The
Pro family of plasma etch and deposition tools is compatible
with advanced silicon etch technology, which achieves the anisotropic
deep-etched structures in silicon needed to make MEMS devices
such as accelerometers; gyroscopes; precision spectrophotometer
slits; and microactuator, micromotor, and microturbine components.
The family consists of the MultiplexPro single-wafer
or batch plasma etch or deposition system for R&D applications,
which has a vacuum loadlock and one etch or deposition source;
the MACSPro for pilot production, a cassette-to-cassette
upgrade to the MulitplexPro for loadlocked systems;
and the ASPECTPro for fully automated volume manufacturing,
a dedicated, cassette-to-cassette cluster platform. The systems
have deep silicon etch rates of up to 20 µm/min, uniformities
of ±3%, and deposition rates of boro phosphosilicate cladding
layers for planar optical waveguides increased by 3.5X to 0.8
µm/min.
Gas-Line
Heater Syste
Watlow
St.
Louis, MO
The
Stretch-To-Length gas-line heater system allows engineers to
customize the thermal profile for any gas-line application.
Superior to heat tape, the system reduces the potential for
hot and cold spots on gas lines. With its preformed construction,
it can be wrapped around the delivery line with consistent heater/gas-line
contact, for improved temperature uniformity. Because it is
flexible, it can compensate for components of varying sizes.
The easy-to-install, two-part system fits on most gas-line configurations.
It includes a 2-W/sq in. heater and silicone rubber foam insulation.
With a maximum operating temperature of 200°C, the heater
system can be used for gas lines that deliver boron trichloride,
chlorine trifluoride, dichlorosilane, tetraethylortho-silicate,
and tungsten hexafluoride. It can also be used for process-gas-line
qualification. (Semicon Taiwan)
Supercritical
CO2 Chamber
Micell
Integrated Systems
Raleigh,
NC
BOC
Edwards
Wilmington,
MA
The
DFP 200 dense-fluid processor is a fully integrated, 200-mm
single-wafer chamber that enables the development and evaluation
of technologies for deposition, cleaning, conditioning, and
lithography applications using supercritical CO2.
The vacuum-compatible system can be integrated with vacuum-based
processes on a single cluster tool. Supercritical CO2
processing offers an enabling baseline technology to deal with
the variety of materials required to reach small interconnect
structures. The low viscosity and surface tension of the CO2
solvent promotes efficient cleaning of small features sizes.
It also has a lower environmental impact than other cleaning
methodologies. Also available are components to enable supercritical
CO2 processes, including specialized feed systems,
CO2 recovery systems, and proprietary chemistries.
(Semicon Taiwan)
Trench
Measurement Tool
n&k
Technology
Santa
Clara, CA
The
3300TMSX trench measurement system for dual-damascene applications
measures both via and trench depth. The tool tracks across-wafer
trench depth variation, providing users with critical uniformity
information. It can also determine barrier and seed layer thicknesses
for <1000-Å films. Capable of measuring a wider range
of structures than other optical metrology systems, the tool
incorporates hybrid rigorous coupled wave analysis software,
which enables the measurement of trenches with pitches <0.5
µm and >1.0 µm. Furthermore, the tool can determine
the depth and profile of trenches with pitches <1.0 µm.
Because it is sensitive to small changes in sample conditions,
the tool can monitor drift in etch processes. On product wafers,
across-wafer uniformity measurements are typically made in less
than 1 minute.
Integrated
Metrology Platform
Newport
Irvine,
CA
The
ISM300 is a compact, integrated x-y-theta positioning platform
for fast and accurate measurements in 300-mm wafer metrology,
thin-film, overlay metrology, and patterned and unpatterned
wafer characterization applications. Featuring a three-plate
design and direct-drive rotation, the tool achieves total surface
access on 300-mm wafers while maintaining a constant orientation
of the patterned elements on the wafer relative to the measurement
optics. The system uses high-precision recirculating ball bearings
offering low noise, long life, and durability under high-speed
cycling. Each linear axis is driven by efficient linear motors
mounted in a stiff aluminum housing. Linear scale encoders produce
position feedback for each axis, providing high bi-directional
repeatability and linear accuracy. The platform has resolutions
down to 0.1 µm in x-y and 0.0001° in theta.
