The
WaferSense autoleveling sensor is a wireless waferlike device that
enables quick and accurate leveling of IC wafer processing and automation
equipment. Designed to be handled like a 150-, 200-, or 300-mm wafer,
the thin and lightweight sensor can be placed in cassettes or front-opening
unified pods, on end effectors or aligners, in loadlocks, and in process
chambers to ensure that stations are level and coplanar. The device
provides precise pitch-and-roll measurements—accurate to ±0.03°—that
can be logged to relate coplanarity with yield and determine optimal
tool adjustments.
The
Atlas advanced metrology system combines multiple metrology technologies
in one stand-alone unit. Providing a reduced cost of ownership and
high utilization rates, the tool can house up to five critical metrology
technologies at one time and performs metrology for wafer characterization
with excellent repeatability. It performs 200- and 300-mm wafer metrology
applications and can be configured with any combination of spectroscopic
reflectometer, spectroscopic ellipsometer, optical critical dimension,
diffraction-based overlay, and wafer stress/bow modules. The tool
features temperature control and robotics, including a dual-arm robot,
a high-precision stage, and high-speed focus system. It provides robust
pattern recognition, fine thickness reproducibility, and high throughput.
The
Liquozon Single ozonated-water (DIO3 water) delivery system
is the newest in a series of ultrapure ozonated water generators.
Designed to supply DIO3 water to single-wafer cleaning
tools, the compact and self-contained unit provides ultrapure DIO3
with a high and accurate ozone concentration at a constant delivery
pressure. The unit delivers DIO3 water with ozone concentrations
between 5 and 55 ppm at flow rates between 0.5 and 20 L/min and at
a pressure of up to 2.5 bar. The instrument, which measures 40 X 50
X 120 cm, contains an ozone-gas generator, an ozone contactor, a dissolved-ozone
analyzer, and an ozone-gas destruct unit.
Tantalum
sputtering targets are available for all leading physical vapor deposition
(PVD) systems. The tantalum material is offered with purity levels
ranging from 3N5 to 5N and a low oxygen content. The targets have
a small grain size and uniform metallurgy for high process consistency.
Assemblies feature a proprietary high-strength bond for maximum throughput.
The
AutoCal Dynamic Correction Engine performs control functions in photolithography
track systems. The system tunes multizone or multicontroller postexposure
bake (PEB) hot plates to provide a uniform thermal dose profile. It
automatically dials in the mean steady-state temperature and reduces
the overall temperature spread across the wafer. As a result, within-plate
thermal uniformities can be optimized. Plate-to-plate and track-to-track
matching of PEB plates can be achieved routinely, improving CD uniformity
in the fab. The system works in conjunction with BakeTemp sensor wafers
to obtain an accurate baseline picture of the process zone. It uploads
BakeTemp data along with an OEM plate-specific thermal model to derive
hot-plate control parameters and achieve thermal dose uniformity.
Metrology
Tool
ReVera
Sunnyvale,
CA
Based
on x-ray photoelectron spectroscopy, the RVX 1000 metrology system
is a small-footprint turnkey system that simultaneously performs multiple
automated measurements, including film-thickness and elemental concentration
measurements in film. The tool incorporates a configurable automation
system, allowing customers to choose the appropriate combination of
200- and 300-mm load ports to meet their needs. A Windows user interface
provides a wide range of measurement outputs, which can be used to
perform process control or generate reports quickly. The unit has
a >95% availability record. It meets industry safety and export
requirements and supports factory-required host communications protocols
for automated production facilities.
Electro
CMP Tool
Applied
Materials
Santa
Clara, CA
Based
on the Reflexion LK platform, the Reflexion LK Ecmp system performs
electrochemical mechanical planarization in copper/low-k applications
at the 65-nm node and beyond. The tool has three platens, enabling
it to remove bulk copper at the rate of >6000 Å per minute
by electric charge, independent of downforce. For use with fragile
low-k films, the tool planarizes dual-damascene structures with minimal
dishing, erosion, and defects (<0.1/cm2). It reduces
the cost of consumables, replacing expensive copper slurry with a
low-cost electrolyte chemistry. Thin, uniform copper film and barrier/liner
materials are removed using very low downforce (<1.0 psi). The
tool features key process control capabilities, including proprietary
integrated iMap radial scan technology, which provides incoming film-thickness
profile information to control the bulk copper removal profile and
endpoint detection.
Excimer
Laser Micromachining
J.
