The MicroStar, a cooled-water-vapor high-vacuum pump, uses Stirling cycle technology instead of the usual Gifford McMahon (GM) cycle, allowing a much smaller compressor to be connected to the cold panel. Compared with the 3000-W power consumption needed to drive a typical GM-cycle pump, the MicroStar consumes <200 W. Because the unit does not use costly helium hoses or large compressors, space savings and reduced installation times are possible. A patented regeneration cycle eliminates heaters during regeneration, offering further cost savings and simplification. The pump and compressor package have an operating time between maintenance cycles of 40,000 hours.

An ultraprecision pancake-style load cell with a pull plate and calibration adaptor, the Model 48 ensures high repeatability when used in a test frame. The load cell is calibrated and traceable to NIST, making it suitable for most high-accuracy applications, including in metrology processes and as a reference standard for calibrating other load cells. The tension/compression load cell offers low creep and delivers accuracy to 0.02% in loads ranging from 250 to 100,000 lb. The standard output is 4 mV/V for ranges >5000 lb, with an excitation of 10 V dc. The unit has amplifier options to provide 4–20 mA or ±5 V dc output. Operating temperatures range from –65° to 200°F, compensated from 0° to 150°F. The load cell is welded and manufactured from 17-4 PH stainless steel.

The Bandit thermal processing system is a horizontal furnace for small-batch, LPCVD, and atmospheric processes. Used for MEMS, optoelectronics, and semiconductor applications, the unit can handle reduced or variable load sizes, accommodate a mixture of high- and low-temperature requirements, and provide many process options per tube level. By incorporating a patented heating element technology, the furnace can maintain high temperature uniformity while consuming lower levels of power and gas than conventional production furnaces. With its small footprint, mirrored finish, and stainless-steel uniframe construction, the system is suitable for cleanroom environments. It allows for front and end access to internal gas components, has doors with safe viewing windows at each level, and provides 180° access to the source end of the tube and other components. (Semicon West, S.F., South Hall, Booth 1326)

The Swam Blast Micro sandblasting tool performs wafer cutting, contouring and edge rounding, surface texturing, and other processes. The tool works by introducing microabrasive powder into a controlled stream of compressed gas to a manually or automatically positioned miniature nozzle. (Semicon West, S.F., South Hall, Booth 1107)

Designed for handling a variety of liquids in the semiconductor industry, SYGEF PVDF HP Flex tubing is a cost-effective alternative to transporting ultrapure water and chemicals with PFA and FEP resin-based tubing systems. The PVDF tubing is constructed from a special resin, resulting in a flexible material that is suitable for installations in areas where space is a factor. A complete range of tubes and fittings is available in 1/4-, 3/8-, 1/2-, 3/4-, and 1-in. sizes. The tubing can handle operating pressures of 150 psi and the high temperatures associated with hot UPW systems. (Semicon West, S.F., South Hall, Booth 409)

Used for semiconductor applications, the SE300 extended metrology system is based on spectroscopy ellipsometry. The unit provides high precision and accuracy in thin-film and material measurement for DUV (193-nm) processes on 200- and 300-mm wafers. Covering the 600- to 6000-cm^–1 range, the IRSE300 addresses a new range of applications: control of materials composition in low- and high-k processes, copper seed and barrier layers, doping profiles in epi layers, SiGe heterojunction bipolar transistor applications, ultrashallow junctions, deep trenches, poly recess, and contamination control. With a microspot of 100 x 300 µm and a minimum throughput of 15 wafers per hour, the IRSE300 has been adapted to meet mass production requirements of the semiconductor industry. (Semicon West, S.F., North Hall, Booth 6807)

The NitroGen miniature liquid-nitrogen (LN₂) generator helps solve the multiple problems of cryogen availability, transport, inventory, and handling. Because many types of fab equipment are dependent on a continuous supply of LN₂, the issue of availability can become critical. Where existing fab facilities have no provision for plumbed-in LN₂ or where physical layouts make the internal movement of dewars difficult and time consuming, the NitroGen system can generate LN₂ when and where it is needed. Automatic filling of fab tools eliminates manual handling of this dangerous cryogen, thereby reducing the risk of worker injury. Available in several configurations with generating capacities ranging from about 9.6 to 58 L/day, the unit offers reduced particle contamination and high uptime levels. (Semicon West, S.F., North Hall, Booth 5726)

An industrial excimer laser for micromachining applications can be used for mask and wafer inspection purposes. The Novatex laser delivers stabilized output energy of 16 mJ at 248 nm and has average output power of 16 W at 1 kHz. It has high-quality gas and optical components and offers long tube lifetimes. High optics lifetimes are achieved by employing a purgeable beam shield. The laser offers an improved fluorine-optimized NovaTube, which extends system uptime and decreases operating costs. (Semicon West, S.F., North Hall, Booth 6562)

