The Model 1600DSA stepper, designed to meet the needs of the nanotechnology market, is based on the 1X 1000-series product line. The fully automated stepper offers 0.8-, 1.0-, and 2.0-µm-resolution lens options. High wafer plane irradiance improves process throughput, especially for thick resists, while low reticle expenses lead to a low cost of ownership. The tool has dual side alignment (DSA) capability and uses direct vision technology. Based on a proprietary machine vision alignment system, direct vision incorporates an off-axis microscope, which is capable of viewing images on the back of the wafer while exposing features on the front. The tool is supported by a worldwide service and support network. (Semicon West, S.F., South Hall, Booth 2516)

Bung Plug

The 2-in. FluoroPure PE bung plug is used with FluoroPure 55-gal HDPE drums for the safe transport of corrosive chemicals. Made of polyethylene material, the plug has a seal retainer that self-aligns to prevent leaks in the drums. It is compatible with tamper-evident covers, which protect chemicals from accidental altering during transportation or staging. A vented option is available for customers who transport chemicals such as hydrogen peroxide, which require a venting system. The single-piece vent design eliminates the need for a separate 3/4-in. vent plug, reducing the possibility that leak paths or entrapment areas will form. (Semicon West, S.F., North Hall, Booth 5944)

Metrology System

Combining a simultaneous multiple angle of incidence laser ellipsometer and an integrated DUV reflectometer with a photomultiplier detector, S200/S300-ultra metrology systems can characterize nitrided gate oxides. Measurements of thicknesses and nitrogen concentrations of dielectric films of 15 to 20 Å can be performed accurately and repeatably. The system also can characterize high-k materials such as ZrO₂ with the throughput and repeatability required for production monitoring. By combining the company's Pulse technology for opaque film measurements and transparent gate measurement techniques, the system can precisely and reliably characterize metal electrode gate stacks. The same combination of techniques makes it possible to measure SiGe thickness, Ge concentrations, Ge profiles in graded layers, local stress in the SiGe lattice, and dopant concentrations. (Semicon West, S.F., South Hall, Booth 1915)

300-mm Single-Wafer Handling

The Swifter is a user-friendly system for single-wafer handling of hand-carry (rush, monitor, test, engineering, send-head, or rework) lots in automated batch-wafer production lines. The unit is a small-footprint cart filled with one loadport adapter and up to four of the company's FOUP-for-One single-wafer pods. The integrated system enables rapid delivery of 300-mm wafers anywhere without the use of an automated batch delivery system, allowing final users to cut cycle times of hot lots, metrology wafers, and calibration wafers. The SEMI E103-compliant system can extract or return wafers from any 300-mm wafer sorter or process tool. (Semicon West, S.F., Gateway, Booth 3125)

Low-k CVD Units

Planar 300 low-k dielectric CVD units are 200/300-mm bridge tools with up to six process modules, dual robots, and standard FOUP or SMIF interface capability. The Planar 300Ci is configured for Orion ultra-low-k processing of copper damascene dielectrics. Orion low-k dielectrics have k values to <1.9 and contain copper diffusion barrier and etch stop materials. The dielectric enables 45-nm production. The robust, mechanically strong, and chemically resilient dielectrics can be integrated with standard plasma etch, clean, and copper polishing interconnect module technologies. The Planar 300Ai is configured for low-k Flowfill processing of aluminum metallization dielectrics. Flowfill low-k materials have k values as low as 2.5 and are used in gap fill and planarization processes. The Planar units have throughputs of up to 100 wafers/hr. They are fully compliant with all SEMI 300-mm factory automation standards, providing recipe upload/ data download capability and wafer batch delivery from overhead or rail-guided vehicles. (Semicon West, S.F., North Hall, Booth 5960)

On-Site Gas Sources

Arsine (AsH₃) and germane (GeH₄) dopant gas sources avoid the hazards and storage limits of compressed gas cylinders. The small on-site gas generators can be placed next to a process tool and produce ultra-high-purity gas from refillable canisters made of solid starting material. Unlike compressed gas cylinders, the source canisters do not have storage limits. They internally blend arsine or germane with hydrogen to provide mixtures with 250-ppm accuracy. This on-the-fly blending offers flexibility and eliminates delays caused by having to order calibrated gas cylinder mixtures. Unlike subatmospheric sources, the gas generator output pressure can be adjusted from subatmospheric to 30 psig. This pressure rating increases the units' compatibility with mass-flow controllers. The source canisters are safe enough to be shipped by air.

Wafer Transfer System

YCAR is an automatic, multicassette system for transferring 150- and 200-mm wafers to and from plastic carriers and quartz or silicon carbide boats. The system features a compact, carousel-shaped platform with up to 12 carrier positions. After flat alignment, wafer counting, and rotation, the unit automatically loads 25 or 50 wafers into boats. Test or dummy wafers are loaded separately from a dedicated carrier to their appropriate positions in the boats. The system generates low particle levels and has a wafer breakage rate of only 1 in 250,000. Carriers can be positioned to the side or in front of the system. Typically transferring 300 wafers in 8 minutes, the YCAR reduces cycle times, since flat alignment and wafer counting are performed in masked time. The system measures 136 cm wide x 130 cm high x 100 cm deep. (Semicon West, S.F., South Hall, Booth 2207A)

Liquid-Level Switches

Pointense LL-10-series liquid-level switches replace mechanical float-type liquid-level devices for high- and low-level alarms, pump protection, and auto-fill/auto-empty operations. Using ultrasonic technology and solid-state surface-mount integral electronics, the switches function reliably in virtually any liquid, eliminating the stickiness and failures that mechanical float-type switches suffer after extended use. With epoxy-sealed electronics, the switches have 1/2- or 3/4-in. NPT standard mechanical connections and are available in 316 stainless steel and Tefzel to meet a wide spectrum of difficult environmental applications. Customized special versions for OEM applications are also available. The switches run on 6 to 30 V dc input power and have transient reverse polarity protection. Two-wire-loop power, relay, and source or sink current output types are available.

