The rapid atomic layer deposition (RAD) process module from Genus boosts ALD deposition rates to ~100 Å/min, more than five times that of conventional ALD. The new ALD chamber on the StrataGem platform reduces precursor exposure time at the wafer surface and uses purge steps as short as 0.2 seconds, delivering a mass-transport-dependent reaction with linear growth using trimethylaluminum and water ALD chemistry. The module’s stoichiometric films have excellent electrical characteristics with good conformality and uniformity. The module addreses the need for thicker conformal films (up to 500 Å) in semiconductors. Information: www.genus.com. (Semicon West, S.F., South Hall, Booth 2401)

ILS Technology’s eCentre Hosted allows fabs and OEMs to rent the use of an e-diagnostics application suite on a tool-by-tool basis. The main hardware and software framework is located in a secure hosting hub. The hub connects to scribing fabs and OEMs with a minimal on-site support framework. Using the latest version of eCentre, the system includes Flexible Security Wrapper, which improves e-diagnostics security from a “connection approved” to a “connection and context approved” format, and Data Collection Plan Manager (DCPM), which can change data collection plans dynamically. The company has hubs in the United States and Europe and plans to add one in Asia. Information: www.ilstechnology.com.

SurfaceWave technology from Philips Advanced Metrology has been shown to provide rapid on-line measurement of copper overburden thickness to new-generation platers. With the new metrology function, plating characteristics can be adjusted to compensate for changes in patterns and structures. The technology can measure copper thickness in a small spot on a patterned wafer, allowing IC manufacturers to optimize process conditions and keep them under control. It is well suited for the copper overburden application because it provides noncontact and nondestructive measurements of the thickness and uniformity of copper and low-k dielectric features. It can also measure associated metals such as tungsten, tantalum, and tantalum nitride on SiO2 and low-k dielectrics. Information: www.ams.philips.com. (Semicon West, S.F., South Hall, Booth 1516)

Wafer Foundry Services has opened an Internet-based wafer foundry services marketplace. The technical and business-oriented electronic marketplace gives semiconductor companies a single Web location that can evaluate the offereings from many wafer foundries to support their unique needs. Using the site, customers can issue one request for quote to many vendors simultaneously, simplifying the process of finding a manufacturing partner. The Web site has three charter member foundry partners: 1st Silicon, with manufacturing facilities in Malaysia; ZMD Foundry Division, with facilities in Germany; and Tower Semiconductor, with facilities in Israel. Information: www.waferquote.com.

EpiTUNE II in situ metrology systems, based on Luxtron’s Ripple technology, are being shipped on Aixtron MOCVD reactors. The system is a standard feature on all Aixtron Planetary Reactors for production of gallium nitride (GaN)–based optical devices. It provides precise control of challenging processes such as GaN-based blue lasers, LEDs, and laser diodes. In addition to measuring true surface temperature, the real-time monitoring tool provides simultaneous reflectivity measurements of film-growth characteristics. Ripple technology offers good precision in temperature measurements over a range of 400° to 1600°C, making the EpiTUNE II suitable for GaN, gallium arsenide, indium phosphide, and other III-V applications. Information: luxtron.com, www.aixtron.com. (Semicon West, S.F., South Hall, Booths 1101, 2103)

A six-page, full-color flow switch guide from Fluid Components International is a quick reference tool on switch applications and products for use in gas, liquid, and slurry environments. With a sensor design that has no moving parts and no orifices to plug or foul, the switches offer accurate, low-maintenance measurement over a wide range. Their fully temperature-compensated sensor design ensures long-term drift-free measurement and correct, repeatable switch actuation. Switch output selections include single relay, dual relays, open collector, and/or linearized analog.