Control
Technology
CyboSoft
Rancho
Cordova, CA
Model-Free
Adaptive (MFA) control technology provides adaptive and robust
control on complex systems. The technology does not require
process models that are difficult to develop and maintain. MFA
can be used for in situ, run-to-run feedback control of single
and multivariable systems, including chemical-mechanical planarization
and rapid thermal processing. The technology complements recipes
and simplifies tool conditioning and calibration. It can be
easily embedded into OEM equipment, and once it is installed,
no manual tuning is required. The control system can improve
yields, reduce scrap, increase product quality, and make the
manufacturing environment more flexible.
Transfer
Station
Tru-Si
Technologies
Sunnyvale,
CA
The
NoTouch transfer station enables the automatic loading and unloading
of wafers. For use with cassettes and wafer stacking pods, the
fully integrated robotic end-effector handles flexible ultrathin
or rigid full-thickness wafers without physical contact. Silicon,
gallium arsenide, indium phosphide, and other fragile materials
and extremely uneven surfaces such as bumped or dirty wafers
can be handled in the same unit. Size-change kits are available
for 100-, 125-, 150-, 200-, and 300-mm wafers. The station is
configured with an input position, an output position, and a
pod for storage of separators. The end-effector can handle wafers
in a cassette, cross-slotted wafers, wafers in a pod, separators
in a pod, and foam in a pod. It is compatible with cassettes
or pods from multiple vendors.
300-mm
Copper Electroplating Tool
Applied
Materials
Santa
Clara, CA
An
electrochemical plating system for use at the 65-nm node and
beyond, the 300-mm SlimCell relies on an individual-cell chemistry
that enables multistep electroplating. Rather than employing
a common chemical bath for multiple plating cells, the tool
provides individual chemical baths to each small-volume plating
cell, allowing chipmakers to use different chemicals in each
cell. Multistep capability optimizes the gap-fill and planarization
performance of the plating sequence. The system's chemical cost
per wafer is at least two times lower than that of other systems.
The tool also features postplating technologies for integrated
bevel cleaning and spin-rinse-dry and annealing components.
Pressure
Transducer
Setra
Systems
Boxborough,
MA
The
Model 528 transducer is designed for robust industrial and submersible
applications in extreme environments. With <0.2% drift per
year, the unit has a chemical vapor deposition strain-gauge
design that resists aging and is virtually insensitive to thermal
transients and pressure cycling. The modular component is offered
with a variety of pressure and electrical connections. All wetted
parts are constructed of corrosion-resistant 17-4 PH stainless
steel, making the unit suitable for use with corrosive media.
It offers 0.1% FS accuracy, a compensated temperature range
of –20° to 212°F, and an output choice of 0–5,
0–10, 1–5, 1–6, or 1–11 V dc, or 4–20
mA. The transducer is available in pressure ranges from –14.7
to 6000 psi. Compound and absolute ranges are available from
15 to 300 psi.
Metrology
Unit
Philips
Advanced Metrology Systems
Natick,
MA
The
3300 metrology unit uses third-generation SurfaceWave optical
technology to perform noncontact, nondestructive measurements
of the thickness and uniformity of blanket and patterned metal
and low-k dielectric films, providing critical information for
the control of copper/low-k processes. The new-generation laser-based
production tool has been optically enhanced to produce a smaller
spot size than earlier versions and much smaller measurement
penetration depth for enhanced accuracy. For use in PVD and
CVD barrier/seed layer applications, plating, CMP, and tungsten
vias, the 200- and 300-mm tool has dual loadports configurable
for FOUPs, SMIFs, FOUP and SMIF bridge tools, and open cassettes.
It can examine up to 75 wafers per hour or 55 wafers per hour
with nine-site pattern recognition.
Ion
Implanters
Varian
Semiconductor Equipment
Gloucester,
MA
Three
new ion implanters are available in the single-wafer VIISta
platform. All three tools—the high-current 80HP, the medium-current
810EHP, and the high-energy 3000HP—have a throughput of
>300 wafers/hr. The 80HP ion implanter's dual-magnet, broad-beam
architecture provides a deceleration mode configuration and
high process control for ultrashallow-junction applications.
