age;
ASML MaskTools, Mentor collaborate on photomasks; Corning, Photronics
agree to develop photoblanks
TECHNICAL ARTICLES
PRODUCT TECHNOLOGY NEWS
- Products: Ion implanter, ash-residue
remover, slurry filter capsule, 300-mm shipping box, microprocessor
module, liquid-level sensors, ESH-protective polypropylene, liquid-flow
controller, vacuum-chamber flange, stripping solvent, fluorine monitor,
laser-scan micrometer, gas system components, wafer clamp ring, pressure
sensors, chemical delivery system fittings, pressure transducers, chemical-processing
station, liquid-level sensor, flip-chip lithography tool, level-sensor
controllers
- Product Extra!
Return to the top of this page
March 2000 - Selected Contents
.
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: Supply industry
veterans get set to launch on-line materials sites.
- Lefty: Black magic
- The Micro Interview
Intel's Mike Splinter to suppliers: Improve your technology, lower your
costs, get more agile
- Breakout: Is the downturn
officially over? Intel's open pocketbook seems to say 'Yes'
- World Beat:
Europe: STMicroeltronics signs agreement with Tecdis
and Three-Five Systems to make driver chips; Naltex opens office in
UK; Union Miniere invests in Performance Materials
Asia: Cabot Builds CMP slurry plant in South Korea
- On Display: USDC contract
with Kurt J. Lesker to promote development of flexible OLED panels;
Kodak, DuPont join USDC; changes in substrate size pose challenge to
TFT-LCD manufacturers; Three-Five exec chosen chairman of USDC's governing
board of directors.
- Expansions and Acquisitions:
KLA-Tencor acquisition of Finle Technologies to facilitate 0.13-µm process;
Transition technology International changes name to TTI Silicon: BOC
Edwards opens lab focusing on copper chemistries, Aeronex signs purifier
pact with Supelco; MRL to up furnace capacity; QC Solutions hires Palmborg
Associates as sales rep
- What’s Going On: IFST 2000,
Diskcon Japan, Estech 2000, and more
- 'Round the Circuit: Wright
Williams & Kelly offers free on-line calculator to decipher the ITRS;
same suppliers top TOP 10; Cypress Information Resource database contains
info on 1400 semiconductor manufacturers; Applied cleans up
TECHNICAL ARTICLES
PRODUCT TECHNOLOGY NEWS
- Products: Spin processor,
vacuum valve, die carrier, wafer loader, thin-film analyzer, particle
size analyzer, digital MFC, gas purifiers, 300-mm thermal processor,
electrochemical depostition system, KrF excimer laser, thin-film metrology
system, CMP polishing pad, fab automation package
- Product Extra!
SEMICON
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.
February 2000
- Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: Irish start-up
senses plasma turning point down the road
- Lefty: A hands-on tour
- Breakout: On the hunt for
foundry capacity, TSMC announces mergers with WSMC, Acer
- World Beat:
Asia: Mitsubishi builds HP plant; SRC admits UMC Group
as first overseas member; Air Products buys Korea Industrial Gases;
M+W Zander to design Korean cleanroom; Tescom Korean branch debuts
Europe: STMicroelectronics chooses Extraction gear
in France; IMEC installs Verteq tool
Africa: BOC, AEC team up to build plant in South Africa
- Expansions and Acquisitions:
Air Liquide opens air separations plant; Wacker, Arch launch CMP slurries
joint venture; ATMI reorganizes materials business; Aera touts InPod
buy
- Microlithography 2000
Special section on 25th annual symposium features metrology conference
shift to defect detection, show exhibitor list
- On Display: Philips signs
deal with Rainbow Displays; Three-Five/Mitsui expand agreement; Kingroup
integrates Adept robots
- 300-mm Imperative: TSMC breaks
ground for Hsinchu fab; Hitachi, UMC to build fab; GW Associates offers
component object model-based server
- 'Round the Circuit: TSMC,
UMC offer copper devices; Graham becomes president of SISA; alliance
pushes Ethernet, TCP/IP in industrial automation; Honeywell, Microbar
sign spin-on materials delivery deal
- What’s Going On: DUMIC,
SPWCC, and more
- Photo Gallery
TECHNICAL ARTICLES
PRODUCT TECHNOLOGY NEWS
- Products: DUV Spectrophotometer,
surface-mount gas delivery system, high-density plasma sources, 3-D
SEM, glass-ceramic connectors, FTIR metrology tool, vacuum gauge, disk
measuring system, particle counter, vacuum chamber, SEM review system,
automated manufacturing software, UPW piping system, mass-flow controller,
contact-angle measuring systems, CVD metrology system, cylinder-pressure
regulator, and more
- Product Extra!
Return to the top of this page
January 2000
- Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: Suppliers ponder
whether chip technology map is road to ruin
- Breakout: Display Works
2000—Display industry's push to larger panel sizes continues to pull
at production yields
- Breakout: SIA backs year-plus
study to assess fab cancer risk
- Photo Gallery: Implantation
augmentation
- World Beat:
Asia: Cabot to open plant in Geino, Japan; Hakuto
agrees to sell Extraction Systems filtration products; Hyundai Electronics,
GaSonics form joint development pact for <0.13-µm DRAMs; Asyst signs
partnership pact with MECS; J.T. Baker contracts Dong Woo of South
Korea to make strippers
Europe: AMD opens new fab in Dresden, Germany
- 'Round the Circuit: Chipmakers,
equipment manufacturers join forces to expand Scalpel litho technology,
NIST assists MEMS projects; VLSI Standards to use MIT technology to
make CMP reference wafers
- Expansions and Acquisitions:
Court okays SubMicron sale to Akroin; Entegris buys Mace; SET sets
up new site in California; Ultratech, Shin-Etsu sign pact to evaluate
photoresists; Silicon Genesis opens Class 1 site; Process technology
enlarges Class 100 cleanroom; DPI ups mask capacity; Lam buys cleaning
technology from Oliver
- What’s Going On: Semicon
Korea, SPIE Microlithography, and more
TECHNICAL ARTICLES
- Building Copperopolis II:
Using a wafer backside spin process to eliminate contamination
in copper applications A spin-process technique prevents back-surface
particle contamination of the process chuck, creates an edge exclusion
zone, and optimizes the copper/barrier material interface.
- ITRS Update: Comparing
the defect reduction sections of the most recent versions of the roadmap
The International technology Roadmap for Semiconductors details the
challenges of finding ever-smaller needles in an ever-larger haystack.
- Ultrapure Fluids: Identifying
organic contaminants in ultrapure water at sub-parts-per-billion levels
Unlike existing methods, a combination TD-GC-MS technique can identify
semivolatile compounds, such as phthalates and siloxanes, which can
affect wager and disk-media processing.
- Defect and Yield Analysis:
Reducing baseline defect density through modeling random defect-limited
yield Partitioning yield into random and systematic components
and partitioning the random defect-limited yield component heightens
defect reduction efforts and enhances yields.
PRODUCT TECHNOLOGY NEWS
- Products: Wafer inspection
system, implant monitor, air sampler, mass-flow controller, microwave
analyzer, recycled-waferscrubber, deep-UV excimer laser, plasma characterization
probe, ESD-certified garments, Teflon process bath, optical spectrograph,
polyimide machining stock, servomotor brakes, fume extractor
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© 2007 Tom Cheyney
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