In
related news, FSA has released its Handbook to Asia-Pacific Expansion:
A Focus on Mainland China. The association says it developed the
book to help members and other chip companies through the process of
establishing business operations in mainland China. Documents contained
in the publication include first-hand case studies from businesses with
Chinese facilities, a white paper on the Chinese semiconductor industry,
and profiles of Asian integrated-device manufacturers and fabless companies.
The handbook will be updated periodically and is available at www.fsa.org.
Novellus,
Fudan U. partner
Fudan
University and Novellus Systems have signed a partnership agreement
to establish a semiconductor manufacturing technology facility. Called
the Fudan-Novellus Interconnect Research Center, the Shanghai site will
be equipped with a full suite of Novellus's copper tools. It will serve
as a regional hub for copper interconnect technology research for university
researchers and students, in addition to the equipment company's regional
customers. Novellus says it will donate PECVD intermetal dielectric,
copper CMP, and PVD barrier/seed systems, as well as a copper electrochemical
deposition tool.
Fudan
University will create a state-of-the-art collaboration facility to
house the equipment and will also be responsible for staffing and maintaining
the site. Although the center will initially be located on the university's
Handan Road campus, it will be relocated to its Zhangjiang campus in
the heart of Shanghai Pudong's chip manufacturing district.
"Fudan's
reputation as a leading incubator of China's new-generation technologists,
along with its proximity to the region's semiconductor manufacturers,
were the deciding factors in our choice of partner for this significant
endeavor," says Chien Chiang, Novellus's vp of R&D. Commenting on
the partnership, university president Wang Shenghong notes that "the
four donated systems for IC interconnect and deposition technology research
will play a very important role in bolstering Fudan University's microelectronics
talent, cultivating technological expertise, and inspiring industry
cooperation."
Air
Prods, SinoMOS ink deal
Air
Products and SinoMOS Semiconductor have signed a 15-year on-site supply
contract for clean dry air (CDA) and bulk gases for the Chinese chip
company's new 150-mm fab in the Ningbo Free Trade Zone, south of Shanghai.
Air Products will supply a CDA system, 20 high-purity nitrogen generators,
and various bulk-gas delivery systems to the site. An in-fab gas distribution
contractor at SinoMOS placed a separate order for 31 gas cabinets and
racks with San Fu Gases, a Taiwanese company in which Air Products has
a 70% interest. Korea-based Han Yang Technology, another Air Products–controlled
firm, will manufacture the gas-handling equipment for the job.
Trebor
grows in Japan
Trebor
will get increased field service and customer support for its DI-water-heater
lines in Japan as a result of a distribution agreement signed with SC
Semicon Technology, a division of Sumitomo. Trebor, a Salt Lake City–based
unit of IDEX specializing in high-purity fluid-handling products, says
that by joining forces with SC Semicon, it has positioned itself strategically
to better respond to the growing demands of the Asian semiconductor
market. In addition to representing companies such as Strasbaugh, Temescal,
OnWafer Technologies, and Hypernex, SC Semicon is one of the leading
Japanese suppliers of CMP systems.
Europe
Wacker
consolidates, ramps
Silicon
wafer supplier Wacker Siltronic will be shuttering 200-mm production
at two German plants, while ramping 300-mm capacity at another. The
200-mm facilities in Wasserburg and Burghausen will be closed, as the
company consolidates and maximizes its existing 200-mm production in
Singapore; Hikari, Japan; and Portland, OR. The company says the moves
will affect about 350 workers at Wasserburg and 260 in Burghausen, many
of which will be offered jobs at Wacker's 300-mm plant under construction
in Freiberg. The silicon supplier is investing more than €400 million
in the new factory, which is scheduled to start production in 2004.
Wacker already has 300-mm wafer-making capacity in place at its Hikari
and Burghausen sites.