BUSINESS/TECHNICAL PROGRAMS

The following is a partial listing of the business and technical programs taking place at Semicon Southwest in Austin, TX. The events take place at the Austin Convention Center. The information was correct at press time; for the latest updates, log onto http://www.semi.org.

SUNDAY, OCTOBER 15

8:00 a.m.­5:00 p.m.

Semiconductor Processing Technology

Instructor: Peter Gwozdz, San Jose State University (continues on Monday, October 16, and Tuesday, October 17)

9:00 a.m.­5:00 p.m.

Winning Customer Satisfaction through Customer Loyalty

Instructor: Jack Rodgers, Business Management Systems (continues on Monday, October 16)

MONDAY, OCTOBER 16

9:00 a.m.­5:00 p.m.

A Partnership for PFC Emissions Reductions (cosponsored with SIA, SSA, International Sematech)

Chairs: Laura Mendicino, Motorola; and Mike Mocella, DuPont

Session 1: Global Perspective on Industry Activities

MOU-2 Update
Sally Rand, U.S. EPA

Japanese R&D Project for PFCs Emission Reduction from CVD Chamber Cleaning Process

Tsuyoshi Takaichi, RITE

Analysis of IPCC Emissions Estimating Methodology

Laurie Beu, Motorola

Session 2: Etch Alternatives and F^₂ Issues

Evaluation of C^₄F^₆ for Dielectric Etch for Reduced PFC Emission

Ritwik Chatterjee, MIT

Fluorine Gas: Safe Packaging & Application of a Nonglobal Warming Gas for Semiconductor Materials Processing

Josep Arnó, Luping Wang, and Terry Tabler, ATMI

Analysis of the Fate of F^₂ Emissions from NF^₃-Based CVD Chamber Cleans

Victor Vartanian, Motorola

Session 3: End-User Chamber Clean Studies

Direct Performance Comparison of In Situ PECVD Chamber Cleaning Gases

Bing Ji, Lei Zhu, and Eugene J. Karwacki, Air Products and Chemicals

Evaluation of Novel In Situ Cleaning Gases for PECVD Tools

Rudi Van San, 3M

A Critical Comparison of Chamber Cleaning Gases and Processes in an Applied Materials PECVD Tool

Charles C. Allgood, DuPont Fluoroproducts

Session 4: Chamber Clean Process Comparisons

Optimization of C^₃F^₈ Clean for an Applied Materials' SACVD Process: Lower MMTCE and Usage

Chin-Tsai Chen, TSMC; and Wen-Hao Liao, 3M Taiwan

PFC Emissions Reduction for Lamp Heated CVD Chambers with Applied Materials Remote Clean Technology

Laura Mendicino, Motorola

Optimizing a Tungsten LPCVD Chamber Clean Process Minimizing PFC Emissions while Reducing Costs

Andrew D. Johnson, Air Products and Chemicals; Frank Weber, Novellus; Wolfram Karcher, Infineon

Closing Remarks

A poster session following the presentations sponsored by International Sematech and Air Products and Chemicals will include oral presentations plus:

PFC Abatement

Joe Sweeney, ATMI-Ecosys; Mike Costabile, Philips; Josep Arnó, ATMI; and Laura Hiscock, ATMI

HAPs Management for PFC Abatement

Joe Van Gompel, BOC Edwards

9:00 a.m.­5:00 p.m.

Lithography Science: An Efficient Look at Lithography Issuses--from Basic to Advanced State-of-the-Art Techniques

Instructor: Harry Levinson, Advanced Micro Devices

TUESDAY, OCTOBER 17

8:30 a.m.­5:30 p.m.

Chemical Vapor Deposition (CVD) for Integrated Circuits

Instructor: Ted Kamins, Hewlett-Packard Laboratories

9:30 a.m.­5:30 p.m.

Integrated Circuit Fabrication Technology and Yield Control Tutorial

Instructor: Ernest Levine, IBM

9:30 a.m.­5:30 p.m.

Semiconductor Manufacturing Science Workshop--Implementing the ITRS Factory Integration Roadmap

Chair: Court Skinner, Semiconductor Research Corp.

