MICRO: Prod Tech News

Photomask Repair System

FEI

Hillsboro, OR

Designed to repair photolithography mask defects at the 65-nm node, the Accura XT+ DualBeam mask-repair system combines a focused ion beam (FIB) column and an environmental scanning electron microscope (ESEM) in a single system. The tool can accommodate current photomasks and be extended to next-generation technologies, including low-energy E-beam proximity projection lithography/stencil, extreme ultraviolet reflective, nanoimprint, chromeless phase lithography, and absorber stack masks. The system contains the VisIONary FIB column, which provides a small spot size and accurate beam placement for both imaging and repair. Patented environmental SEM technology enables E-beam repair and high-resolution E-beam imaging. The system also features an optical microscope for mask navigation and global alignment. (Semicon Japan, 5A-506)

Gas-Flow Calibrator

Sierra Instruments

Monterey, CA

The Cal=Trak SL-500 primary standard gas-flow calibrator is a fast, mercury-free, and easy-to-use instrument that offers standardized accuracy of ±0.4% in a portable, low-maintenance unit. The instrument's dimensionally based primary accuracy is superior to pressure-based secondary methods. The field-rugged system is used in the manufacture, inspection, validation, and recalibration of mass-flow controllers, flowmeters, and many other varieties of flow equipment in the 5-std cm³/min to 50 std L/min range. Its broad turndown ratio allows three interchangeable flow cells to cover this range, minimizing initial investment and maintenance costs. The unit's modular nature enables users to begin with one flow cell and add others as resources allow. The calibration device provides primary NIST traceability, is manufactured under strict ISO 17025 certification, and is CE approved.

Ion Implanter

Varian Semiconductor Equipment

Gloucester, MA

The single-wafer VIISta 810XE ion implanter platform provides high overall throughput, precision doping capability, and excellent contamination control. The toolset offers an extended energy range to 900 keV, achieving high productivity for most well implant applications. All VIISta products feature the company's control system and positioning systems. In addition, they all have a common single-wafer end station. The entire toolset achieves good process matching, providing flexibility in managing capacity, product mix changes, spare parts use, and training.

Electron Probe Microanalyzer

JEOL USA

Peabody, MA

The fully automated, high-throughput JXA-8500F is an advanced electron probe microanalyzer (EPMA) for the analysis of magnetoresistive heads in the semiconductor industry. The system can simultaneously use up to five wavelength-dispersive x-ray spectrometers and an energy-dispersive x-ray spectrometer for combined quantitative and qualitative elemental analysis of submicron sample areas. The instrument has a Schottky-type field emission gun, which produces a pinpoint probe diameter one-half to one-tenth the size of conventional probes—as small as 40 nm (10 nA and 10 kV). It operates at low accelerating voltages of 1–30 kV over a wide range of probe currents, from 10 pA to 500 nA. The tool can analyze most elements. (Semicon Japan, 1A-510)

Thin-Film Deposition Controller

Inficon

East Syracuse, NY

The Cygnus thin-film deposition controller maximizes process capability and flexibility for organic light-emitting diode (OLED) applications in the production of flat-panel displays. The low-density materials and low deposition rates associated with OLED processes demand high accuracy and reliability from thin-film deposition controllers and sensors. The unit controls up to six materials independently, or in any combination, with a rate resolution of 0.01 Å/sec and a measurement resolution of 0.005 Å/measurement at 1.00 g/cm³ and 100% tooling. As substrates are cycled through the system, flexible deposition sequencing allows continuous rate control and saves production time by eliminating the need to reheat source material with every substrate. (Semicon Japan, 3B-607)

Aqueous Develop/Etch Tool

Steag HamaTech

Sternenfels, Germany

The ASP 5500, a single-substrate photomask processing tool, is designed especially for critical applications such as chemically amplified resist (CAR) developing, which demands defect-free manufacturing. The tool can be used in aqueous-based resist develop and etch applications as well as in resist-strip and preclean applications. It can be equipped to fully process 6-in., 250-mil binary and phase-shift masks, extreme ultraviolet mask substrates, masks and other special substrates up to 230 X 230 X 9 mm, and wafers up to 300 mm. The tool meets and exceeds SEMI S2-0302 and SEMI S8-0701 safety and ergonomic standards and the CE European harmonized standard.

Excimer Laser Micromachining

J. P. Sercel Associates (JPSA)

Hollis, NH

The IX-1100 excimer laser micromachining system features high-precision air-bearing stages, a low and ergonomic structure, advanced excimer lasers with soft preionization capability, integrated coordinated opposing-motion mask-indexing air-bearing stages, new beam homogenizers and imaging lenses, and other features. The compact, Class 1 workstation machines complex shapes and patterns in a wide range of materials. Beam homogenization and near-field imaging enable users to perform several simultaneous micromachining processes. The tool's high pulse repetition rate ensures rapid processing.

Sample-Preparation Platform

Sagitta

Hauppauge, NY

The Centar automated sample-preparation platform encompasses advanced analytical methods for failure analysis, yield enhancement, and product development in the semiconductor, data storage, and other industries. The platform is based on a patented polishing technology, which enables submicron cross-sectioning or the thinning of ICs or microcomponents. The one-stop system performs sample preparation methods, including scanning electron microscopy, transmission electron microscopy, and scanning capacitance microscopy. The fully automated platform offers 3-D exact angle control, computer-controlled polishing force, and incremental target analysis, resulting in horizontally true cross sections. Automated target acquisition, edge detection, and the on-line PolishEye module enable accuracy control down to 0.1 µm.

