INDUSTRY NEWS

Expansions and Acquisitions

Infineon eyes sensor maker

Looking to strengthen its position in the market segment, Infineon Technologies says it plans to acquire a Norwegian manufacturer of semiconductor sensors. In late May, the Munich-based chipmaker was set to make a bid worth approximately $56 million for SensoNor, a manufacturer of automotive sensors based in Horten, Norway. If completed, the deal would make Infineon the world's leader in tire pressure sensors. Infineon notes that the automotive market for semiconductor sensors is expected to increase at a yearly rate of 20%. Tire pressure sensors are the fastest-growing segment of the pressure sensor market, according to Infineon. The chipmaker's automotive and industrial business unit is based in Villach, Austria.

ASM, Soitec sign SOI pact

Extending their previous cooperation, ASM International and Soitec have signed an agreement to develop a high-volume manufacturing capability for strained silicon-on-insulator (sSOI) wafers. The partners hope to pair ASM's Epsilon 3000 epitaxial reactor and Soitec's Smart Cut Technology to create a "production-worthy" sSOI substrate. The pact continues the firms' collaboration involving ASM's Advance 400-series vertical furnaces and Soitec's 300-mm Unibond SOI wafers.

The partners say that so-called engineered silicon substrates are needed for device production at the 65-nm node and below. ICs made on SOI substrates function at higher speeds and at lower rates of electrical consumption than devices made on conventional wafers, Soitec says. Power consumption is two to three times lower and device speed is 20 to 30% higher than standard ICs, says the SOI-wafer supplier, which is based in Bernin, France.

3-D chipmaker finds funds

A manufacturer of 3-D ICs has received an additional $17.4 million to speed development of devices targeting wireless communications. Ziptronix of Research Triangle Park, NC, raised the second-round funds from a group of investment firms led by Grotech Capital Group of Timonium, MD, and Intersouth Partners of Durham, NC. During an inaugural round of funding in 2001 Ziptronix raised $6.5 million from Alliance Technology Ventures and Xilinx.

In 2002, Ziptronix introduced its ZiROC adhesive-free semiconductor bonding technology and ZiCON 3-D interconnect technology. Founded in October 2000, the privately held start-up was spun off from 10 years' worth of R&D work in 3-D devices at the Research Triangle Institute.

Despatch integrates its HQ

Despatch Industries, a manufacturer of thermal processing equipment, has brought all of its business and manufacturing functions into one building. Located in Lakeville, MN, the company has moved all manufacturing, engineering, warehousing, and other departments into the expanded headquarters site. Previously, some departments had operated from Despatch's original office in Minneapolis. The manufacturer expects the change to improve efficiency and collaboration with its Ransco Products division in Oxnard, CA, and installation unit in Detroit.

Pair partners on copper

Enthone plans to expand sales of copper damascene deposition processes under the terms of a new joint agreement with ATMI of Danbury, CT. Enthone says its Viaform copper electrochemical deposition (ECD) processes enhance the integration of the CMP process at high yields. The agreement gives ATMI, which makes specialty materials and related equipment, exclusive global rights to use and sell Enthone's Viaform materials and related copper ECD products and services.

Entegris ships new shippers