P. Sercel Associates (JPSA)
Hollis,
NH
The
IX-1100 excimer laser micromachining system features high-precision
air-bearing stages, a low and ergonomic structure, advanced excimer
lasers with soft preionization capability, integrated coordinated
opposing-motion mask-indexing air-bearing stages, new beam homogenizers
and imaging lenses, and other features. The compact, Class 1 workstation
machines complex shapes and patterns in a wide range of materials.
Beam homogenization and near-field imaging enable users to perform
several simultaneous micromachining processes. The tool's high pulse
repetition rate ensures rapid processing.
Atomic-Layer
Deposition System
Aviza
Technology
Scotts
Valley, CA
The
Pantheon atomic-layer deposition system is a configurable 200-/ 300-mm
tool for the 65-nm node and beyond. The system offers precise atomic-level
thickness control, low process temperature, and highly conformal coatings
with excellent film quality. The multichamber cluster tool is composed
of up to four process chambers connected to a central backbone hub.
Two dual-stage loadlocks act as an interface between the hub and a
self-contained atmospheric front end. Two loadport modules are attached
to the front end for material loading and unloading. Process modules
use showerhead injectors and ozone-based reactant for optimum process
performance. The unit performs high-k capacitor, high-k gate dielectric,
high-k interpoly, etch-stop/barrier layer, passivation, and other
applications.
Copper
Electroplate Filter Cartridges
Pall
East
Hills, NY
Varafine
Varaclean filter cartridges reduce defects and improve productivity
in high-volume copper plating processes. The cartridges are based
on patented asymmetric membrane material, which filters impurities
down to 50 nm while maintaining high flow rates. For use in 200- and
300-mm copper electrochemical deposition tools, the cartridges are
available in a range of sizes and grades, all of which offer >99.9%
removal efficiency.
Particle-Detection
System
Dr.
Schenk
Planegg/Martinsried,
Germany
The
Pollux automated particle-detection system enables fabs to perform
complete inspection of all masks and reticles before they are used.
More cost-effective and reliable than performing visual inspection,
the system can be integrated into bare-reticle stockers, wafer steppers,
and cleaning stations. It can also function as a stand-alone unit.
The system inspects the glass side and pellicle side of the mask simultaneously
and can detect imperfections down to a 10-µm equivalent sphere
diameter. It detects particulate contamination and defects such as
glass scratches and holes in the pellicle. The small-footprint, high-speed
system enables fabs to make pass/fail decisions about photomasks.
ArF
Excimer Light Source
Cymer
San
Diego, CA
Designed
to support 65-nm photolithography applications, the XLA 105 argon
fluoride (ArF) excimer light source is based on master oscillator
power amplifier dual-gas- discharge-chamber technology. Operating
at a 4-kHz repetition rate and delivering 40 W of output power, the
instrument provides full imaging capability for 200- and 300-mm lithography
scanners at a very tight bandwidth of ≤0.2 pm at full-width
half maximum and ≤0.50 pm at 95% energy integral. It enables
tools with high-numerical-aperture (NA) lens designs to expose the
most critical semiconductor features. Because of this high-spectral-bandwidth
performance, high-NA lens designs require fewer calcium fluoride elements.
The instrument also offers increased pulse duration of ≥70 nanoseconds,
helping to reduce peak fluence for increased scanner optics lifetime.
Atomic
Layer Deposition Valve
Swagelok
Solon,
OH
The
ALD-series valve is an ultra-high-purity, pneumatically actuated component
for use in atomic layer deposition (ALD) processes. To meet the stringent
demands of ALD applications, the valve features rapid valve actuation
speeds <5 milliseconds. It also achieves lifetime ratings >25
million cycles. The patent-pending flow-setting feature provides consistent
process-gas delivery. Manufactured from 316L VIM/VAR stainless steel,
the valve body is available with 1/4-in.
VCR and 1/4-in.
and 6-mm tube-butt-weld end connections. A high-temperature model,
rated for temperatures up to 200°C, is available. Additionally,
multiport, multivalve manifold, and modular surface-mount configurations
are available.
Dry/Wet
Lithography System
ASML
Veldhoven,
The Netherlands
The
newest member of the Twinscan platform, the Twinscan XT:1400, is a
0.93-NA, 193-nm scanner that images at the 65-nm node in volume production
environments and can also be used for preproduction testing and development
at the 45-nm node. Its design will allow users to shift from dry to
immersion lithography on the fab floor through an immersion-conversion
kit that will be available at the end of 2005. The unit will enable
users to include immersion lithography in their technology roadmaps
while performing dry manufacturing at the 193-nm node. The immersion-conversion
kit has three main components: a lens that is suitable for immersion
use, immersion-compatible wafer stages, and immersion infrastructure.
