MICRO: Products

300-mm CMP/Plating System

NuTool

Milpitas, CA

The LuminaCu RL-CMP, a 300-mm system for copper planarization processes at the 90-nm technology node and below, is a single-wafer processing tool for polishing copper on soft ultra-low-k dielectrics. Combining a high-linear-velocity component that provides high polishing rates with a low-downforce component, the system limits dishing and erosion to 200 Å or less, with almost no global oxide loss. The module can polish both copper and barrier metals at the same station. The platform can also perform copper-plating processes. The system delivers up to 60 wafers per hour in typical copper CMP applications and up to 90 wafers per hour in copper-plating applications.

Immersion Cleaning System

FSI International

Chaska, MN

Providing high performance at the 100-nm technology node and beyond, the Magellan immersion cleaning system for use in 300-mm manufacturing provides high-throughput processing (up to 30 wafers per hour/m²). The system's use of dilute and ozone chemistries, as well as chemical injection, reduces cycle times by as much as 40%, decreasing learning cycles and increasing order turnaround. In addition to dilute and ozone chemistries, conventional recirculated concentrated chemistries are offered. STG rinse/dry technology with chemical injection is standard. The unit's chemical-blending and delivery technology enables users to switch between multiple chemistries on the same system with no downtime, allowing them to change the product mix easily. Surface tension gradient technology provides watermark-free rinsing and drying, and a short low-IPA consumption process. Advanced process control features enhance process consistency. The fully automated system offers half-pitch, cassetteless processing of up to 52 wafers per batch.

Copper Annealing Systems

WaferMasters

San Jose, CA

Stacked Annealing Oven (SAO) thermal processing systems are suitable for 150-, 200-, and 300-mm wafer processing. The systems process copper wafers with no direct contact between the hot plates and the wafers. SAO units process up to five wafers simultaneously at temperatures up to 500°C. Offering a low cost of ownership, the units use material efficiently and have a mean-time-between-failures rate of 4000 hours. The energy-efficient system consumes <5 kW of power, less than 25% of similar systems. In addition to performing copper annealing processes, the unit is also suitable for aluminum sintering, hydrogen annealing, spin-on-glass functions, low-k dielectric annealing, polyimide bake, SiLK annealing, and compound semiconductor annealing.

Chemical Analyzer

Metara

Sunnyvale, CA

The LMS-300 chemical constituent analyzer performs fast, direct quantification of inorganic compounds such as copper and chloride, organic additives, and breakdown products in common chemical processing solutions. The tool can generate real-time trend data suitable for correlating back-end yield analysis to chemical processing parameters. The unit performs a range of wet process applications, including electrochemical deposition, electroless deposition, and chemical-constituent analysis. For use in high-volume environments, the system enables the correlation of defects, such as voids and surface irregularities, to the constituents in process chemicals. It also reduces chemical use and minimizes process variations. The fully networked system can be interfaced with a fab's factory automation system. At the push of a button, early-warning signals indicate excursions that can threaten yields.

Automated Immersion Cleaning

Akrion

Allentown, PA

Offering process control capabilities and flexibility, the Akros automated immersion cleaning system is for use in sub-100-nm IC manufacturing on 300- and 200-mm wafers. The unit handles all front-end-of-line (FEOL) and preepitaxial cleaning processes. It features a chemical concentration feedback system, allowing users to tighten process control parameters and boost productivity by ensuring the consistency and accuracy of chemical mixtures before wafers enter the bath. The system's adaptable software enables users to mix multiple process recipes without having to perform hardware modifications. Thus, chipmakers can streamline processes by using the same tool set for performing FEOL pregate, prediffusion, predeposition, and preepitaxial cleans on many device types.

Defect Review System

Applied Materials

Santa Clara, CA

The SEMVision G2 defect-review system can review defects at the bottoms of high-aspect-ratio features and electrical defects. With a high throughput of up to 1000 defects per hour, the tool can image and analyze defects as small as 80 nm. Its multiperspective imaging capability enables users to collect defect images from different angles and rapidly translate them into meaningful information. An improved SEM column and detector provide high image quality under a variety of conditions. High-aspect-ratio imaging, incorporated into the column, enables users to review the bottoms of 1:10 vias. The tool performs bare-wafer review and patterned-wafer energy-dispersive x-ray functions. An advanced process inspection e-beam inspection mode focuses on critical areas of the die or predefined test structures for efficient inspection with high-resolution SEM imaging.

Analysis/Imaging Workstation

Leo Electron

Thornwood, NY

Combining the high-resolution Gemini field emission column with the Canion focused ion beam column into a single unit, the 1540 XB Crossbeam workstation performs 3-D analysis and SEM imaging. A six-axes stage allows for eucentric wafer movements at all working distances. A multichannel gas-injection system, a mass spectrometer, dedicated airlocks, and EBSP, EDS, WDS, and other analytical detectors ensure that the system can be configured for a range of applications. The tool performs high-resolution live imaging during milling and polishing, and end-point detection for automated milling. It is offered with an automated TEM preparation software package and a tough, reliable pumping system. An optional multichannel gas-injection system can be used for material deposition and enhanced or selective etching.

