MICRO: Products

Wafer-Edge Inspection Tool

EV Group

Schärding, Austria

The SmartEdge inspection system detects and classifies defects and particles on the wafer edge. Point defects, scratches, and area defects can be detected automatically, eliminating the necessity of labor-intensive and costly manual visual inspection. Using new and advanced vision and image-recognition components for extended inspection capabilities, the tool can differentiate between usable and scrap wafers. It has a robotic handling system and full FOUP automation. The tool prevents wafer breakage caused by edge defects, which can result in downtime and a low cost of ownership. The system is available in both 200- and 300-mm configurations. (Semicon West, S.F., North Hall, Booth 5425)

AMHS Integration

SK Daifuku

Salt Lake City, UT

A complete series of automated material handling systems (AMHS) products includes logistics studies, simulations, material control software, 200- to 300-mm bridge technology, equipment, installation, and support services. Among the company's offerings are transport and stocker systems. The Cleanway CLW-07 is a fast, small, light overhead transport system for use in interbay and intrabay applications. (Semicon West, S.F., North Hall, Booth 5206)

Bright-Field, Dark-Field Inspection

Negevtech

Santa Clara, CA

Designed for entry at the 90-nm node and optimized for 65-nm wafer inspection, the 302 system combines both bright-field and dark-field inspection technologies in one tool. For bright-field inspection, the system's Step&Image 2-D imaging technology replaces traditional TDI CCD technology, which is slow and jitter-prone. The system is also effective for dark-field imaging at smaller technology nodes. The tool uses short-pulsed UV illumination and a large 2-D focal plane assembly (FPA) to create die-sized images. The FPA enables a large field of view, improving throughput and reducing overhead. The UV illumination source also enables high optical resolution. The tool's footprint is up to 50% smaller than that of traditional bright-field tools. (Semicon West, S.F., South Hall, Booth 442)

Pad-Conditioning System

TBW Industries

Hatfield, PA

A pad-conditioning system provides integrated pad cleaning and polishing-waste removal for CMP tools and processes. The tool, which can be integrated into existing systems, sprays ultrapure water and cleaning and neutralizing chemistries onto the pad directly through the conditioner, while vacuuming abraded materials and fluid wastes through additional regions of the conditioner. By actively cleaning the polishing pad, the tool combines multistep polishing processes on a single platen. Endpoint-selective chemistries for barrier removal, dishing reduction, or buffing operations can be run in sequence, improving throughput, quality, and uniformity. The 300-mm tool is for use in <0.18-µm, metal, low-k, and shallow-trench isolation applications. (Semicon West, S.F., South Hall, Booth 2966)

Double-Diaphragm Pumps

Wilden Pump & Engineering

Grand Terrace, CA

Air-operated double-diaphragm pumps belonging to the Unitec family are for use in a wide variety of chemical, waste, and abrasive-slurry pumping applications. The Unitec family's UA- and UX-series pumps are compact units with bolted Teflon PTFE and polyethylene liquid paths for excellent product containment and conductivity for grounding. UH-series pumps are plastic high-pressure, air-operated double-diaphragm units that can deliver two times more discharge pressure than inlet air supply. (Semicon West, S.F., South Hall, Booth 425)

Depth Filter Cartridges

Pall

East Hills, NY

CMPure CMPD-series depth filter cartridges are optimized for CMP slurry systems, resulting in consistent and repeatable filter performance. CMPD filters feature proprietary, patented CoLD fiber-melt-blowing technology, which produces a rigid graded pore structural network in the cartridge. As a result, the filters offer high structural strength, resistance to contaminant unloading, and long service life. (Semicon West, S.F., North Hall, Booth 5356)

Reticle Area Filter

Donaldson

Minneapolis, MN

A reticle area filter efficiently removes gas-phase organics and other contaminants in lithography tools. The filter is smaller than standard point-of-use filters for lens purge and optics protection applications, providing lithography tool managers with high contamination control in small environments. Made with activated carbon, the filter does not affect the transmission of O₂, water, and relative humidity. It is for use in ultra-high-purity applications and has no particulation or offgassing requirements. The filter purges the reticle/illuminator area and removes nonpolar compounds. The refillable unit is available in many different sizes for various applications. (Semicon West, S.F., North Hall, Booth 6347)

