Tegal has been awarded U.S. patents No. 6,689,220 and 6,756,318, which enable nanolayer deposition (NLD) of conformal thin films for barrier, copper seed, and high-k dielectric applications in advanced microprocessor and memory-device production. The systems and methods described in the patents enable nanolayer deposition with an ultraconformality comparable to that of atomic layer deposition (ALD) and with the manufacturing throughput of conventional chemical vapor deposition systems. NLD allows manufacturers to choose from a wide field of deposition precursors (a key limitation of ALD) to apply thin films onto the surface of a wafer with atomic layer precision. The technology can also be used to construct complex compound film structures with a high level of control and conformality. Information: www.tegal.com.

A Shimadzu brochure spotlights custom-configured high-performance liquid chromatography (HPLC) front ends for mass spectrometry. Users can select from a variety of precise, reliable, and customizable modular VP-series components or choose turnkey systems to meet specific requirements. Modular component options include six autosamplers, including the SIL-HT; six pumps that deliver pulse-free flows from 1 µl/min to 150ml/min; and nine detectors, including the ELSD-LT, a rugged and economical low-temperature evaporative-light-scattering detector. Single-point control is available for all components. The company offers a 2-D capillary-to-microflow HPLC that performs automated on-line proteomics R&D and a high-speed multiplexed HPLC that offers parallel-gradient analysis on up to four columns. Information: www.ssi.shimadzu.com.

A high-resolution module from Rudolph Technologies can be integrated into chemical-mechanical planarization (CMP) tools to provide high-throughput, automated inspection for defects 5 µm and larger. The new member of the i-MOD family inspects the entire front surface of 300-mm wafers, which is critical to manufacturers who are shifting to copper and low-k dielectric materials at the 90-nm node and below. When integrated into a CMP tool, the module provides rapid detection and classification of defects, enabling fast and efficient rework decisions, process-excursion resolution, and fast process ramp or tool requalification. The module is part of the WaferView line, which offers 100% real-time automated inspection of every wafer at each critical process step. Information: www.rudolphtech.com.

Silicon Skunkworks has been granted U.S. patent No. 6,632,261 for a silane flash arrestor. The RB3S is a passive device that can be placed in-line on operating SiH₄ lines. If a breach occurs in the line either upstream or downstream of the device, the device stops the reaction and protects equipment. The RB3S acts as a double-isolation valve and a gas filter. It does not require power to stop a silane reaction because it is activated by the shock wave and pressure differential created by the line breach. It uses filter media to lower the temperature of the reaction, slowing it enough so that the valve can be closed. Information: 503/209-1064.