Conversion from a dry to a wet platform will be achievable in weeks
and will increase system performance. The tool is equipped with Ultra-k1,
hardware and software imaging-enhancement technologies that make it
possible to shrink circuit features and achieve high die yields.
Rotary
Actuator
Rigaku
Tokyo,
Japan
A
rotary actuator for contamination-sensitive applications, the Omni-Lev
is supported entirely by magnetic fields, eliminating contact between
moving parts that can generate particles. The actuator's noncontact
mechanism eliminates particles and friction, resulting in accurate
positioning, ultralow shaft runout, long life, and decreased maintenance
requirements. An all-metal construction enables the unit to be used
in ultra-high-vacuum environments and in the corrosive gas or liquid
applications encountered in semiconductor manufacturing processes.
High-Purity
Ozone Generators
IN
USA
Needham,
MA
Series
OG-5000 ozone generators produce high-purity ozone gas at very high
concentrations. The systems are used in chemical vapor deposition,
atomic-layer deposition, oxide growth, surface conditioning, ashing,
wet processing, particle cleaning, photoresist removal, and epitaxy
applications. Ozone gas is generated in the unit through controlled
electrical discharge. The addition of parts-per-million levels of
a doping or spiking gas increases ozone production, ensuring concentration
stability over time. The compact generators are available as stand-alone
systems or as a part of a complete turnkey integrated ozone gas or
DIO3 water-delivery system.
FOUP
Cleaner
Entegris
Chaska,
MN
A
system for cleaning front-opening unified pods (FOUPs) reduces contamination
from human contact. The Process One FX30 cleaning system resides in
an individual cleanroom environment to prevent contamination and has
robotic controls that transport FOUPs through the cleaning process.
It helps semiconductor manufacturers to reduce overall operating costs
by offering high throughput, reliability, and low utility consumption.
The unit is designed to clean and dry the company's FOUPs and front-opening
shipping boxes (FOSBs). It isolates the cleaning media used inside
the FOUPs and FOSBs from the cleaning media used outside, preventing
cross-contamination.
Photomask
Repair System
FEI
Hillsboro,
OR
Designed
to repair photolithography mask defects at the 65-nm node, the Accura
XT+ DualBeam mask-repair system combines a focused ion beam (FIB)
column and an environmental scanning electron microscope (ESEM) in
a single system. The tool can accommodate current photomasks and be
extended to next-generation technologies, including low-energy E-beam
proximity projection lithography/stencil, extreme ultraviolet reflective,
nanoimprint, chromeless phase lithography, and absorber stack masks.
The system contains the VisIONary FIB column, which provides a small
spot size and accurate beam placement for both imaging and repair.
Patented environmental SEM technology enables E-beam repair and high-resolution
E-beam imaging. The system also features an optical microscope for
mask navigation and global alignment.
Wet-Process
Tool
AP&S
Donaueschingen,
Germany
The
TwinStep wet-process tool combines two process stations: a flow-optimized
immersion bath for circulation processing and an overflow processing
system. In contrast to manual benches, the system offers controlled
processing, from automated chemical mixing to processing to service
functions. A flexible tool architecture offers a broad range of configurations
that are suitable for photoresist strip, metal and oxide etch, and
cleaning processes. Optimized process baths for wafers of different
sizes help keep chemical consumption low. The unit's AeroSonic drying
technology can be enlarged to perform chemical treatment, rinsing,
and drying in one bath. The unit is for use in MEMS, gallium arsenide,
and other applications.
Front-End
Module
Newport
Irvine,
CA
The
Performix equipment front-end module (EFEM) features an automated
self-teach wafer-handling robot, patented technology that enables
the EFEM to be installed and operated without extensive operator training.
The module minimizes initial system set-up time in the tool-manufacturing
environment and wafer fab during system startup. The combination of
the robot and an ADO load port and prealigner enables the module to
provide high throughput and extended uptime. The EFEM forms an isolated
minienvironment between a process or metrology tool and a FOUP or
SMIF wafer carrier. The module is available in two-, three-, or four-port
configurations. The use of a repeatable precision datum-mounting scheme
for all major EFEM components facilitates alignment during installation
and reassembly after servicing.