Atomic Layer
Deposition Tool

Genus

Sunnyvale, CA

The StrataGem²⁰⁰ and StrataGem³⁰⁰ atomic layer deposition (ALD) systems provide high film-deposition flexibility and process performance in leading-edge production environments. The tool is used in semiconductor and data-storage device applications. A new feature of the StrataGem²⁰⁰, an optional in situ chamber clean, decreases the time and frequency of chamber wet cleans, thus increasing chamber uptime. An integrated gas box, available on the StrataGem³⁰⁰, reduces the size and complexity of the gas-delivery system and improves maintainability. Also available are an optional autorefill feature, which provides convenient chemical delivery, and an optional smart equipment front-end module. (Semicon West, S.F., South Hall, Booth 2401)

Vacuum Preloaded Air Bearings

New Way Precision

Aston, PA

Using vacuum preloaded (VPL) air bearings, semiconductor toolmakers can combine x and y linear motion and theta rotation on one flat surface, eliminating the need to stack several separate stages. VPLs make it possible to build stages that are kinematically correct and not overconstrained. By minimizing the stack height, angular and thermal errors can also be minimized. The air bearings can fly over patterned wafers to contain process gases or vacuum. They float on a thin film of air while simultaneously being sucked down by vacuum, providing zero-friction motion while the vacuum provides high stiffness without added mass. The result is an efficient, stable, low-profile product for multiaxis motion applications. Standard and custom VPLs are available. (Semicon West, S.F., Esplanade, Booth 4027)

Single-Wafer Wet-Process Cleaning

SEZ

Villach, Austria

Uniting high throughput and a small footprint, Da Vinci–series cleaning tools provide a high level of serviceability and reliability in a single-wafer format. The DV-38F performs BEOL processing of 300-mm wafers with 90-nm and smaller geometries. It can perform polymer removal on the wafer frontside on eight 300-mm wafers simultaneously. The tool's spin processors are equipped with advanced process control, an enhanced software system, an onboard chemistry-dispense system, wafer-handling capability, and an operator interface. The system enables customers to select preferred organic or inorganic process chemistries rather than specific ones. It also allows users to continue production during maintenance in the process section. (Semicon West, S.F., Gateway, Booth 3416, North Hall, Booth 5256; S.J., McEnery Hall, Booth 10319)

Nonspill Quick-Disconnect Couplings

Colder Products

St. Paul, MN

Injection-molded polypropylene couplings provide a lightweight, durable, economical alternative to heavy high-pressure metal couplings and expensive PVDF, PTFE, and PFA high-purity couplings. The CQG06 and NSH-series devices are for use in high-flow chemical management applications. They can be disconnected and reconnected at full system pressure with almost no spillage. Based on ChemQuik CQN-series high-purity couplings, they feature the same pressure-balanced, nonspill design. Their 100% metal-free and spring-free flow path results in high Cv/low- turbulence flow, broad chemical compatibility, and no corrosion. They can withstand pressures from 0 to 120 psig and temperatures from 32° to 150°F. (Semicon West, S.F., South Hall, Booths 302, 1305, 3011)

E-Beam Inspection System

KLA-Tencor

San Jose, CA

The eS30 E-beam inspection system is designed for high-volume production line monitoring of electrical defects at sub-130-nm device nodes. Given the incidence of electrical defects in both filled and unfilled high-aspect-ratio structures, E-beam inspection is required in memory and logic applications. Following the eS20XP platform, the new tool reduces overhead times while offering faster scanning speeds and extensive enhancements. Tool features include eControl technology, which improves inspection stability and increases the electrical signal of voltage contrast defects by reducing wafer charging. The system also incorporates in-line automatic defect classification capability, allowing chipmakers to identify and sort yield-relevant defects. A 20-nm-resolution defect review capability enables a twofold increase in recipe setup and optimization over the eS20XP. Better imaging flexibility allows the tool to detect critical defects on a variety of layers, including silicon-on-insulator and low-k dielectrics. (Semicon West, S.F., South Hall, Booth 426)