Digital Mass-Flow Controller

Advanced Energy Industries

Fort Collins, CO

The PrimAera digital mass-flow controller (MFC) uses a small-diameter sensor that is very sensitive to changing gas conditions. The core of the unit's electronics is a digital signal processor that operates at 30 MHz, which replaces conventional sensing and control circuits with a digital algorithm, eliminating the drift and inaccuracies associated with analog instruments. The MFC's piezoelectric diaphragm-seated control valve provides fast response times of <1 second. By storing multiple surrogate-gas calibration templates in its memory, the unit allows users to select a wide range of gases without having to recalibrate. That capability makes it possible to reduce MFC inventories.

Gas-Purification Technology

Pall

East Hills, NY

Gas-purification material removes damaging impurities from gas-phase processes. AresKleen combines reactive groups on an inorganic substrate with the Ultramet-L filter technology to capture and remove O₂, H₂O, CO₂, CO, total hydrocarbons, and particulates. The material, which is compatible with a wide range of inert gases, is available in the Gaskleen family of purifiers for point-of-use gas purification. The products offer sub-parts-per-billion-level purification at flow rates from 1 to 50 std L/min, at pressures of 750 to 3000 psig. They provide 0.003-µm filtration, have electropolished 316L stainless-steel components, and offer high pressure-drop characteristics.

Linear Slides and Stages

Thomson Industries

Port Washington, NY

MicroStage 46 precision linear slides and stages, available in both belt and ball-screw-actuated configurations, provide a low-cost, high-performance drop-in replacement for heavier steel-based products. The components are manufactured from rugged, high-quality aluminum, and their light weight decreases system mass. All parts are designed with steel 60 Case LinearRace shafts and Ball Bushing bearing technology. The bearing segment design features a backlash-free assembly that does not sacrifice load capacity or smoothness. Redi-Mount-compliant, the units permit the mounting of any servo/stepper motors and gearheads. They are available in extended stroke lengths up to 1840 mm.

Overlay Measurement System

Nikon SITECH Group

Tempe, AZ

The NRM-3000 combines fine optics and advanced technology to automatically measure overlay and NSR (focus management) marks rapidly and precisely. The tool's lens offers excellent imaging performance with a very high signal-to-noise ratio and high dynamic range characteristics. The illumination system is bright and optically matched to the imaging system. It uses a fiber-optic delivery system to activate a quartz halogen lamp, which can be replaced easily. The system's high-precision, actively damped stage and EGA alignment control technology assure correct and fast measurements, resulting in throughput of 150 wafers/hr (5 points/wafer). Company software provides recipe management functions that can be optimized quickly and easily.

Elemental Analyzers

Jobin Yvon

Edison, NJ

EMIA-series carbon/sulfur, nitrogen/oxygen, and hydrogen analyzers from Horiba perform simultaneous carbon and sulfur analysis through a high-frequency induction furnace with variable temperature control. The instrument detects CO, CO₂, and SO₂ in real time without the need for an oxidizing or trapping reagent. The EMGA series analyzes nitrogen and oxygen using the inert-gas fusion method. The unit's variety of analysis modes ensures proper analysis conditions regardless of the sample. Real-time monitoring of sample heating and gas extraction is a standard feature of the equipment. The EMGA hydrogen series uses a high-sensitivity thermal conductivity detector for precise analysis. It also offers temperature-programmed analysis for various bonding modes.

Thermometry Instrument

Luxtron

Santa Clara, CA

The m600 OEM thermometry instrument controls temperature in processes using radio and microwave frequencies and high voltages. Suitable for use in thin-film etch and deposition processes, where temperature is critical, the unit provides precise and repeatable in situ temperature measurement of targets such as wafers, electrostatic chucks, reactor showerheads, and chamber domes. Based on Fluoroptic temperature technology, the instrument has a measurement range of –100° to 300°C. The technology uses fiber-optic probes, which are immune to aggressive electromagnetic and high-voltage conditions. The unit measures 75 mm high X 105 mm deep X 45 mm wide.

Filter Housings

Filter Specialists

Michigan City, IN

The CX150 filter housing, designed for pressures up to 150 psig, and the CX300 filter housing, designed for pressures up to 300 psig, are made of 316 stainless steel. The standard finish is 45 Ra for the wetted surfaces and a bright electropolish finish for the outside of the housing. A 32-µin. (3A) sanitary finish for the wetted surfaces also is available. The units are convertible: they accept either a filter bag or a filter cartridge. They cannot be pressurized if they are not closed properly, nor can they be opened unless pressure has been released. Their clean wall interior surface design allows fast, easy manual cleaning or in-place flushing.

