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Automated Defect Inspection

Accent Optical Technologies

Bend, OR

SiPHER Auto is a fully automated system for controlling metallic contamination and defect generation on 200- and 300-mm wafers. By providing rapid process feedback of wafer quality, it increases overall equipment effectiveness. The system can be used to inspect incoming wafers and monitor surface contamination. Rapid feedback allows it to reduce the number of batches out of specification. The unit's optics design enables it to detect defects faster and with greater sensitivity than other methods. Its ability to monitor the wafer surface, rather than the bulk silicon, enhances its ability to detect defects in the device-active region. The system includes advanced image processing and data logging for statistical process control, and complies with all automation standards. An improved slip inspection module for accurate and fast detection of slip is available as an option.


Thick-Film Quartz Heaters

Watlow

St. Louis, MO

Based on thick-film technology, ultrapure quartz heater modules for use in semiconductor wet-chemistry applications perform better than inefficient infrared quartz heaters and avoid the permeability problems associated with Teflon-coated products. The heating elements are applied directly onto the exterior surfaces of the quartz tubes, providing efficient transfer of heat energy and enabling rapid response to changes in flow and temperature. The state-of-the-art heaters are for use with aggressive chemicals, such as ammonium hydrochloride, hydrochloric acid, hydrogen peroxide, phosphoric acid, and ultrapure 18-M Ω DI water. The modules are 50% smaller than competitive heaters and eliminate the risk of process contamination if heating elements fail. The units have a maximum process temperature of 180°C, maximum operating pressure of 75 psi, and a maximum flow rate of 35 L/min. The heaters can be integrated directly into process tools.


Cordless Vacuum Wand

H-Square

Sunnyvale, CA

The FWCR2, a battery-operated, cordless vacuum wand system can safely handle up to 300-mm wafers for 3 hours without recharging. The unit, part of the Freedom Wand family, can be directly connected to a power supply when batteries have been discharged. A tabletop/wall-mount stand keeps the unit clean and secure when it is not in use. An ergonomic handle with finger contours makes the wand comfortable for users. All Freedom wands are suitable for use in Class 1 cleanrooms. (Semicon Southwest, Booth 1014)


Manual Transfer Unit

ASQ Technology

San Clemente, CA

The Manual Transfer Machine transfers wafers between cassettes and quartz or SiC boats without requiring constant, time-consuming calibration by trained technicians. The easy-to-use unit transfers 25 wafers from a Teflon or plastic cassette to an angle-slot boat and from the boat back to the cassette. Transfer takes place in less than 40 seconds. The machine does not require maintenance, calibration, or alignment and does not cause wafer rattling, chipping, scratching, or breakage. The angle-slot boats used with the unit reduce particle contamination and enhance uniformity, throughput, and yield. The machine's performance equals or exceeds that of an autoloader at one-tenth the cost.


Ultrapure Thermoplastic Piping

Edlon

Avondale, PA

Cost-effective, ultrapure thermoplastic piping for semiconductor and other processes protects critical transmission lines from mechanical damage and eliminates expansion problems associated with solid thermoplastic systems. Secure & Pure products combine the strength of a stainless exterior with a noncontaminating, unpigmented plastic interior. Virgin-resin liners are available in PVDF, PP, or PTFE. All three materials meet the chemical-resistance, purity, and temperature-capability requirements of the IC industry. The piping's stainless-steel shell resists exterior corrosion, UV effects, and weathering. It also protects high-purity lines from mechanical and seismic damage. It is available with diameter sizes of 1/2 to 12 in. (Semicon Southwest, Booth 1737)


Deposition Technology

ASM

Phoenix, AZ

Available on Epsilon reactors and Polygon cluster platforms, New Technology performs deposition techniques for a range of semiconductor manufacturing processes. The technology improves the performance and manufacturing efficiency of single-wafer processes for epitaxy of Si, SiGe, and SiGeC, as well as for rapid thermal chemical vapor deposition of poly- and amorphous Si, SiGe, Si3N4, and SiO2. The system's precursor relies on very low activation energy for dissociation of adsorbed molecules on the wafer surface, leading to a high growth rate over a wide temperature regime. At 600°C, the deposition rate becomes independent of substrate temperature, resulting in improved control of layer thickness and facilitating improved thickness uniformity and repeatability.