The 810EHP increases the capabilities of the previous-generation
810 medium-current tool. The 3000HP's high-vacuum conductance
end station and beam filter provide high effective productivity
without compromising dose accuracy and energy purity. All systems
feature the company's control and positioning systems and a
common single-wafer end station.
Cross-Sectional
Analysis
Seiko
Instruments
Chiba,
Japan
JEOL
Akishima,
Japan
A
high-throughput instrument for preparing cross-sectional samples
and imaging sub-90-nm feature sizes at high resolution can be
used for process integration support of advanced development
of 200- and 300-mm manufacturing. Combining the Seiko SMI2000MS-series
focused ion beam (FIB) tool and the JEOL JEM-2500SE scanning
transmission electron microscope (STEM), the instrument prepares
test samples accurately and quickly. The FIB prepares and finalizes
multipoint specimens nondestructively at specified locations
without operator intervention. Using a gallium ion beam, it
converts the specified cross-section area into a 100-nm layer.
After sample preparation, the cross-sectional layers are transferred
to the STEM, which produces ultra-high-resolution, 0.2-nm images.
The STEM's compact footprint and ergonomic design make it suitable
for the semiconductor fab. (Semicon Taiwan)
Handheld
Particle Counter
Lighthouse
Worldwide Solutions
Milpitas,
CA
With
0.2-µm sensitivity, the Handheld 2016 particle counter
detects and verifies particle sources. It displays six channels
of particle data in cumulative or differential mode and also
displays temperature and relative-humidity data. It has a 2.83-L/min
flow rate and a large memory for storing up to 3000 records.
Data can be easily downloaded to a computer. A user-removable
lithium ion battery makes portable use convenient. The unit
can also become a part of a larger facility monitoring system.
(Semicon Taiwan)
Antivirus
Software
Global
Hauri
San
Jose, CA
Antivirus
software kills and repairs most viruses without interruption
rather than merely quarantining them. ViRobot For Industrial
Systems is an antivirus management program that protects data
in complex, segmented chip manufacturing environments. Although
the typical fab isolates network connections from normal IT
infrastructure, minor network connections are used for yield
management or data flow purposes. Portable computer connections
to the tools for calibration, tool installation, maintenance,
or e-diagnostics purposes require the use of diskettes or CDs,
which can transmit viruses into the fab. The antivirus software
does not require rebooting for updating the signatures of new
viruses. It runs on minimal system resources and features an
extendable feature for updating the software off-line.
Flowmeters
Asahi/America
Malden,
MA
EMT-series
4K flowmeters for use in the semiconductor industry are a low-cost
alternative to expensive PFA rotor meters. Accurate and reliable,
the flowmeters feature a variablearea design for measuring flow
rates in a variety of liquid applications. They are offered
in 1/4-
and 1/2-in.
models and are constructed from durable, corrosion-resistant
PPN, PVDF, and PFA thermoplastic materials. They are equipped
with a needle valve for fine-tuning. Specialized flow tubes
can be accommodated on request to suit specific needs. Various
end connections are also available.
Quiet
Ball Screws
Steinmeyer
Bedford,
MA
An
expanded line of quiet ball screw products are available in
diameters ranging from 5 to 20 mm. The 24xx-series ball screws
are available in 11 sizes: 5 X 2, 8 X 2, 10 X 4, 12 X 5, 12
X 10, 16 X 10, 16 X 16, 16 X 20, 16 X 30, 16 X 32, and 20 X
10. The precision ball screws are virtually noiseless because
instead of metal tubes, the nut uses end-cap ball returns manufactured
from plastic. The ball screws are available with or without
backlash. A choice of two accuracy grades, T5 (ground thread,
Series 2426) and T7 (rolled thread, Series 2446), are available.
Combination wipers, consisting of labyrinth seals and felt wipers,
are standard. The felt, saturated with oil or liquid grease,
enables long-term lubrica- tion and excellent wiping action.
For pitches >5 mm, the ball screws use a dual start-thread
profile, which provides higher load carrying capacity than single
start screws.
