INDUSTRY
NEWS
300-mm Imperative
UMCi
installing more tools
UMCi
will begin the second phase of tool installation at its 300-mm fab in
Singapore. The fab's parent, the foundry UMC, approved move-in of FEOL
equipment at the most recent meeting of its board of directors. UMCi has
been processing high-yielding 300-mm wafers with defect densities comparable
to those of Fab 12A, its plant in Tainan, Taiwan. UMCi is a joint venture
with Infineon Technologies and the investment arm of the Singapore Economic
Development Board.
The
UMCi fab makes ICs at the 90-nm node. Investment in the facility will
grow to $500 million by the end of 2003, the company says. Capacity will
reach 10,000 300-mm wafers per month with total investment at $1.2 billion
by the end of 2004. All FEOL equipment will be installed by January of
next year, UMC says.
Meanwhile,
Asyst Technologies says it has received a multi-million-dollar order from
UMCi for Asyst's 300-mm automated material-handling system. The installation
will combine Asyst-Shinko material-handling technology and Asyst's FasTrack
"continuous flow" technology. FasTrack technology is capable of delivering
material from tool to tool four times faster than conventional systems
using material-handling vehicles, the supplier claims.
TEL
to ship track modules
TEL
is ready to ship the first of its iODP100 modules for the supplier's 300-mm
coater-developer. Volume shipments of the module for use with the vendor's
Clean Track Lithius tool will begin before the end of September, TEL says.
The new coater-developer is built on the platform of TEL's Clean Track
ACT tool. The new system is designed for use at 70 nm. The Lithius system
accommodates metrology modules, TEL says, adding that macro inspection
and CD capabilities are also available in separate modules.
Chipmaker
buys strip tools
A
North American chipmaker described as a major manufacturer of logic ICs
has ordered strip systems from Mattson Technology, the vendor announced.
The 300-mm Aspect II ICP tools will be used for advanced low-k processing
and related BEOL resist strip and residue removal. The first of the tools
shipped in May 2003. Two previous versions of the dry-strip system are
installed at fabs operated worldwide by the device manufacturer, Mattson
says.
Asyst
sells RFIDs
A
Japanese electronics company has chosen radio-frequency ID tags from Asyst
Technologies for its first 300-mm fab, the vendor announced. The unnamed
manufacturer joined another large 300-mm factory in Southeast Asia in
selecting the vendor's AdvanTag RFIDs as a "tool of record." The automated
system uses Microtags attached to components such as FOUPs, lots, and
pods to track each asset as it moves among tools in the fab, Asyst says.
AdvanTag readers are integrated in loadports, material-handling systems,
sorters, and related fab equipment.
The
California-based supplier of fab automation systems says it especially
welcomed the orders because it has sold fewer RFIDs in Japan than in
other regions.

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