Wet-Process Station

Clean Air Products

Minneapolis, MN

Series 1412 wet-process stations for use in semiconductor manufacturing operations feature a safety-oriented design to provide high quality, a clean appearance, and maximum chemical resistance. The rugged units can be constructed of stainless steel, white polypropylene, and fire-retardant white polypropylene. They come in standard sizes up to 8 ft wide and 42 in. deep, with other sizes available. Numerous options can be employed to meet specific application requirements.

Closed-Loop Gas Chiller

IGC Polycold

Petaluma, CA

The PGCL closed-loop gas chiller incorporates a recirculating gas system that offers a cost-effective means of improving wafer processing, increasing throughput and improving process quality and reproducibility. The chilled-gas recirculation system is easily serviced and reliable. The small-footprint unit provides clean coolant gas. It allows high-temperature bakeout without pressure buildup. Offering a low cost of ownership, the system can be used in wafer chuck cooling, tool heat transfer, and process temperature control applications. (Semicon West, S.F., South Hall, Booth 2916)

Photoresist Dry Strip Tool

Axcelis Technologies

Beverly, MA

A 300-mm resist-strip system designed to support the integration of low-k dielectric materials, the ES3Lk provides a zero-damage process for the low-k materials, capping layers, and etch stops used in low-k integration schemes through the 45-nm technology node. The stand-alone plasma stripping unit reduces chipmakers' cost of ownership up to 25% more than in situ etch/strip tools, in which etch and strip processes are performed in a single chamber. Based on the FusionES3 platform, the isotropic dry strip system maintains a very-low-k-effective value for integrated BEOL dielectric stacks. Compatible with subsequent wet cleaning steps, the ES3Lk process can be used with virtually all dense and porous low-k materials. (Semicon West, S.F., South Hall, Booth 702)

Dual-Axis Servomotor Controller

Adept Technology

Livermore, CA

The FireBlox miniature dual-axis servo amplifier and controller powers multiaxis servo devices. Based on SmartServo architecture, the product reduces wiring, lowers costs, and improves reliability in motion control applications. It controls auxiliary axes such as servo grippers, Z-theta heads, servo pumps, and other motion control devices. In addition to performing servo control, the controller provides digital and analog I/O. It uses a FireWire-based high-speed control bus, which replaces hundreds of wires and connections with a single cable. FireWire connectivity to the PC lays the basis for real-time open architecture controls while maintaining reliability and safety. (Semicon West, S.F., South Hall, 2442; S.J., McEnery Hall, Booth 11928)

Post-CMP Cleaning Solution

EKC Technology

Danville, CA

PCMP5510 cleaning solution for postcopper/low-k CMP applications is an aqueous material that removes residual metals and particles. The solution does not contain fluorides, is environmentally safe, and can be disposed of through the drainage system. It is also fully compatible with double-sided scrubbers and megasonic cleaning equipment. The product facilitates metal-ion-residue removal, SiO₂ and Al₂O₃ particle removal, and high performance on copper surfaces. It eliminates copper redeposit problems, has a wide process window, and can be used efficiently with DI water. The solution does not corrode sensitive metal films or process equipment. (Semicon West, S.F., South Hall, Booth 417)

Safety Curtain

Scientific Technologies

Fremont, CA

A 14-mm-resolution version of the MicroSafe MC4700-series safety light curtain complements the existing range of detection options (12, 20, and 30 mm) for maximum application flexibility. The curtain is available in protected heights from 150 to 1800 mm and offers a sensing range to 5 m. The product is available in standard, segmented, or jointed versions. Options include low electrostatic discharge models and a DeviceNet interface. Tight resolution, combined with a 6.5-millisecond response time, allows the curtain to be mounted close to the pinch points of hazardous equipment. Its compact size permits installation in small areas. (Semicon West, S.F., Esplanade, Booth 4126)