Stainless-Steel Gas Springs

Stabilus

Gastonia, NC

Suitable for use in semiconductor fabs, Lift-O-Mat INOX stainless-steel gas springs allow doors and lids to open and close effortlessly. The compact, maintenance-free springs hold doors or cabinets securely in an open or closed position. They are effective in vertical-hinge applications. Constructed from 316 stainless steel, they provide protection in corrosive environments. The nearly iron-free product has virtually no effect on magnetic fields. The gas springs offer speed-controlled dampening, cushioned end motion, simple mounting, a compact size, and a wide range of available forces.

Wireless Autoleveling Sensor

CyberOptics Semiconductor

Beaverton, OR

The WaferSense autoleveling sensor is a wireless waferlike device that enables quick and accurate leveling of IC wafer processing and automation equipment. Designed to be handled like a 150-, 200-, or 300-mm wafer, the thin and lightweight sensor can be placed in cassettes or front-end unified pods, on end effectors or aligners, in loadlocks, and in process chambers to ensure that stations are level and coplanar. The device provides precise pitch-and-roll measurements—accurate to ±0.03°—that can be logged to relate coplanarity with yield and determine the optimal tool adjustments for the best yields. (Semicon Japan, 4A-306)

Wireless Maskmaking Sensor

OnWafer Technologies

Dublin, CA

The MaskTemp SensorPlate wireless sensor on a plate enables photomask manufacturers to look inside their processes so that they can solve critical-dimension challenges and optimize their mask sets. The technology uses 64 sensors to measure temperature in a rich spatial format, accurately recording the thermal activity in the process zone on the plate's surface. The sensor on a plate uses mobile metrology technology, which performs nonintrusive measurements of critical process zones, ensuring that process tools are working properly and that the maskmaking process is in control. The product is available for plasma etch, resist, E-beam writing, scanning, and wet-processing steps. Its data-processing and collection module, sensors, and power plant are integrated into a standard 6 X 6 -in. mask blank.

Linear CD Source

Morgan Advanced Ceramics

Fairfield, NJ

The Diamonex linear CD source uses an existing 3.5-in. CD power supply, providing broad deposition coverage for substrate cleaning, etching, ion-assisted deposition (IAD), and direct-deposition applications. The CD source's CD path creates a surface working area that is more than three times larger than that of typical sources. The extended oval-area coverage (up to 12 in.) enables deposition, etching, coating, and IAD over a larger area in less time. The CD source operates for at least 170 hours in harsh, chemically reactive, or deposition environments. With no process gas restrictions, it is suitable for many processes.

FPD Measurement Tools

n&k

Santa Clara, CA

RT flat-panel-display measurement systems simultaneously measure reflectance and transmittance. The 1800-RT, 1720-RT, 1700-RT, and 1512-RT cover a wavelength range of 190 to 1000 nm in 1-nm intervals for both reflectance and transmittance measurements. The 1800-RT, 1720-RT, and 1700-RT units offer microspot technology and pattern recognition. The 1512-RT is a lower-cost system that can measure and characterize blanket films and trench structures on transparent substrates. The systems' maximum sample sizes are 1000 X 750 mm for the 1800-RT, 400 X 500 mm for the 1720-RT, and 300 X 300 mm for both the 1700-RT and the 512-RT.

Mask Metrology System

Nanometrics

Milpitas, CA

Combining multiple metrology technologies, the Atlas-M mask metrology tool provides full characterization of masks and reticles for linewidth, etch depth, overhang, height, and profile measurements. The platform also provides the metrology technologies necessary for complete film analysis, including phase-shifting layers. The tool is available with any combination of spectroscopic ellipsometry, spectroscopic reflectometry, and normal-incidence spectroscopic ellipsometry modules. It features closed-loop temperature control, mask-handling robotics, and staging for 150 X 150-mm substrates. It offers robust pattern recognition, good thickness and CD reproducibility, and high throughput. (Semicon Japan, 9B-126)

TEM Sample Extraction

Ascend Instruments

Beaverton, OR

Extreme Magic, a technique for enhanced transmission electron microscopy (TEM) sample extraction, eliminates many difficult steps from focused ion beam (FIB)–based TEM sample preparation. The approach works with the Extreme Access nanomanipulator and offers a fast, reliable method for preparing the site-specific, ultrathin (<100-nm) samples needed for atomic-resolution TEM analysis. The system uses a patent-pending nanoengineered end effector to extract relatively thick samples. After extraction, the nanomanipulator can be used to position the sample for final FIB thinning or scanning TEM evaluations away from the bulk sample, providing visual insight into the quality of the sample and avoiding the risk of contaminating the sample with redeposited bulk material.

High-Precision Gantry

Anorad

Shirley, NY

The latest generation of the High Precision Gantry line features a modular construction, offering high design flexibility. Each axis of the unit can be ordered with either iron-core or ironless (zero-cogging) linear servomotors. In addition, both motor types are available in two coil lengths to suit applications' power requirements. The lower (y) axis can be specified with either single-or dual-motor actuation to optimize throughput. All motor options make the unit highly configurable and capable of meeting high-accuracy x-y automation needs. Its many motor options enable designers to satisfy a broad range of gantry applications, including high-speed point-to-point motion and step-and-scan applications.