MONDAY,
OCTOBER 14
9
a.m.–6 p.m.
A
Partnership for PFC Emissions Reductions
Cosponsored
by SEMI, SIA, International Sematech, and SESHA
Chairs:
Laura Mendicino, Motorola; Mike Mocella, DuPont Electronic Gases
Environmental
Protection Agency Update
Scott
Bartos, Environmental Protection Agency
World
Semiconductor Council Update
Chuck
Fraust, SIA
PFC
Emissions Reduction from Semiconductor PE-CVD Process using an
Alternative Chamber Cleaning Gas COF2 or
F2
Katsuo
Sakai, National Institute of Advanced Industrial Science and
Technology
Progress
and Challenges in PFC Reductions at AMD
Dan
Seif, Advanced Micro Devices
PFC
Emissions from a 200 mm Fab at the 90 nm Technology Node
Laura
Mendicino, Motorola
In
situ Cleaning of LPCVD Furnaces Using a Thermal NF3
Etch Process
Eric
Timmermans, ASM International
Control
of PFC Emissions from Plasma Processes by Reactive Gas Addition
Victor
Vartanian, Motorola
Advances
in Reducing PFC Emissions and Gas Costs: Qualification and Implementation
of c-C–4F8 Chamber
Clean Gas in a Novellus Concept-2 Chemical Vapor Deposition Tool
Allen
Evans, Advanced Micro Devices
Integrated
Fluorine Supply Strategy for CVD Chamber Cleaning Applications
Nancy
Irwin, BOC Edwards
Regulatory,
Toxicity and Recommended Exposure Limit Considerations for Semiconductor
Process Gases
Gary W. Jepson, DuPont Haskell Laboratory
Post-pump
Abatement of Waste PFCs from Etch Tools by Atmospheric Microwave
Surface-Wave Plasmas: Raised-Floor Integrated System for Multiple
Chamber Exhaust Treatment
Jean-Christophe
Rostaing, Air Liquide - Centre de Recherche
PFC
Abatement System Monitoring with Infrared Spectrometry
Gregory
T. Merklin, MKS On-Line Products
TUESDAY,
OCTOBER 15
8
a.m.–12 noon
EHS
Issues in Advanced Lithography Workshop Cosponsored
by SEMI Chemical and Gases Manufacturers Group (CGMG) and International
Sematech
The
workshop will identify EHS issues associated with advanced lithography
materials and processes and provide a PFAS update. It will allow
for an information exchange from the perspectives of the photolithography
research community, chemical and equipment suppliers, and device
manufacturers. The goal is to gain a better understanding of the
EHS challenges facing advanced lithography and how they affect
each industry segment.
8
a.m.–12:30 p.m.
STEP:
SEMI E78—Assessment and Control of ESD and ESA for Equipment
SEMI
Standard E78 defines ways to minimize the negative impact of static
charge in IC manufacturing and to establish the electrostatic
compatibility of IC equipment. This half-day Standards Technical
Education Program (STEP) will describe SEMI E78-0998 and review
its use in the industry. Static-charge control issues, particularly
in photolithography, will be discussed.
1
p.m.–5 p.m.
STEP:
SEMI E89—Analysis of Gauge Measurement Capability
Until
the adoption of SEMI E89 in 1999, the IC industry had no generally
accepted method to carry out measurement system capability analyses
(gauge studies). While this standard proposes a methodology for
conducting such studies, only a limited example can be given because
of the variety of measurement instruments. This program will show
how to set up, conduct, and analyze the results of a gauge study
according to SEMI E89.
3
p.m.–5 p.m.
SEMI
Chemical and Gas Manufacturing Group (CGMG) General Meeting
The
Chemical and Gas Manufacturers Group (CGMG) is a SEMI-sponsored
special interest group for SEMI members who supply chemicals,
gases, resists, and related products to the semiconductor industry.
They hold regularly scheduled meetings in conjunction with Semicon
shows held in the U.S., Europe, and Japan. The CGMG provides a
forum and a point of focus for its members to address those issues
of special importance to their segment of the semiconductor industry.
This committee has an international membership and all interested
parties are invited to become members.
WEDNESDAY,
OCTOBER 16
8
a.m.–5 p.m.
Semiconductor
Processing Technology
(Day 1 of 3)
Instructor:
Dr. Peter Gwozdz, San Jose State University
To
be successful in this industry, having an understanding of semiconductor
processing technology is a must. This introductory course deals
with wafer fabs. The material is presented in a familiar manner
to answer very specific technical questions about how products
relate to other parts of the wafer fab. The instructor, with two
decades of hands-on engineering experience, encourages questions
and takes the time to answer them all.
8:30–9:30
a.m.
Equipment
and Materials Market Briefing
Lubab
Sheet, Senior Market Analyst, SEMI
In
this fast-paced industry, reliable market intelligence is required
to make informed business decisions. This briefing will provide
timely and accurate market data on semiconductor equipment and
materials that will help companies gain a competitive advantage.
8:30
a.m.–12:30 p.m.
STEP:
SEMI E116—Equipment Performance Tracking (EPT)
SEMI
E116 EPT provides the model for the measurement of equipment performance
that is inevitable for equipment engineering. In this Standards
Technical Education Program (STEP), the concept and application
of EPT will be introduced and its practical implementation described.
The position of EPT is discussed in the domain of SEMI E10 equipment
performance measurement.
THURSDAY,
OCTOBER 17
8
a.m.–5 p.m.
Semiconductor
Processing Technology
(Day 2 of 3)
FRIDAY,
OCTOBER 18
8
a.m.–5 p.m.
Semiconductor
Processing Technology
(Day 3 of 3)