MICRO's Top 40 Product All-Stars for 2000 continued...

Relief Valve

Plast-O-Matic Valves

Cedar Grove, NJ

A high-flow 3-in. NPT relief valve for corrosive and ultrapure liquids also serves as a back-pressure regulator and bypass valve. The Series RVTX angle-pattern valve is made of Grade 1, Type 1 PVC and comes with a choice of Viton or EPDM elastomeric seal. It can be customized or made of other materials as needed. The valve opens rapidly, providing high sensitivity to changing pressure. A stainless-steel control spring does not contact the liquid. Relief or back pressure is adjustable between 5 and 100 psi, and maximum flow is 200 gal/min.

Spin Processor

SEZ Group

Villach, Austria

Designed for wafer cleaning and thinning applications, the 304 spin processor 300-mm platform complies fully with SEMI 300-mm automation and communications standards. Seen as a replacement for batch wet-bench applications, the spin processor performs backside film removal preceding advanced lithography operations and provides silicon stress relief for die-strength enhancement in thinning operations. The spin processor can thin frontside film for 50-Å gates, clean the bevel, and remove postetch residue or polymer. It can also remove metallic, copper, organic, particulate, and other backside contaminants. The process tool incorporates an object-oriented, multitasking Windows NT software platform that facilitates factory integration.

Dry Process Pump

Alcatel Vacuum Technology

Hingham, MA

ADP/ADS Series Two semiconductor process pumps are based on multistage Roots technology. The dry pumps feature a nitrogen mass-flow sensor and standby purge function, and they provide precise temperature control and power-failure protection. They have a smaller footprint than predecessors and offer improved backup management. Fully SEMI S2-93 compliant, the pumps are available with flows ranging from 112 to 1150 m³/hr.

Surface-Mount Gas Delivery System

Syncro Vac

Milpitas, CA

A surface-mount gas delivery system features built-in secondary containment, enabling it to be used with hazardous and toxic materials such as those involved in CVD processes. Made of Type 316L stainless steel, the Cube features multiple gas streams and has a modular design to ease installation and provide access to problem areas. Conventional C-seals are used for primary containment, while fittings for secondary containment use standard O-rings. A contaminated area of the system can be disassembled, cleaned, electropolished again, and refitted without involving the entire assembly. The Cube has a snap-in block system that uses easily changed-over heating
cartridges to ensure precise temperature control throughout the gas stream.

Process Control Software

Yield Dynamics

Santa Clara, CA

MAPAppc advanced process control (APC) software enables users to meet the overlay threshold required for the achievement of 0.12-µm design rules by means of mix-and-match lithographic methods. Using modeled control parameters, it allows any lot to be directed to any capable exposure tool. The software automates the calculation of exposure tool alignment settings prior to exposure and automatically compensates for reticle, tool-matching, and process errors, thereby minimizing rework and maximizing exposure tool capacity. The software is an upgrade of the manufacturer's MAPA (model automated production applications) APC software.

CMP Slurry Cleaning Systems

Texwipe

Upper Saddle River, NJ

Chemical-mechanical planarization (CMP) residues can be removed from process tooling and environmental surfaces by a pair of CMP slurry cleaning systems. The first system, for removing residues from ferric-based CMP tungsten slurries, consists of AlphaWipe polyester wipers prewetted with a cleaning agent and ultraclean Honeycomb 10 polyester wipers prewetted with 3% TexPure solution to remove the last traces of ferrous oxide from the slurry. The other system, used for removing residues from oxide slurries, has three parts. The first, consisting of prewetted nylon wipers, redisperses the slurry; the second removes very hard deposits of oxide slurry; and the final wipedown matches the last stage of the tungsten system. Each element of each system comes in a package that can be wiped down before introduction into the cleanroom.