Micromachining
Laser System
New
Wave Research
Fremont,
CA
The
LaserMill benchtop Nd:YAG laser micromilling tool is for use in R&D,
prototyping, pilot-line development, and short-run production applications.
The system features switchable- wavelength operation for machining
a variety of organic and inorganic materials in MEMS, semiconductor,
and other devices. Applications range from passivation and polyimide
removal to lab-on-a-chip production. A flexible alternative to outsourcing,
the 18 X 30-in. tool fits on most workbenches. It is equipped with
100 X 100-mm stages, a high-magnification video microscope, and a
continuously variable, rotating x-y shutter that yields cut sizes
down to nearly 1.0 µm.
Air-Filtration
System
Donaldson
Minneapolis,
MN
A
gas-phase molecular contamination filtration system supplies high-purity
air to IC process tools. The small-footprint Lithoguard-16 has chemical
filter inserts that can be configured to minimize contaminant breakthrough
and maximize overall media utilization. The system controls airborne
contamination, which increasingly degrades expensive optical elements
and adversely affects critical chemical processes. The chemical media
target acidic and basic gases and volatile organic compounds. The
media's removal capacity can be adjusted for each target depending
on actual process conditions. The company offers chemical-filter refurbishment
and used-filter analysis programs.
CMP
Monitor
Tekscan
Boston,
MA
A
monitoring device for chemical-mechanical planarization applications
provides rapid insight into the pressures applied during the polishing
process and supplies data directly to personal computers. The easy-to-use
I-Scan system measures the tactile force and pressure applied by a
polishing head on a wafer. When uneven pressures exist, tool adjustments
can be made, and then new measurements can be taken. The unit includes
interface hardware, software, and patented thin-film array sensors
that are minimally disruptive to the pressure pattern.
Day
Tanks
Edlon
Avondale,
PA
Secure
& Pure day tanks are used to store ultrapure, electronic-grade
chemicals used in semiconductor manufacturing. The tanks feature a
one-piece, 90-mil-thick removable Teflon PFA liner with a high-density
polyethylene outer shell (overpack) to eliminate possible metal-ion
contamination from the container. Other features include sidewall
cutouts for liquid-level monitoring, heat-exchanger coils, PFA-coated
mixer assemblies, spray bars, baffles, and flare-type fittings for
feed-line connections. In addition to day tanks, the Secure &
Pure line includes fluoropolymer coatings and glass-backed, bonded
fluoropolymer liners that satisfy the IC industry's purity requirements.
Coatings are fused directly to metal substrates. Bonded liners are
adhered using a proprietary bonding system.
Diamond
CMP Pad Conditioners
Abrasive
Technology
Lewis
Center, OH
An
extension of the Infinity line of diamond CMP pad conditioners, the
Infinity v6.1 disk offers the highest-strength synthetic diamond.
The conditioner's diamond concentration has been optimized to achieve
a bond strength improvement of more than 80% and a disk life improvement
of more than 60% over the standard Infinity product. The v6.1 pad
conditioner features the PBS process, which permanently bonds diamonds
to the stainless-steel substrate. That process delivers an excellent
combination of bond strength and diamond exposure to provide consistent
pad conditioning through the life of the disk. The pad conditioner
is available in production quantities and is manufactured in an ISO
9001:2000–certified facility.
Deposition
Bath Control System
ECI
Technology
East
Rutherford, NJ
The
Quali-Line QLC-8000 is an on-line control system for electroless deposition
baths used in VLSI interconnect cobalt capping applications. The system
has a special electrochemical/titrating two-cell design, which enables
prompt response times for all key components, including cobalt, copper,
hypophosphite, reducing/ complexing/buffering agents, pH adjuster,
and background ions. The system can also control copper and nickel
electroless deposition solutions. In addition, it can be upgraded
to perform spectroscopic measurements of tungstate, palladium, and
other metal concentrations.
3-D
Surface Analysis Instrument
Taylor
Hobson
Leicester,
UK
The
Talysurf CCI 3000A coherence correlation interferometer performs surface
analysis with 0.1-Å resolution. The instrument combines the
surface-imaging quality of a microscope with the high-accuracy measuring
capability of a surface profiler, resulting in precise 3-D surface
texture, step height, and microdimensional measurements. Used for
semiconductor and MEMS applications, the tool uses a patented correlation
algorithm to find the coherence peak position of an interference pattern
produced by selectable-bandwidth light sources. This method provides
high resolution and sensitivity to returning light. The instrument
provides excellent data resolution in the x and y axes and a low missing-data
rate.