Litho Tool Characterization

Litel

San Diego, CA

A suite of products provides feedback on the status of lithography tools, so that go/no-go decisions can be made quickly on the fab floor. The Optical Tool In-situ Characterization and Control Suite (OPTICCS) builds on the InspecStep Interferometer (ISI) and Source Metrology Instrument (SMI) products. Lens tuning using the ISI has led to adjustments that improve imaging at the wafer plane and result in yield improvements. The new robust SMI software package can determine numerical aperture. ISI and SMI improvements enable lithographic engineers to evaluate lens performance quantitatively, independent of feature size. In addition, OPTICCS integrates quantitative data on lens aberration and source profile, and adds new functions to determine focus, distortion, and lens transmission data.

Surface-Preparation Tools

Novellus Systems

San Jose, CA

Two 300-mm surface-preparation tools, the Gamma 2130 photoresist removal system and the Sierra dry-clean system, deliver cost-of-ownership improvements in sub-130-nm applications. The Gamma 2130 incorporates six stations in a single process chamber and can remove both low- and high-dose implanted photoresist at a 30% higher throughput rate than other systems. The Sierra addresses BEOL cleaning issues, such as CD changes in the line or via, and shifts in the effective k value of the film when conventional strip and wet-clean processes are applied to low-k dielectric films. The tool has a dual-plasma source that delivers the process flexibility required to perform cleans on low-k dielectric materials without damaging the underlying exposed films.

Catalytic Steam-Generation Unit

Ultra Clean Technology

Menlo Park, CA

The UCT catalytic steam-generation system is for use in rapid thermal, oxidation, and photoresist removal processes. Designed to perform a variety of 200- and 300-mm applications, the unit improves polymer and postetch residue removal in BEOL dry-clean applications, including photoresist strip over low-k materials. The tool also can be used in postetch advanced surface passivation processes. It relies on a low-temperature (<300°C) catalytic process to generate steam. The result is a highly reproducible steam supply that can be customized to accommodate a wide range of process requirements. Because it eliminates concerns over metallics and corrosion, the system reduces the risk of defect generation. A typical system measures 1 X 1 ft.

Atomic Force Microscope

Veeco Metrology Group

Santa Barbara, CA

The Dimension X3D in-line metrology tool, a nondestructive, automated atomic force microscope that provides 3-D resolution for high-volume semiconductor fabrication, can thoroughly characterize 90-nm and smaller device features in photolithography and etch processes. The system performs in-line x, y, and z measurement, allowing users to gather detailed data on contact holes, vertical and reentrant sidewalls, line edge roughness, and photomask features. These measurements are not affected by the multiple layers of materials on the wafer, enabling production of demanding gate and shallow trench isolation structures. The system provides accurate feature-shape control, sidewall scans, and width and depth analysis of CDs with high repeatability and resolution.

Film-Thickness Measurement

Tevet

Yokneam Moshava, Israel

The IsTMS system performs integrated or in situ thickness measurements on thermally grown or CVD-deposited silicon oxide and silicon nitride films, photoresist, spin-on dielectrics, low-k dielectrics, and other transparent layers. The system integrates the metrology module directly into the processing equipment. It relies on rapid, broadband Fourier transform spectral analysis using optical sensors positioned above the wafer. Multipoint measurements are performed simultaneously. Large-measurement spot size, rapid signal acquisition and analysis, and proprietary algorithms enable dynamic measurements on static wafers or during linear or rotational motion. Measuring is immune to noise, vibration, or inaccurate positioning, eliminating the need for vibration isolation, autofocus, pattern recognition, or accurate stage movement.

Phase-Shift Mask Monitoring

n&k Technology

Santa Clara, CA

A metrology tool is suitable for characterizing chromeless phase-shift masks and advanced reticles in a production environment. The 1512-RT TMS uses a rapid, nondestructive optical characterization method to simultaneously measure the phase shift and trench depth of chromeless phase-shift reticles. It also can measure the etch-depth characteristics of MoSi on quartz. When trenches are etched into the quartz substrate to create an alternating-phase layer in phase-shift reticles, the depth of the trench determines the amount of phase shift, which must be monitored for correct depth and uniformity. In contrast to expensive or time-consuming methods such as AFM, SEM, or UV interferometry, the 1512-RT TMS can determine trench depth and phase shift at 193 and 248 nm without the need for a special test site. Measurements take only 3 seconds per measured site, and a full uniformity map can be obtained in 2 to 3 minutes.

Bottom Antireflective Coating

Brewer Science

Rolla, MO

Imbarc is a spin bowl–compatible, wet-developable bottom antireflective coating (BARC) suitable for 248-nm implant and front-end processes. The coating is specially formulated for thin photoresist implant applications. Imbarc's optimized substrate reflectance control capability helps to obtain the smaller geometries that result from shrinking critical dimensions. Because the ARC layer eliminates the etch step from the microlithography process by developing Imbarc simultaneously during photoresist development, higher throughput can be achieved. Imbarc is soluble in common photoresist solvents and can therefore be used in the same bowl as the solvents.