Digital Control Monitor

The SmartMax II stand-alone digital control monitor performs area monitoring of hazardous gases and vapors. Each unit continuously monitors the readings from as many as four same-type sensors. Monitoring multiple sensors enables users to lower the cost of gas detection because there is less equipment to buy, install, and maintain. The monitor works with a wide range of sensors in many different applications, including combustible gases, toxic gases, hydrocarbons, and oxygen. The unit comes equipped with a 4–20-mA analog output and an RS-485 serial port. It has three onboard programmable relays and runs off of ac or dc power sources.

Motion and Machine Controller

The BX2 is a highly integrated, 64-bit, RISC-based, multitasking, Ethernet-capable motion and machine controller. About the size of a cigar box, the unit contains up to 8 axes of control, up to 6 onboard drives supporting various servo technologies up to 1600 W, and 46 onboard digital input/ output points. The controller's real-time operating system includes a comprehensive set of easy-to-program motion control features. A powerful syntax-free programming environment simplifies robust applications development and tool integration. A built-in Ethernet supports as many as 56 axes of controller networking and a variety of external I/O expansion modules.

Moisture Standards

Trace Source moisture permeation tubes supply standards for applications requiring moisture levels from 5 ppb to 1%. The tubes offer reliable calibration standards for critical, low-level moisture analysis. Applications include quality assurance for high-purity gas users, process streams where moisture levels are critical, and analyzer upkeep where moisture sensors need moisture to remain functional. Common levels include 200 ppb, 600 ppb, 1–2 ppm, and 3–4 ppm, all of which are compatible with self-calibrating analyzers. At customary dilution flow rates, disposable permeation tubes generate moisture levels up to 30 ppm, while refillable permeation tubes generate moisture levels from 50 ppm to 1%.

X-Ray Diffraction Tools

X-ray diffraction tools for wafers measure epitaxial and nonepitaxial film thicknesses, compositions, and layer roughnesses with high accuracy. Other substrate parameters such as porosity, texture, and stress can be measured as well. The systems use the company's X-Ray Microsource, which provides high x-ray flux on sample spots ranging in size from 500 x 500 µm down to 100 x 100 µm, which makes the tools suitable for performing nondestructive point measurements on monitor wafers and dedicated product wafers. Models are available for automated 300-mm fab lines or for compound semiconductor companies. All systems can be equipped with software for system control and data analysis and are compatible with such front-end modules as FOUPs, SMIFs, or open cassettes.

Liquid-Flow Sensors

Designed as an electronic alternative to ball-and-tube rotameters, Model 106F liquid-flow sensors precisely measure flow rates down to 15 ml/min. Their Teflon, Kalrez, and sapphire construction ensures that they are compatible with most chemicals used in semiconductor applications, including hydrofluoric acid, CMP slurries, and photodeveloper solutions. The sensors have ±1% linearity (full scale) and ±0.2% repeatability (full scale), offering accurate readings in critical applications. Seven different power and output configurations are available, including analog and pulse. An advanced sensor design ensures precise flow measurement with no particle generation or contamination. (Semicon West, S.F., Esplanade, Booth 4426)

Pneumatic Diaphragm Pump

With a maximum nominal capacity of 10 L/min, the SL 10 self-priming pneumatic diaphragm pump is used for applications involving small volumes of liquids. Liquid flows through the product chambers of the center housing, while the air control system and air chambers are located on the side. This design ensures that one part of the housing contacts the liquid, reduces the number of flow bends to two, and minimizes the surface area. There are no sliding parts in the product chambers, and gaskets are used to dispense liquid, reducing particle generation. The corrosion-resistant unit can deliver acids and caustics. Its smooth, pore-free PTFE-TFM housing parts offer universal resistance to chemicals. The pump is metal-free and can be used in temperatures up to 200°C.

Substrate-Bonding Machine

The Asigs 200, a semiautomatic substrate-bonding machine, performs silicon-on-anything process development and can transfer silicon circuits to glass and other insulating materials. Developed primarily for transfer of 200- and 150-mm wafers, the unit can produce 25 fully bonded wafer units per hour. It aligns silicon and glass wafers to within 0.1 mm of the wafer edge and bonds them with UV-sensitive adhesive. The adhesive is deposited onto the wafers while they are pressed together and rotated, eliminating potential air bubbles and ensuring that the silicon structures are uniformly coated. The adhesive layer is cured with UV illumination and a controlled temperature stage. The tool has a user-friendly interface and real-time display of process parameters.

Wafer-Handling Software

An upgraded software package for the RC-2005 and RC-3005 wafer-handling alignment systems enhances system efficiency. The upgrades are designed for engineers who must assess robot arm position and achieve precise, repeatable alignment settings for different robot types and tool sets. The software helps determine a robot's alignment, find optimum teach values, and transfer those values to other robots. When used for predictive-maintenance purposes, it can track alignment data over time, support trend analysis and early warning of failures, produce numeric readouts supporting robot adjustment, engage Auto-Run software to accelerate system start-up, and upgrade paths to extend software usability over a wide range of robots. (Semicon West, S.F., North Hall, Booth 5003)