Fab
Data Integration Package
Knights
Technology
Sunnyvale,
CA
A
hardware-independent software system that allows engineers to quickly
collect, correlate, analyze, and graphically display or report essential
fab data, YieldManager helps chipmakers achieve and maintain higher
yields. The system's automated analysis functionality provides engineers
with instant insight into significant sources of yield loss, enabling
them to improve productivity and reduce infrastructure costs. A variety
of add-ons are available. Data Explorer allows engineers to analyze
defect trends and perform advanced statistical analysis of defect
data. SpaR recognizes spatial patterns, grouping defects into signatures
that can then be classified into process events. LogicMap enables
the automatic overlay of logic device failure information at the signal
level, reducing translation times from weeks to hours.
The
WaferSense autoleveling sensor is a wireless waferlike device that
enables quick and accurate leveling of IC wafer processing and automation
equipment. Designed to be handled like a 150-, 200-, or 300-mm wafer,
the thin and lightweight sensor can be placed in cassettes or front-opening
unified pods, on end effectors or aligners, in loadlocks, and in process
chambers to ensure that stations are level and coplanar. The device
provides precise pitch-and-roll measurements—accurate to ±0.03°—that
can be logged to relate coplanarity with yield and determine optimal
tool adjustments.
The
Atlas advanced metrology system combines multiple metrology technologies
in one stand-alone unit. Providing a reduced cost of ownership and
high utilization rates, the tool can house up to five critical metrology
technologies at one time and performs metrology for wafer characterization
with excellent repeatability. It performs 200- and 300-mm wafer metrology
applications and can be configured with any combination of spectroscopic
reflectometer, spectroscopic ellipsometer, optical critical dimension,
diffraction-based overlay, and wafer stress/bow modules. The tool
features temperature control and robotics, including a dual-arm robot,
a high-precision stage, and high-speed focus system. It provides robust
pattern recognition, fine thickness reproducibility, and high throughput.
The
Liquozon Single ozonated-water (DIO3 water) delivery system
is the newest in a series of ultrapure ozonated water generators.
Designed to supply DIO3 water to single-wafer cleaning
tools, the compact and self-contained unit provides ultrapure DIO3
with a high and accurate ozone concentration at a constant delivery
pressure. The unit delivers DIO3 water with ozone concentrations
between 5 and 55 ppm at flow rates between 0.5 and 20 L/min and at
a pressure of up to 2.5 bar. The instrument, which measures 40 X 50
X 120 cm, contains an ozone-gas generator, an ozone contactor, a dissolved-ozone
analyzer, and an ozone-gas destruct unit.
Tantalum
sputtering targets are available for all leading physical vapor deposition
(PVD) systems. The tantalum material is offered with purity levels
ranging from 3N5 to 5N and a low oxygen content. The targets have
a small grain size and uniform metallurgy for high process consistency.
Assemblies feature a proprietary high-strength bond for maximum throughput.
The
AutoCal Dynamic Correction Engine performs control functions in photolithography
track systems. The system tunes multizone or multicontroller postexposure
bake (PEB) hot plates to provide a uniform thermal dose profile. It
automatically dials in the mean steady-state temperature and reduces
the overall temperature spread across the wafer. As a result, within-plate
thermal uniformities can be optimized. Plate-to-plate and track-to-track
matching of PEB plates can be achieved routinely, improving CD uniformity
in the fab. The system works in conjunction with BakeTemp sensor wafers
to obtain an accurate baseline picture of the process zone. It uploads
BakeTemp data along with an OEM plate-specific thermal model to derive
hot-plate control parameters and achieve thermal dose uniformity.
Based
on x-ray photoelectron spectroscopy, the RVX 1000 metrology system
is a small-footprint turnkey system that simultaneously performs multiple
automated measurements, including film-thickness and elemental concentration
measurements in film. The tool incorporates a configurable automation
system, allowing customers to choose the appropriate combination of
200- and 300-mm load ports to meet their needs. A Windows user interface
provides a wide range of measurement outputs, which can be used to
perform process control or generate reports quickly. The unit has
a >95% availability record. It meets industry safety and export
requirements and supports factory-required host communications protocols
for automated production facilities.
