New Materials Roundup

TEL touts low-k success

Working with International Sematech, TEL's subsidiary in Austin, TX, says it has successfully used an advanced low-k material in an integrated module. The module combines dual-level metal copper and material with a dielectric constant of 2.2, TEL says. The company achieved the results on an integrated set of tools that includes its Clean Track coater-developer, Unity etch system, and Alpha-8SE thermal processing system. TEL has made the tools available as an integrated system for more than two years.

TEL processed the wafers through Sematech's wafer services program. The vendor and the consortium evaluated three wet-cleaning chemistries for the low-k dielectric. TEL claims its PR200Z cleaning system resulted in lower defects and higher yields than the other chemistries.

MicroHome | Search | Current Issue | MicroArchives
Buyers Guide | Media Kit