Microstructure
Monitoring
HyperNex
State
College, PA
An
automated 300-mm inspection tool, the AutoTex uses an advanced
2-D detector and novel analysis protocols. The protocols enable
the high-speed monitoring of quantitative microstructure properties
such as crystallographic phase and grain orientation, allowing
the instrument to operate as a true production metrology tool.
The system performs rapid crystallographic analysis of device
crystalline materials, including copper, aluminum, tantalum,
tantalum nitride, titanium, titanium nitride, tungsten, cobalt,
CoSi2, TiS2, and other materials. It provides
outputs of numerical maps, 2-D and 3-D color contour maps, trend
charts, scalable vector graphic plots, and ASCE tables. User
control of spatial resolution on the wafer surface ranges from
1 mm to 35 µm X 26 µm for smaller test structures.
The tool has two operational modes: an automated mode with pattern
recognition for fab quality control and trend charting, and
an interactive mode for development work.
Wafer
Cassette Transfer Carts
Eagle
MHC
Clayton,
DE
Carts
for transporting wafer cassettes or work in process optimize
maneuverability in restricted-space critical environments. Designed
for Class 10 to Class 1 cleanrooms, the carts are more cost-effective
and efficient than heavier, bulkier ones. They feature a specially
designed wafer cassette shelf to hold wafers securely and offer
superior laminar flow. The shelf is 40 in. from the floor; an
adjustable-height push handle provides ergonomic and user-friendly
operation. Softie plate casters dampen vibrations without the
black rubber and tread associated with traditional pneumatic
casters. A variety of cart configurations and sizes are available.
Remote
Plasma Source
Advanced
Energy Industries
Fort
Collins, CO
A
remote plasma source platform mounted outside the process chamber
generates active, neutral chemical species from stable feed
gases for surface modification, chamber cleaning, thin-film
etch, and plasma-assisted deposition. The Xstream platform integrates
a remote plasma source, a 6- or 8-kW high-efficiency power supply,
and a solid-state active matching network, which accommodates
a wide impedance operating range. The platform offers users
high flexibility in their reactive gas processes, improving
system throughput and optimizing the use of expensive resources.
Overlay
Measurement System
Nikon
SITECH Group
Tempe,
AZ
The
NRM-3100, a new-generation version of the 3000-series overlay
measurement platform, is designed to accommodate the 90-nm lithography
node and beyond. The instrument measures lithographic exposure
overlay precision with respect to the previous exposure layer.
It delivers subnanometer precision on overlay metrology with
enough bandwidth to meet the demands of the upcoming 70-nm node.
The tool's improved camera and image processing capabilities
increase move-and-measure time to better than 1.3 seconds, providing
high throughput of >150 wafers/hr. In addition to using wavefront
aberration testing to 0.0036 λ rms, the company has determined
the higher-order Zernike polynomials, minimizing lens aberration.
The platform uses an active vibration-absorption stage and stage
control system that significantly reduce stage-positioning time.
The
Pro family of plasma etch and deposition tools is compatible
with advanced silicon etch technology, which achieves the anisotropic
deep-etched structures in silicon needed to make MEMS devices
such as accelerometers; gyroscopes; precision spectrophotometer
slits; and microactuator, micromotor, and microturbine components.
The family consists of the MultiplexPro single-wafer
or batch plasma etch or deposition system for R&D applications,
which has a vacuum loadlock and one etch or deposition source;
the MACSPro for pilot production, a cassette-to-cassette
upgrade to the MulitplexPro for loadlocked systems;
and the ASPECTPro for fully automated volume manufacturing,
a dedicated, cassette-to-cassette cluster platform. The systems
have deep silicon etch rates of up to 20 µm/min, uniformities
of ±3%, and deposition rates of boro phosphosilicate cladding
layers for planar optical waveguides increased by 3.5X to 0.8
µm/min.
The
Stretch-To-Length gas-line heater system allows engineers to
customize the thermal profile for any gas-line application.
Superior to heat tape, the system reduces the potential for
hot and cold spots on gas lines. With its preformed construction,
it can be wrapped around the delivery line with consistent heater/gas-line
contact, for improved temperature uniformity. Because it is
flexible, it can compensate for components of varying sizes.
