Entegris has made several yield- and safety-enhancing modifications to its 300-mm front-opening unified pod (FOUP) product line. The F300 AutoPod is available in PEI, a new flame-retardant material that provides improved fire protection and safety characteristics. Improved purge features, which include a purge-gas inlet and original-air exhaust outlet, protect wafers from oxygen, moisture, and gaseous contaminants. An ESD path has been added to the FOUP door, which helps dissipate static charge buildup on the wafer retainer.

Varian Semiconductor has received a patent for its beam current sensor technology. U.S. Patent Number 6,403,972, "Methods and Apparatus for Alignment of Ion Beam Systems Using Beam Current Sensors," covers the company's use of the sensors throughout the ion implanter beamline for alignment and precalibration of the beam optics. The company says the sensor technology results in significant increases in machine throughput on its VIISta 810 and 810 HP medium-current implanters.

The 2002-2004 Vacuum Technology Catalog from Pfeiffer Vacuum features more than 600 pages of company products and related information. The catalog has listings on the application field, features, definitions and formulas, technical data, and part numbers on various company offerings. New additions to the catalog include the OnTool DryPump, which mounts directly to semiconductor process tools, and the DigiLine advanced digital pressure gauges for measurement of the entire vacuum range. An on-line version of the publication can be found at www.pfeiffer-vacuum.com.