Based
on the Reflexion LK platform, the Reflexion LK Ecmp system performs
electrochemical mechanical planarization in copper/low-k applications
at the 65-nm node and beyond. The tool has three platens, enabling
it to remove bulk copper at the rate of >6000 Å per minute
by electric charge, independent of downforce. For use with fragile
low-k films, the tool planarizes dual-damascene structures with minimal
dishing, erosion, and defects (<0.1/cm2). It reduces
the cost of consumables, replacing expensive copper slurry with a
low-cost electrolyte chemistry. Thin, uniform copper film and barrier/liner
materials are removed using very low downforce (<1.0 psi). The
tool features key process control capabilities, including proprietary
integrated iMap radial scan technology, which provides incoming film-thickness
profile information to control the bulk copper removal profile and
endpoint detection.
The
IX-1100 excimer laser micromachining system features high-precision
air-bearing stages, a low and ergonomic structure, advanced excimer
lasers with soft preionization capability, integrated coordinated
opposing-motion mask-indexing air-bearing stages, new beam homogenizers
and imaging lenses, and other features. The compact, Class 1 workstation
machines complex shapes and patterns in a wide range of materials.
Beam homogenization and near-field imaging enable users to perform
several simultaneous micromachining processes. The tool's high pulse
repetition rate ensures rapid processing.
The
Pantheon atomic-layer deposition system is a configurable 200-/ 300-mm
tool for the 65-nm node and beyond. The system offers precise atomic-level
thickness control, low process temperature, and highly conformal coatings
with excellent film quality. The multichamber cluster tool is composed
of up to four process chambers connected to a central backbone hub.
Two dual-stage loadlocks act as an interface between the hub and a
self-contained atmospheric front end. Two loadport modules are attached
to the front end for material loading and unloading. Process modules
use showerhead injectors and ozone-based reactant for optimum process
performance. The unit performs high-k capacitor, high-k gate dielectric,
high-k interpoly, etch-stop/barrier layer, passivation, and other
applications.
Varafine
Varaclean filter cartridges reduce defects and improve productivity
in high-volume copper plating processes. The cartridges are based
on patented asymmetric membrane material, which filters impurities
down to 50 nm while maintaining high flow rates. For use in 200- and
300-mm copper electrochemical deposition tools, the cartridges are
available in a range of sizes and grades, all of which offer >99.9%
removal efficiency.
The
Pollux automated particle-detection system enables fabs to perform
complete inspection of all masks and reticles before they are used.
More cost-effective and reliable than performing visual inspection,
the system can be integrated into bare-reticle stockers, wafer steppers,
and cleaning stations. It can also function as a stand-alone unit.
The system inspects the glass side and pellicle side of the mask simultaneously
and can detect imperfections down to a 10-µm equivalent sphere
diameter. It detects particulate contamination and defects such as
glass scratches and holes in the pellicle. The small-footprint, high-speed
system enables fabs to make pass/fail decisions about photomasks.
Designed
to support 65-nm photolithography applications, the XLA 105 argon
fluoride (ArF) excimer light source is based on master oscillator
power amplifier dual-gas- discharge-chamber technology. Operating
at a 4-kHz repetition rate and delivering 40 W of output power, the
instrument provides full imaging capability for 200- and 300-mm lithography
scanners at a very tight bandwidth of ≤0.2 pm at full-width
half maximum and ≤0.50 pm at 95% energy integral. It enables
tools with high-numerical-aperture (NA) lens designs to expose the
most critical semiconductor features. Because of this high-spectral-bandwidth
performance, high-NA lens designs require fewer calcium fluoride elements.
The instrument also offers increased pulse duration of ≥70 nanoseconds,
helping to reduce peak fluence for increased scanner optics lifetime.
The
ALD-series valve is an ultra-high-purity, pneumatically actuated component
for use in atomic layer deposition (ALD) processes. To meet the stringent
demands of ALD applications, the valve features rapid valve actuation
speeds <5 milliseconds. It also achieves lifetime ratings >25
million cycles. The patent-pending flow-setting feature provides consistent
process-gas delivery. Manufactured from 316L VIM/VAR stainless steel,
the valve body is available with 1/4-in.
VCR and 1/4-in.
and 6-mm tube-butt-weld end connections. A high-temperature model,
rated for temperatures up to 200°C, is available. Additionally,
multiport, multivalve manifold, and modular surface-mount configurations
are available.