3-D SEM

Applied Materials PDC Group

Santa Clara, CA

Designed to detect yield-killing excursions early in the process, the VersaSEM 3-D metrology system views images of sidewall profiles down to 0.10 µm. Resolution of the slope is up to 10 times greater than that of existing scanning electron microscopes. Stereoscopic sidewall imaging gives operators a view of the slope and shape of the most advanced device features, including high-aspect-ratio contact holes and trenches, that is unavailable with top-down CD SEMs. Unlike cross-section SEMs, the instrument allows operators to quickly monitor wafers between steps and alert users to process problems. Corrective cycle time can be reduced from hours to less than one minute. The tool's in-line capability can also eliminate the need for test wafers. Because maintaining slope shape is important to prevent voids in dual damascene structures, the microscope is suitable for use with copper processes. The 3-D system features automated operation, shared database capability, and off-line programming. The instrument's MTBF rate is >1500 hours, and it accommodates both 200- and 300-mm wafers.

Flame Detector

Ansul

Marinette, WI

A Factory Mutual­approved flame detector is targeted for use in semiconductor cleanroom or wet-bench applications. The microprocessor-controlled DCR1 uses a combination of ultraviolet and infrared technology to detect programmed flame signatures and rejects such false sources as sunlight, fluorescent and incandescent lights, flashlights, and infrared heaters. When the flame conditions of the system algorithm are met, the detector signals the control unit of a fire suppression system that is part of the complete detection and suppression package. The sealed polypropylene detector housing has an IEC 529 IP 67 rating. Its surfaces are smooth, nonshedding, scuff resistant, and accessible for wipedown.

Microwave Analyzer

CEM

Matthews, NC

Designed for ultratrace contamination detection, the CleanSTAR microwave analyzer system automatically prepares samples of ultrapure chemicals, water, and other raw materials for parts-per-billion and parts-per-trillion analysis. The instrument reduces the time needed for matrix reduction and can manage large or small sample volumes. Its autodetect software determines dryness and prevents samples from burning. Each of the analyzer's vessels has its own vacuum line and HEPA-filtered or pure nitrogen air inlet.

Teflon Process Bath

Lufran

Streetsboro, OH

The Etch-Tech cascading process bath with all-Teflon inner and outer tanks can replace existing quartz baths or be installed on new wet-chemistry stations in place of breakable quartz baths. The bath accommodates two 5- or 8-in. cassettes and can be heated up to 180°C. It interfaces with remote pumping or filtration systems and can be used with either an in-line Teflon heater or an immersed bottom heater, both of which can be quickly replaced without the need to remove the entire tank or send the system to the manufacturer. A Teflon midframe assembly with H-
pattern sparger rails ensures that the inner tank remains level and that bath temperature is uniform.

Nanoscale Profilometer

Surface/Interface

Sunnyvale, CA

The SNP 9000 nanoscale stylus profilometer performs two- and three-dimensional measurement of critical dimensions for photomask metrology and mask-repair characterization. The instrument nondestructively measures and characterizes clear and opaque defect repairs made by focused-ion-beam (FIB) systems and provides information about the dimensions and shapes of complex mask features in order to facilitate the repair process. Z-axis information from the system makes possible the more precise direction of FIB repair end-pointing of quartz bumps. Measurements can be made on such insulating materials as quartz without the charging problems associated with electron-beam techniques.

UHP Pressure Transducer

Setra Systems

Boxborough, MA

The Model 217 pressure transducer for monitoring specialty gas processes in high-purity gas delivery systems and semiconductor process tools can be installed on a modular block-type gas stick or panel. Featuring stable, reliable variable-capacitance sensing technology, the transducer has a down-mount C-seal pressure fitting and a small swept sensor chamber of electropolished Type 316L stainless steel for contaminant-free operation and system purging. Pressure ranges from 0­25 to 0­3000 psi in gauge, absolute, or compound pressure are available. Bar ranges from 0­7 to 0­200 bar are also offered. Accuracy is within either 0.25% of full scale or 1.0% of the reading.

