CMP System

SpeedFam-IPEC

Chandler, AZ

A chemical-mechanical planarization (CMP) system combines rotational and orbital technologies, providing the stability of an advanced solid polishing platen with the flexibility of orbital system architecture. Designed for logic and ASIC applications, the Momentum dry-in/dry-out wafer processing system integrates four independent polishing platens, cleaning capability, advanced metrology, and automation. The single tool accommodates simultaneous process development and production operation and supports hot-lot processing. It is designed to ease the transition among oxide, tungsten, shallow-trench isolation, and copper applications. The system's front-referenced carrier technology features an edge-tuning design to ensure within-wafer uniformity. A multiprobe, broadband optical end point assures complete copper removal over 100% of the wafer surface.

Dry Pumps

BOC Edwards

Wilmington, MA

A family of dry pumps is suitable for use in 300-mm process applications. Their Active Utility Control design feature minimizes the consumption of power, nitrogen, and water when the pumps are in standby mode. The iH160, iH800, and iH2400 pump models offer capacities ranging from 160 to 2400 m³/hr. The pumps have a footprint comparable to that of pumps for 200-mm processes. They offer high pumping speeds, quiet operation, ease of control, and low cost of ownership for the difficult etch, PECVD, and LPCVD processes used in silicon wafer and flat-panel display manufacturing.

Inspection Systems

August Technology

Bloomington, MN

Two systems added to the NSX series perform high-speed wafer, bump, and die inspection for defects as small as 0.5 µm. The instruments offer enhanced cameras, optics, inspection performance, and illumination capabilities. The NSX-95 for wafer and die inspection and the NSX B-95 for bump inspection can handle as many as 63 8-in. wafers per hour. Because of their accuracy and reliability, these flexible, automated systems compare favorably to manual inspection processes.

Lithography Platform

ASML

Veldhoven, The Netherlands

The Twinscan 300-mm lithography platform will support mass production on 300-mm substrates down to the 70-nm node. The scanner platform uses a balanced-mass high-speed stage to eliminate stage-induced system vibration and improve focus and image contrast. System features that minimize sensitivity to such environmental challenges as temperature variations make imaging of sub-100-nm design rules possible. Ultimate 300-mm-wafer throughput is expected to be well above 100 wafers per hour. The platform is designed to handle 200- or 300-mm wafers and support Carl Zeiss Starlith optics for 365-nm i-line, 248-nm deep-UV, and 193- and 157-nm wavelengths. The first available system in the Twinscan product family is the AT:700S scanner.

Birefringence Measurement

Hinds Instruments

Hillsboro, OR

The Exicor 150AT birefringence measurement system for characterizing optical materials maps low levels of retardation in optical elements such as photolithography components. The system uses photoelastic-modulator technology, a polarization modulation technique, to achieve high sensitivity and provide birefringence magnitude and angle simultaneously. Materials from the ultraviolet to the infrared can be mapped and the data displayed in high-content 2-D and 3-D birefringence images. The system measures the magnitude of retardation of linear birefringence with a sensitivity of ±0.005 nm and the direction of birefringence with an accuracy within 1° for retardation greater than 0.5 nm.

SIMS Tool

Atomika Instruments

Oberschleissheim/Munich, Germany

The SIMS 4600­series secondary-ion mass spectrometry tool performs automated depth profiling and dose monitoring of full wafers up to 300 mm for process control and development. The analytical system provides profiling and dosimetry of ultrashallow junctions as well as conventional dopant distributions. It offers recipe-driven, unattended measurement and operates around the clock with high uptime. The system also features the options of SMIF or FOUP cassette loading and automated analysis of up to 50 samples per load. Ion guns based on advanced FLIG technology are optimized for high performance at both low and high beam energies. The system is configured to meet present and future wafer-diagnostic requirements in both R&D and manufacturing environments.

Feedthrough Actuator

Harmonic Drive Technologies

Peabody, MA

A combination rotary feedthrough and harmonic-drive servo actuator that supplies high-powered, precisely controlled motion within a vacuum chamber is available in two new sizes. The stainless-steel ChamberLink 14 and ChamberLink 32 offer higher torque capabilities than the original ChamberLink system. The size 14 unit is rated at 40 in.-lb of continuous torque at a 70-rpm output speed and can provide accurate positioning of wafers and small cassettes in loadlock, transfer, and process chambers. Rated at 500 in.-lb of continuous torque, the size 32 is suitable for turning indexing platens operating in vacuum process chambers. Because the device has no wall-penetrating shafts that require seals, vacuum leakage is prevented and replacement because of seal failure is not an issue.

XRF Elemental Analyzer

EDAX

Mahwah, NJ

The Eagle II µ-Probe tabletop elemental analyzer combines the Eagle microspot x-ray fluorescence elemental analyzer with the Phoenix energy-dispersive x-ray analysis system. The micro-XRF analyzer uses advanced capillary optics to concentrate an x-ray beam to a 100-µm-diam spot on the sample. The high-intensity optics, 10-mm working distance, CCD video imaging cameras, and motorized x-y-z stage enable the nondestructive, simultaneous multielement analysis of solids, liquids, and powders. Standard features of the Phoenix analyzer include digital signal processing, PCI-bus architecture, user-friendly software, and the Windows NT operating system.