The
newest member of the Twinscan platform, the Twinscan XT:1400, is a
0.93-NA, 193-nm scanner that images at the 65-nm node in volume production
environments and can also be used for preproduction testing and development
at the 45-nm node. Its design will allow users to shift from dry to
immersion lithography on the fab floor through an immersion-conversion
kit that will be available at the end of 2005. The unit will enable
users to include immersion lithography in their technology roadmaps
while performing dry manufacturing at the 193-nm node. The immersion-conversion
kit has three main components: a lens that is suitable for immersion
use, immersion-compatible wafer stages, and immersion infrastructure.
Conversion from a dry to a wet platform will be achievable in weeks
and will increase system performance. The tool is equipped with Ultra-k1,
hardware and software imaging-enhancement technologies that make it
possible to shrink circuit features and achieve high die yields.
A
rotary actuator for contamination-sensitive applications, the Omni-Lev
is supported entirely by magnetic fields, eliminating contact between
moving parts that can generate particles. The actuator's noncontact
mechanism eliminates particles and friction, resulting in accurate
positioning, ultralow shaft runout, long life, and decreased maintenance
requirements. An all-metal construction enables the unit to be used
in ultra-high-vacuum environments and in the corrosive gas or liquid
applications encountered in semiconductor manufacturing processes.
Series
OG-5000 ozone generators produce high-purity ozone gas at very high
concentrations. The systems are used in chemical vapor deposition,
atomic-layer deposition, oxide growth, surface conditioning, ashing,
wet processing, particle cleaning, photoresist removal, and epitaxy
applications. Ozone gas is generated in the unit through controlled
electrical discharge. The addition of parts-per-million levels of
a doping or spiking gas increases ozone production, ensuring concentration
stability over time. The compact generators are available as stand-alone
systems or as a part of a complete turnkey integrated ozone gas or
DIO3 water-delivery system.
A
system for cleaning front-opening unified pods (FOUPs) reduces contamination
from human contact. The Process One FX30 cleaning system resides in
an individual cleanroom environment to prevent contamination and has
robotic controls that transport FOUPs through the cleaning process.
It helps semiconductor manufacturers to reduce overall operating costs
by offering high throughput, reliability, and low utility consumption.
The unit is designed to clean and dry the company's FOUPs and front-opening
shipping boxes (FOSBs). It isolates the cleaning media used inside
the FOUPs and FOSBs from the cleaning media used outside, preventing
cross-contamination.
Designed
to repair photolithography mask defects at the 65-nm node, the Accura
XT+ DualBeam mask-repair system combines a focused ion beam (FIB)
column and an environmental scanning electron microscope (ESEM) in
a single system. The tool can accommodate current photomasks and be
extended to next-generation technologies, including low-energy E-beam
proximity projection lithography/stencil, extreme ultraviolet reflective,
nanoimprint, chromeless phase lithography, and absorber stack masks.
The system contains the VisIONary FIB column, which provides a small
spot size and accurate beam placement for both imaging and repair.
Patented environmental SEM technology enables E-beam repair and high-resolution
E-beam imaging. The system also features an optical microscope for
mask navigation and global alignment.
The
TwinStep wet-process tool combines two process stations: a flow-optimized
immersion bath for circulation processing and an overflow processing
system. In contrast to manual benches, the system offers controlled
processing, from automated chemical mixing to processing to service
functions. A flexible tool architecture offers a broad range of configurations
that are suitable for photoresist strip, metal and oxide etch, and
cleaning processes. Optimized process baths for wafers of different
sizes help keep chemical consumption low. The unit's AeroSonic drying
technology can be enlarged to perform chemical treatment, rinsing,
and drying in one bath. The unit is for use in MEMS, gallium arsenide,
and other applications.
The
Performix equipment front-end module (EFEM) features an automated
self-teach wafer-handling robot, patented technology that enables
the EFEM to be installed and operated without extensive operator training.
The module minimizes initial system set-up time in the tool-manufacturing
environment and wafer fab during system startup. The combination of
the robot and an ADO load port and prealigner enables the module to
provide high throughput and extended uptime. The EFEM forms an isolated
minienvironment between a process or metrology tool and a FOUP or
SMIF wafer carrier. The module is available in two-, three-, or four-port
configurations. The use of a repeatable precision datum-mounting scheme
for all major EFEM components facilitates alignment during installation
and reassembly after servicing.
The
LaserMill benchtop Nd:YAG laser micromilling tool is for use in R&D,
prototyping, pilot-line development, and short-run production applications.