The Ultra DI 30 is a liquid particle counter that can size and count particles as small as 0.03 µm. The product line monitors particle contamination in ultrapure water systems. Its large sample volume provides large amounts of statistical data (1.2 ml/min), and cosmic ray elimination has been added to the instrument for ultralow zero count, improving measurement precision in ultrapure DI-water systems. Because of its 4–20 mA communications system, the system can be easily integrated into existing facilities management systems, while Ethernet communications use existing networks, lowering the cost of ownership. Process control is accomplished with Facility Net software, which provides alarm settings, status conditions, sensor setup, and on-line help. (Semicon West, S.F., North Hall, Booth 6154)

Glove liners knitted from 100% continuous-filament, polyester offer maximum softness, comfort, and protection during extended periods of glove use in critical environments. BCR half-finger liners provide comfort without sacrificing tactile sense in the fingertips. They also protect hands from excessive perspiration and skin irritation. BCR full-finger liners offer total protection from irritation caused by latex and PVC gloves. BCR heavy-weight full-finger liners are for wear in temperature-controlled areas, providing protection, comfort, and insulation under extreme conditions. All liners are constructed using a seamless technique to keep gloves from unraveling and releasing unwanted particles. The liners are ambidextrous and can be laundered for multiple reuse.

DUO, a sacrificial organo-siloxane-based polymer, meets the lithographic and etch requirements of advanced patterning applications. The material has bottom antireflective coating capabilities and can be used for fill and local planarization of topography. Designed with an inorganic polymer backbone, the coatings possess intrinsic etch selectivity to organic photoresist. Their tunable etch rate offers high process flexibility. With 248- and 193-nm formulations, DUO coatings absorb light passing through the photoresist layer. Absorption is required to remove scattered light reflecting back up into the photoresist, improving the photolithographic process by eliminating standing waves, jagged edges, or reflective notching. The result is improved CD control. (Semicon West, S.F., North Hall, Booth 5843)

Based on the five-axes-controlled Mag 2000, mag pumps meeting the needs of 300-mm semiconductor manufacturing have been optimized for high gas flows under typical processing conditions. A temperature management system can be set to 100°C, which is important for metal etch processes to avoid particle accumulation inside the pump. The pump is equipped with a purge valve containing an integrated pressure reducer, which permits the use of nitrogen supplies ranging from 1.5 to 6.0 bar. All pump models can be operated with the Mag Drive digital controller. Pumps and controllers can be changed independently without matching or tuning. All accessories such as purge/vent calves and the temperature management system are integrated into the pump and operated by the controller. (Semicon West, S.F., South Hall, Booth 1626)

Designed for EH- and EZ-series pumps, the PosiFlow sensor detects the flow of liquid output by the pump, which verifies that the metering pump is moving liquid and has not lost prime. The sensor operates without moving parts. The pump's standard flow path is preserved so that the liquid does not go through gears or move a magnet to actuate a pulse in the sensor, thus eliminating plugging or jamming. The unit's output signal stops if the pump loses prime, is in a dead-head condition, or loses pressure because of a broken discharge line. An input device can be configured to interpret sensor signals in numerous ways, including as totalization, no-flow alarm, or drum refill notifications. (Semicon West, S.F., South Hall, Booth 916)

An ammonia-stabilized colloidal silica slurry can be used in both shallow-trench isolation and interlayer dielectric polishing applications. With an average particle size of 40 nm, Ascend slurry contains low levels of metals and sodium and is recommended for CMP applications that may be sensitive to those impurities. The slurry has been tested and proven on both single- and multiplaten tools in the company's laboratories and at customer sites. (Semicon West, S.F., North Hall, Booth 5568B)

An endpoint detector uses nondispersive infrared technology to precisely and automatically determine the end point of the cleaning cycle in CVD chambers after wafer deposition processes. The Opti-Sense 4000 accurately measures silicon tetrafluoride (SiF₄). SiF₄ concentration during the cleaning cycle is a proxy for the amount of SiO₂ present in the chamber and can be used to determine the end of the cleaning process. The endpoint detector optimizes clean-cycle times and the use of costly NF₃ by automatically detecting clean-cycle end point independent of process recipes. Wafer scrap, resulting from under- or overcleaning, can therefore be minimized. The system has no moving parts, is compact, and features corrosion-resistant windows. (Semicon West, S.F., North Hall, Booth 5161)

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