Bulk Special Gas System

BOC Edwards

Wilmington, MA

The SpectraSure intelligent Bulk Special Gas System (iBSGS) satisfies the high-flow and high-purity process gas requirements of the semiconductor industry. Using all-1/2-in. components, the system features the iGSC controller and provides a flexible and cost-effective alternative to the traditional gas cabinet supply scheme. Inert and hazardous process material configurations, as well as indoor and outdoor installation options, are available. The iBSGS ensures performance reliability, operator safety, and product consistency.


Nitrile Cleanroom Glove

Kimberly-Clark

San Diego, CA

The Safeskin NxT synthetic nitrile polymer cleanroom glove is made from acrylonitrile butadiene and contains no natural rubber latex. The white, ambidextrous, beaded-cuff glove has textured fingertips. It has a minimum tensile strength of 14 MPa before aging and after accelerated aging, and ultimate elongation of 500% before aging and 400% after accelerated aging. The glove's nominal thickness is 0.16 mm at the middle finger, 0.13 mm at the palm, and 0.10 mm at the cuff. Its nominal length is 305 mm. With a particle rating of 950 ≥0.5-µm particles/cm2, its extractables levels are 0.03 µg/cm2 for sodium, 0.03 µg/cm2 for ammonium, 0.03 µg/cm2 for potassium, 0.03 µg/cm2 for magnesium, 0.33 µg/cm2 for calcium, 0.23 µg/cm2 for chloride, 0.13 µg/cm2 for nitrate, and 0.07 µg/cm2 for sulfate. (Semicon Southwest, Booth 1032)


Spin Coater

Suss MicroTec

Munich, Germany

The Delta 80 spin coater offers both the patented Gyrset system and conventional open-bowl coating with the high acceleration capabilities required for some thin-resist applications. The tool's ability to coat thick resist makes it suitable for MEMS applications. The Gyrset technology features a closed processing chamber, which creates a solvent-saturated and turbulence-free atmosphere above the substrate. The technology is required for uniform coating of rectangular substrates and for all fast-drying photoresists. It yields a uniform, consistent coating thickness on most surfaces without spinning defects, such as rebounding, splashback, striations, comets, or corner effects. The Delta 80 can process delicate wafer fragments, 200-mm wafers, and substrates up to 6 x 6 in. A quick-exchange system enables operators to change wafer sizes with ease.


Process Mass Spectrometers

Ametek Process Instruments

Pittsburgh, PA

The Dycor ProLine series of process mass spectrometers are compact, bench-top systems that provide real-time process monitoring and control. They feature high mass resolution, a low cost-per-sample point, a flexible design, user-defined data presentation, and high sample rate and data throughput. Available with up to 16 inlet ports for sampling process streams and calibration gases, the systems are fully automatic. They come with multiport automatic valve switching, an inlet manifold, a turbomolecular pumping package, and a choice of closed ion-source analyzers. The quadrupole mass spectrometers determine the amounts of different gas species in a sample by providing data output not only in ion current or partial pressure, but also in concentration units (such as parts per million and percent). Automatic calibration and calibration verification features allow users to quantify the amount of gas species in a sample and to maintain analyzer sensitivity and stability. (Semicon Southwest, Booth 1308)


Miniature Digital Servo Drive

Elmo Motion Control

Windsor, CT

The Harmonica is an intelligent, one-horsepower digital servo drive in a tiny, 150-g package. The drive provides up to 750 W of continuous output power and 1500 W of peak power. It features sinusoidal vector control, trapezoidal vector control, and trapezoidal six-step and dc commutation methods. Integrated into the drive is high-efficiency power switching technology aligned with a fast version of the CANopen protocol. The drive is fully programmable with company-supplied programming language. Users can employ the Composer setup tool to perform drive setup, configuration, tuning, analysis, and drive programming quickly and easily.