The system features switchable- wavelength operation for machining
a variety of organic and inorganic materials in MEMS, semiconductor,
and other devices. Applications range from passivation and polyimide
removal to lab-on-a-chip production. A flexible alternative to outsourcing,
the 18 X 30-in. tool fits on most workbenches. It is equipped with
100 X 100-mm stages, a high-magnification video microscope, and a
continuously variable, rotating x-y shutter that yields cut sizes
down to nearly 1.0 µm.
A
gas-phase molecular contamination filtration system supplies high-purity
air to IC process tools. The small-footprint Lithoguard-16 has chemical
filter inserts that can be configured to minimize contaminant breakthrough
and maximize overall media utilization. The system controls airborne
contamination, which increasingly degrades expensive optical elements
and adversely affects critical chemical processes. The chemical media
target acidic and basic gases and volatile organic compounds. The
media's removal capacity can be adjusted for each target depending
on actual process conditions. The company offers chemical-filter refurbishment
and used-filter analysis programs.
A
monitoring device for chemical-mechanical planarization applications
provides rapid insight into the pressures applied during the polishing
process and supplies data directly to personal computers. The easy-to-use
I-Scan system measures the tactile force and pressure applied by a
polishing head on a wafer. When uneven pressures exist, tool adjustments
can be made, and then new measurements can be taken. The unit includes
interface hardware, software, and patented thin-film array sensors
that are minimally disruptive to the pressure pattern.
Secure
& Pure day tanks are used to store ultrapure, electronic-grade
chemicals used in semiconductor manufacturing. The tanks feature a
one-piece, 90-mil-thick removable Teflon PFA liner with a high-density
polyethylene outer shell (overpack) to eliminate possible metal-ion
contamination from the container. Other features include sidewall
cutouts for liquid-level monitoring, heat-exchanger coils, PFA-coated
mixer assemblies, spray bars, baffles, and flare-type fittings for
feed-line connections. In addition to day tanks, the Secure &
Pure line includes fluoropolymer coatings and glass-backed, bonded
fluoropolymer liners that satisfy the IC industry's purity requirements.
Coatings are fused directly to metal substrates. Bonded liners are
adhered using a proprietary bonding system.
An
extension of the Infinity line of diamond CMP pad conditioners, the
Infinity v6.1 disk offers the highest-strength synthetic diamond.
The conditioner's diamond concentration has been optimized to achieve
a bond strength improvement of more than 80% and a disk life improvement
of more than 60% over the standard Infinity product. The v6.1 pad
conditioner features the PBS process, which permanently bonds diamonds
to the stainless-steel substrate. That process delivers an excellent
combination of bond strength and diamond exposure to provide consistent
pad conditioning through the life of the disk. The pad conditioner
is available in production quantities and is manufactured in an ISO
9001:2000–certified facility.
The
Quali-Line QLC-8000 is an on-line control system for electroless deposition
baths used in VLSI interconnect cobalt capping applications. The system
has a special electrochemical/titrating two-cell design, which enables
prompt response times for all key components, including cobalt, copper,
hypophosphite, reducing/ complexing/buffering agents, pH adjuster,
and background ions. The system can also control copper and nickel
electroless deposition solutions. In addition, it can be upgraded
to perform spectroscopic measurements of tungstate, palladium, and
other metal concentrations.
The
Talysurf CCI 3000A coherence correlation interferometer performs surface
analysis with 0.1-Å resolution. The instrument combines the
surface-imaging quality of a microscope with the high-accuracy measuring
capability of a surface profiler, resulting in precise 3-D surface
texture, step height, and microdimensional measurements. Used for
semiconductor and MEMS applications, the tool uses a patented correlation
algorithm to find the coherence peak position of an interference pattern
produced by selectable-bandwidth light sources. This method provides
high resolution and sensitivity to returning light. The instrument
provides excellent data resolution in the x and y axes and a low missing-data
rate.
A
hardware-independent software system that allows engineers to quickly
collect, correlate, analyze, and graphically display or report essential
fab data, YieldManager helps chipmakers achieve and maintain higher
yields. The system's automated analysis functionality provides engineers
with instant insight into significant sources of yield loss, enabling
them to improve productivity and reduce infrastructure costs. A variety
of add-ons are available. Data Explorer allows engineers to analyze
defect trends and perform advanced statistical analysis of defect
data. SpaR recognizes spatial patterns, grouping defects into signatures
that can then be classified into process events. LogicMap enables
the automatic overlay of logic device failure information at the signal
level, reducing translation times from weeks to hours.