The easy-to-install, two-part system fits on most gas-line configurations.
It includes a 2-W/sq in. heater and silicone rubber foam insulation.
With a maximum operating temperature of 200°C, the heater
system can be used for gas lines that deliver boron trichloride,
chlorine trifluoride, dichlorosilane, tetraethylortho-silicate,
and tungsten hexafluoride. It can also be used for process-gas-line
qualification. (Semicon Taiwan)
Supercritical
CO2 Chamber
The
3300TMSX trench measurement system for dual-damascene applications
measures both via and trench depth. The tool tracks across-wafer
trench depth variation, providing users with critical uniformity
information. It can also determine barrier and seed layer thicknesses
for <1000-Å films. Capable of measuring a wider range
of structures than other optical metrology systems, the tool
incorporates hybrid rigorous coupled wave analysis software,
which enables the measurement of trenches with pitches <0.5
µm and >1.0 µm. Furthermore, the tool can determine
the depth and profile of trenches with pitches <1.0 µm.
Because it is sensitive to small changes in sample conditions,
the tool can monitor drift in etch processes. On product wafers,
across-wafer uniformity measurements are typically made in less
than 1 minute.
The
ISM300 is a compact, integrated x-y-theta positioning platform
for fast and accurate measurements in 300-mm wafer metrology,
thin-film, overlay metrology, and patterned and unpatterned
wafer characterization applications. Featuring a three-plate
design and direct-drive rotation, the tool achieves total surface
access on 300-mm wafers while maintaining a constant orientation
of the patterned elements on the wafer relative to the measurement
optics. The system uses high-precision recirculating ball bearings
offering low noise, long life, and durability under high-speed
cycling. Each linear axis is driven by efficient linear motors
mounted in a stiff aluminum housing. Linear scale encoders produce
position feedback for each axis, providing high bi-directional
repeatability and linear accuracy. The platform has resolutions
down to 0.1 µm in x-y and 0.0001° in theta.
Model-Free
Adaptive (MFA) control technology provides adaptive and robust
control on complex systems. The technology does not require
process models that are difficult to develop and maintain. MFA
can be used for in situ, run-to-run feedback control of single
and multivariable systems, including chemical-mechanical planarization
and rapid thermal processing. The technology complements recipes
and simplifies tool conditioning and calibration. It can be
easily embedded into OEM equipment, and once it is installed,
no manual tuning is required. The control system can improve
yields, reduce scrap, increase product quality, and make the
manufacturing environment more flexible.
The
NoTouch transfer station enables the automatic loading and unloading
of wafers. For use with cassettes and wafer stacking pods, the
fully integrated robotic end-effector handles flexible ultrathin
or rigid full-thickness wafers without physical contact. Silicon,
gallium arsenide, indium phosphide, and other fragile materials
and extremely uneven surfaces such as bumped or dirty wafers
can be handled in the same unit. Size-change kits are available
for 100-, 125-, 150-, 200-, and 300-mm wafers. The station is
configured with an input position, an output position, and a
pod for storage of separators. The end-effector can handle wafers
in a cassette, cross-slotted wafers, wafers in a pod, separators
in a pod, and foam in a pod. It is compatible with cassettes
or pods from multiple vendors.
An
electrochemical plating system for use at the 65-nm node and
beyond, the 300-mm SlimCell relies on an individual-cell chemistry
that enables multistep electroplating. Rather than employing
a common chemical bath for multiple plating cells, the tool
provides individual chemical baths to each small-volume plating
cell, allowing chipmakers to use different chemicals in each
cell. Multistep capability optimizes the gap-fill and planarization
performance of the plating sequence. The system's chemical cost
per wafer is at least two times lower than that of other systems.
The tool also features postplating technologies for integrated
bevel cleaning and spin-rinse-dry and annealing components.
The
Model 528 transducer is designed for robust industrial and submersible
applications in extreme environments. With <0.2% drift per
year, the unit has a chemical vapor deposition strain-gauge
design that resists aging and is virtually insensitive to thermal
transients and pressure cycling. The modular component is offered
with a variety of pressure and electrical connections. All wetted
parts are constructed of corrosion-resistant 17-4 PH stainless
steel, making the unit suitable for use with corrosive media.