Fusion Welder

George Fischer

Tustin, CA

The BCF Plus Fusion Machine joins a variety of piping materials and provides strong fusion welds. The compact unit produces strong, reproducible fusion welds without irregularities, beads, or crevices. Easily transportable to remote installation sites, the unit can join SYGEF PVDF-HP, SYGEF PVDF standard, and PP-n (natural) piping components ranging in size from 20 mm (1/2 in.) through 63 mm (2 in.). An option is available for fusing 75–110-mm (2 1/2–4-in.) piping. The machine uses standard butt-fusion fittings that not only reduce costs, but also allow for more-compact installations. A high-purity transport crate is provided with the unit. Accessories available include a facer, a back support, a hose box, and a card for electronic evaluation of fusion data.


Wafer-Position Detector

Yamatake Sensing Control

Santa Clara, CA

Whereas conventional equipment measures notches with sensors that scan the periphery of a rotating 300-mm wafer, the VS-Aligner wafer-position detector makes a single, rapid measurement using whole-wafer images produced by a megapixel digital image sensor. The images are automatically analyzed to determine each notch and center coordinates. The center position is accurate to within ±0.05 pixels, while the angle is accurate to within ±0.06° (repeatable). Direct digital processing image resolution is 1280 x 1024 pixels. Featuring Ethernet/USB 1.1/EIA-232C connectivity, the unit is easy to integrate and install. The main unit measures 80 mm wide x 130 mm high x 117 mm deep, while the camera measures 33 mm wide x 33 mm high x 44 mm deep.


Valve with Position Indicator

Qualiflow

Montpellier, France

A manual shut-off valve has a position indicator that is connected to a PC or PLC, allowing fab personnel to manage plant safety more effectively and with fewer visual inspections of valve positions than conventional valves. Fabs can have several manual valves, which must be inspected periodically to determine whether they are on or off. The valve-position indicator performs that function electronically, avoiding time-consuming visual inspections and the possibility of human error. The indicator provides personnel with constant access to real-time information about the ever-changing situation on the fab floor, enabling them to respond quickly if necessary. The unit detects the position of the manual valve through two dry reed switches, which allows a controller to control valve position.


Thin-Film Metrology Tool

Scientific Computing International

Carlsbad, CA

Used for R&D and volume production of 90-nm devices, FilmTek 2000M-DUV provides complete characterization of semiconductor films. The instrument allows product wafer monitoring in 193-nm DUV lithography and other film applications. It measures thickness and optical film properties simultaneously. Based on broadband spectrophotometry at wavelengths of 190 to 1700 nm, it has a measurement spot size as small as 5 µm in diameter. A proprietary algorithm enables the system to characterize single- and multilayer films ranging in thickness from 3 Å to 250 µm in deposition, diffusion, etch, and lithography processes. It can characterize metal films and determine their thickness up to several hundred angstroms. The instrument also can determine extinction coefficient and index, roughness, porosity, composition, crystallinity, energy band gap, inhomogeneity, and depth gradient.


CVD Precursors

Dow Corning

Midland, MI

Three CVD precursors, Z2DM (dimethyldimethoxysilane), Z4MS (tetramethylsilane), and ZTOMCATS (tetramethylcyclotetrasiloxane), are multifunctional silicon source liquids. They are designed for advanced PECVD processes used to deposit thin-film dielectrics, including passivation, etch-stop, hard-mask, and copper diffusion barrier films. These high-performance liquid precursors are compatible with copper dual-damascene and aluminum processes. They are colorless, noncorrosive, nonpyrophoric organosilicon liquids that meet the highest purity requirements of the semiconductor industry. The products offer the same low cost of ownership, quality, and availability as Z3MS CVD precursor.


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