Wafer Transport Robot

Asyst Technologies

Fremont, CA

Featuring a sealed-for-life, direct-drive gear system, the Axys 407 atmospheric robot provides reliable, repeatable wafer transfer into and out of process tools. The robot incorporates four field-replaceable subassemblies for easy maintenance, while the reduced number of parts makes possible an MCBF of >10 million cycles. Compatible with better than Class 1 environments, it can move either 200- or 300-mm wafers from any position in a wafer carrier into the process station or loadlock of any process tool. Proprietary software enables the robot to move wafers from two front-opening unified pods without the need for a horizontal linear track. The system is also offered as a drop-in replacement.

Copper-Cleaning Products

Arch Chemicals

Norwalk, CT

The Microstrip 6000 series, a line of photoresist stripper and postetch residue cleaner products, was developed for use with copper low-k dielectric dual-damascene interconnect architectures. The safe, completely water-based cleaning formulation can be released into the industrial waste stream and eliminates the need for intermediate rinse steps. The products can remove residues without any detrimental effect on low-k dielectric and barrier layer materials.

Static-Dissipative Linear Slides

Del-Tron Precision

Bethel, CT

Precision ball slides, crossed roller slides, and ball and crossed roller multiaxis positioning stages are available with an electroless-nickel coating to allow static charges to dissipate. The plating, a noninsulating alloy of nickel and phosphorus, provides a conductive path to the grounding apparatus. The linear motion devices meet ESD requirements for automated semiconductor production equipment. They are plated in accordance with ASTM standard B 733-97.

Vacuum Valves

MKS Instruments

Boulder, CO

V-100-series 4-in. vacuum valves are available in angle and in-line versions and in custom forms to suit specific needs. The bellows-sealed poppet valves have a body made of Type 304 stainless steel, ensuring a low leak rate. Their formed bellows resists particle damage. The valves can be operated manually, pneumatically, and electropneumatically. A limit-switch option and a choice of flanging, seals, and solenoid voltages support customization.

Ash-Residue Remover

J. T. Baker

Phillipsburg, NJ

An 80% aqueous ash-residue remover cleans a wide variety of metal-organic residues from substrates, including copper and low-k dielectrics. REZI-38 is compatible with standard postash residue-removal equipment and can be used in automatic spray processing equipment or in a simple one-bath process. No special rinse is required. Offering a typical processing time of 5­10 minutes, it is effective at temperatures between 23° and 45°C. The residue remover contains no SARA 313­specified components or hazardous air pollutants and has a concentration of volatile organic compounds below 5%. Because of its high water content, the chemical can be disposed of down most acid drains.

Post-CMP Cleaner

Steag Electronic Systems

Pliezhausen, Germany/Austin, TX

The DamasClean post-CMP cleaner can be used as either a stand-alone 200-mm wafer cleaning tool or an integrated CMP cluster module. The tool features multiple cleaning mechanisms, modular architecture, standard robotics, and flexible process flow. Wafers are processed in a horizontal orientation, which permits front- and backside treatment as well as fast wafer handling. The system can be configured for either one-cassette serial processing or two-cassette parallel processing; the parallel option allows two post-CMP cleaners to be integrated into one tool.

IPA Drying System

AIO

Fremont, CA

The Sonic Fog liquid-phase isopropyl alcohol system can completely dry substrates ranging in size from 50-mm wafers to 1-m² glass panels used in making semiconductors, disk drives, and flat-panel displays. The process involves using liquid IPA at room temperature along with the application of ultrasonics. The drying system produces a low level of chemical emissions and consumes IPA efficiently.

Deep-UV Excimer Laser

Gigaphoton (formerly Komatsu)

Cypress, CA

The G21K excimer laser is designed for use with high-numerical-aperture stepping and scanning lithography systems in the mass production of silicon chips with 0.13-µm geometries. The 2-kHz deep-UV laser features a 0.5-pm bandwidth to satisfy the critical chromatic aberration correction requirements of a high-numerical-aperture lens. It also offers an energy-dose stability of 0.35%, making the laser light source suitable for use with scanners and steppers. The narrow-band laser has a chamber life expectancy of 10 billion pulses.

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