It offers 0.1% FS accuracy, a compensated temperature range
of –20° to 212°F, and an output choice of 0–5,
0–10, 1–5, 1–6, or 1–11 V dc, or 4–20
mA. The transducer is available in pressure ranges from –14.7
to 6000 psi. Compound and absolute ranges are available from
15 to 300 psi.
The
3300 metrology unit uses third-generation SurfaceWave optical
technology to perform noncontact, nondestructive measurements
of the thickness and uniformity of blanket and patterned metal
and low-k dielectric films, providing critical information for
the control of copper/low-k processes. The new-generation laser-based
production tool has been optically enhanced to produce a smaller
spot size than earlier versions and much smaller measurement
penetration depth for enhanced accuracy. For use in PVD and
CVD barrier/seed layer applications, plating, CMP, and tungsten
vias, the 200- and 300-mm tool has dual loadports configurable
for FOUPs, SMIFs, FOUP and SMIF bridge tools, and open cassettes.
It can examine up to 75 wafers per hour or 55 wafers per hour
with nine-site pattern recognition.
Three
new ion implanters are available in the single-wafer VIISta
platform. All three tools—the high-current 80HP, the medium-current
810EHP, and the high-energy 3000HP—have a throughput of
>300 wafers/hr. The 80HP ion implanter's dual-magnet, broad-beam
architecture provides a deceleration mode configuration and
high process control for ultrashallow-junction applications.
The 810EHP increases the capabilities of the previous-generation
810 medium-current tool. The 3000HP's high-vacuum conductance
end station and beam filter provide high effective productivity
without compromising dose accuracy and energy purity. All systems
feature the company's control and positioning systems and a
common single-wafer end station.
A
high-throughput instrument for preparing cross-sectional samples
and imaging sub-90-nm feature sizes at high resolution can be
used for process integration support of advanced development
of 200- and 300-mm manufacturing. Combining the Seiko SMI2000MS-series
focused ion beam (FIB) tool and the JEOL JEM-2500SE scanning
transmission electron microscope (STEM), the instrument prepares
test samples accurately and quickly. The FIB prepares and finalizes
multipoint specimens nondestructively at specified locations
without operator intervention. Using a gallium ion beam, it
converts the specified cross-section area into a 100-nm layer.
After sample preparation, the cross-sectional layers are transferred
to the STEM, which produces ultra-high-resolution, 0.2-nm images.
The STEM's compact footprint and ergonomic design make it suitable
for the semiconductor fab. (Semicon Taiwan)
Handheld
Particle Counter
Flowmeters
Quiet
Ball Screws
An
automated 300-mm inspection tool, the AutoTex uses an advanced
2-D detector and novel analysis protocols. The protocols enable
the high-speed monitoring of quantitative microstructure properties
such as crystallographic phase and grain orientation, allowing
the instrument to operate as a true production metrology tool.
The system performs rapid crystallographic analysis of device
crystalline materials, including copper, aluminum, tantalum,
tantalum nitride, titanium, titanium nitride, tungsten, cobalt,
CoSi2, TiS2, and other materials. It provides
outputs of numerical maps, 2-D and 3-D color contour maps, trend
charts, scalable vector graphic plots, and ASCE tables. User
control of spatial resolution on the wafer surface ranges from
1 mm to 35 µm X 26 µm for smaller test structures.
The tool has two operational modes: an automated mode with pattern
recognition for fab quality control and trend charting, and
an interactive mode for development work.
Carts
for transporting wafer cassettes or work in process optimize
maneuverability in restricted-space critical environments. Designed
for Class 10 to Class 1 cleanrooms, the carts are more cost-effective
and efficient than heavier, bulkier ones. They feature a specially
designed wafer cassette shelf to hold wafers securely and offer
superior laminar flow. The shelf is 40 in. from the floor; an
adjustable-height push handle provides ergonomic and user-friendly
operation. Softie plate casters dampen vibrations without the
black rubber and tread associated with traditional pneumatic
casters. A variety of cart configurations and sizes are available.
Remote
Plasma Source
Overlay
Measurement System