Getting the Most Out of Automating a Factory, Realistic Expectations

Dick Deininger, Advanced Micro Devices

Master Planning of Site Water Management

Ralph Williams, IDC

Factory Systems Support for Increased Protocol Requirement--An Enabler for Copper Processing

Eric Christensen, Advanced Micro Devices

Factory Integration Challenges/

Solutions in Advanced Process Control

Alan Weber, KLA-Tencor

Modeling and Simulation Applied to Factory Operations

John Fowler, Arizona State University

Panel Discussion: Tim McDonnell, Knight AT, Moderator

Fab Layout Methodology and AMHS Technology for Extendible, Flexible, and Scalable Integration Factories

Application of Quantitative Techniques to Evaluate Factory Performance

John Plummer, Consultant

Hardware, Software, and Database Pitfalls in Semiconductor Fab Operations

Jim Irwin, Irwin Consulting, Software Management in the Automated Semiconductor Fab

Douglas Scott, PRI Automation

Running the 300-mm Factory at Internet Speed

Charles Baylis, DomainLogix

Realistic Approaches to Productivity Improvements in 300-mm Factories

Randy Goodall, International Sematech

Panel Discussion: Court Skinner, Semiconductor Research Corp., Moderator

Realistic Expectations from Software and Automation Hardware for Production Applications

3:00 p.m.­5:00 p.m.

SEMI Chemical and Gas Manufacturers Group (CGMG) General Meeting

6:00 p.m.­8:00 p.m.

Paradise Island Reception

WEDNESDAY, OCTOBER 18

8:00 a.m.­12:00 noon

Recent Advances in Metrology--in Cooperation with International Sematech

Chair: Alain Diebold, Sematech

Interdependent Evolution of Metrology and Technology

Murray Bullis, SEMI

Optical Metrology for Oxynitride and High K Gate Dielectrics

William Chism, Jesse Canterbury and Alain Diebold, Sematech

CD Metrology by Phase Profilometry

L. Smith, Thermawave; and N. Jakatdor, Timbre

Ultra-High Depth Resolution Profiling of Semiconductor Materials by SIMS

Joe Bennett, International Sematech

Applications of Rapid X-Ray Reflectometry (XRR) to Interconnect Metrology

Bill Johnson, Thermawave

Copper Process Control from Seed to Polish Using Noncontact Optoacoustic Metrology

M. Gostein, M. Joffe, A. A. Maznev, C. J. L. Moore, Philips Analytical; and Alain Diebold, Sematech

8:00 a.m.­12:00 noon

Semiconductor Supply Chain Management Tutorial

Instructors: Adeel Najmi, Jose M. Padillo, and Leslie-Ann Asmus, i2 Technologies

8:00 a.m.­12:00 noon

STEP: Electrostatic Compatibility of Equipment--Applying SEMI E78-0998

Chair: Arnold Steinman, Ion Systems, ESD/ESC Task Force Leader, SEMI International Standards Program

Introduction: The Basics-Static Charge Problems, Electrostatics, Measurement Techniques and Static Control Methods

Arnold Steinman, Ion Systems

ESD Damage to Components

Presenter to be announced

Minimizing Electrostatic Attraction of Contamination

Presenter to be announced

ESD Effects on Equipment

Presenter to be announced

Implementing SEMI E78­0998, User/Manufacturer Collaboration to Achieve the Static Levels in the Guide

Arnold Steinman, Ion Systems

8:00 a.m.­5:00 p.m.

Practical Negotiating Skills for Semiconductor Professionals

Instructor: Robert J. Laser and Stanley N. Sloan, Alliance Management Consultants

1:00 p.m.­5:00 p.m.

Reliability Implications of Changes in Semiconductor Materials--in Cooperation with International Sematech

Chair: Raymond L. Delk, International Sematech

Keynote Address: 50 Years of Oxide Reliability: 1960­2010

David Dumin, Clemson University

Advanced CMOS Gate Dielectrics and Associated Reliability Issues

Tso-Ping Ma, Yale University

Degradation of Thin Oxides Under Electrical Stress

Gennadi Bersuker, Sematech

Challenges of Reliability Evaluation of Gate Oxide Below 2 nm for Microprocessors

Abdullah Yassine, Advanced Micro Devices

Development of a Gate Dielectric Reliability Evaluation Program at International Sematech

George Brown, Texas Instruments

Cu and Cl/Cu Metallurgy. . .Different Animals

James Lloyd, IBM Research Center

1:00 p.m.­5:00 p.m.

Supply Chain Management Workshop--Issues and Trends in the Semiconductor Supply Chain

Chair: Shari Temple, i2 Technologies

Beyond Company Walls--Extending the Supply Chain to Customers and Suppliers

Shari Temple, i2 Technologies

Supply Chain Management at IBM Microelectronics

Barbara Wesolowski, IBM Microelectronics

eBusiness

Dana Parker, Tokyo Electron

Lessons from SCM Implementation Experience

Adeel Najmi, i2 Technologies

B2B For Chip Manufacturers

Charles W. Ferrel, IBM

Panel Discussion

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