CMP Slurry Cleaning Systems

Texwipe

Upper Saddle River, NJ

Chemical-mechanical planarization (CMP) residues can be removed from process tooling and environmental surfaces by a pair of CMP slurry cleaning systems. The first system, for removing residues from ferric-based CMP tungsten slurries, consists of AlphaWipe polyester wipers prewetted with a cleaning agent and ultraclean Honeycomb 10 polyester wipers prewetted with 3% TexPure solution to remove the last traces of ferrous oxide from the slurry. The other system, used for removing residues from oxide slurries, has three parts. The first, consisting of prewetted nylon wipers, redisperses the slurry; the second removes very hard deposits of oxide slurry; and the final wipedown matches the last stage of the tungsten system. Each element of each system comes in a package that can be wiped down before introduction into the cleanroom.

Particle Detection System

Applied Materials

Santa Clara, CA

The Excite high-speed particle detection system monitors the condition of process tools using either blanket or patterned wafers. Inspecting actual device wafers after processing is completed enables the quick discovery of yield-limiting particle excursions, reduces the need to run monitor wafers, and limits the number of defective wafers in process. The system inspects >60 blanket wafers and >45 patterned wafers per hour. With a small footprint, it provides a high output per unit area. It is most economical for processing 300-mm wafers. Automatic recipe generation allows any system operator to scan new wafer types. The Excite system complements the company's SEMVision defect review system and the Compass inspection system for detecting critical yield-limiting, process-induced defects.

Silicon-on-Quartz Wafers

Soitec USA

Peabody, MA

Quartz wafers coated with monocrystalline silicon offer advantages over polycrystalline silicon on quartz for applications in thin-film transistor (TFT) LCD projection single-valve systems and small flat-panel devices. For example, the wafers feature a low leakage current for the TFT, five times greater mobility, a low threshold voltage, higher resolution because of their smaller TFT, and high brightness. The integration of CMOS drivers on the quartz wafers is easy, which means that the number of connectors on the small displays can be reduced. Wafers made of quartz polished to <3 Å rms are available in 150- and 200-mm sizes and have a 2000-Å-thick monocrystalline silicon film that has no grain or subgrain boundaries. The wafers can be processed in temperatures up to 1050°C.

Yield Management Software

Knights Technology

San Jose, CA

LCD-YM is a software-based system for monitoring, analyzing, and controlling defects during all phases of liquid-crystal-display manufacturing. The yield management system gathers defect data and images from electrical tests as well as from the optical inspection of thin-film transistor substrates and assembled panels. The system then analyzes this information and identifies potential manufacturing problems. The software supports an automated process control loop that integrates all LCD inspection, test, and fabrication equipment within a single plant or across multiple facilities. It automatically flags violations of statistical process control limits and initiates corrective responses.

Linear Motion Guide

THK America

Schaumburg, IL

A lightweight miniature linear motion guide is made of corrosion-resistant stainless steel for cleanroom compatibility. The Type RSR-Z guide uses resin in the construction of its block body to reduce mass, and the areas of passage that are free of loads applied by the balls are molded in resin. Smooth, silent operation results because metal parts do not make contact with one another. The durable motion guide supports loads in radial, reverse radial, and lateral directions.

Flame Detector

Ansul

Marinette, WI

A Factory Mutual­approved flame detector is targeted for use in semiconductor cleanroom or wet-bench applications. The microprocessor-controlled DCR1 uses a combination of ultraviolet and infrared technology to detect programmed flame signatures and rejects such false sources as sunlight, fluorescent and incandescent lights, flashlights, and infrared heaters. When the flame conditions of the system algorithm are met, the detector signals the control unit of a fire suppression system that is part of the complete detection and suppression package. The sealed polypropylene detector housing has an IEC 529 IP 67 rating. Its surfaces are smooth, nonshedding, scuff resistant, and accessible for wipedown.

Brushless Linear Motors

Yaskawa Electric America

Waukegan, IL

The Linear Sigma series for critical motion control applications includes coreless balanced linear motors and two types of iron-core linear motors. The latter type are designed to negate the effects of magnetic attraction between the motor coil and the permanent-magnet linear motion tracks. The motors offer linear thrusts ranging from 140 to 6000 N and come in 24 coil configurations. Combined with Sigma II digital servo amplifiers, they constitute a plug-and-play linear motor system for industrial automation machinery. One range of the product offering provides fully integrated linear positioning slides with linear encoders and amplifiers as an Ethernet-ready motion control system.

Teflon Bellows

EVAC International

Elk Grove Village, IL

Teflon bellows for KF flanges feature the high chemical resistance needed for semiconductor processing applications. Their fiberglass-reinforced flanges offer long service life. Bellows for vacuum or pressure conditions are made from a single piece of material, which minimizes leakage. Standard sizes are KF NW 10­63. Custom versions are also available.

Rapid Thermal Processing Tool

ASM International

Bilthoven, The Netherlands

The Levitor 4000 noncontact rapid thermal processing tool uses gas-bearing technology to process silicon wafers, requiring 5% of the energy consumed by conventional lamp systems and eliminating the cost of consumable lamps. The wafer is supported by gas between two large, heated blocks of refractory material and kept 0.1 mm from the block surfaces. The blocks act as a thermal flywheel for high heating efficiency; because they are good thermal conductors, they ensure that the wafer is uniformly heated. The use of conduction rather than radiation eliminates problematic wafer emissivity variations. Wafer rotation in either direction at speeds up to several hundred revolutions per minute is possible. The high-throughput system offers fast, reproducible heat-up and cooldown rates above 300°C/sec. The reactor can be used in stand-alone mode or as part of a cluster module.

Poly Etch System

Lam Research

Fremont, CA

A high-density plasma poly etch system for advanced sub-0.13-µm devices performs multiple advanced silicon applications in a single chamber, including poly, polycide, metal gate, bottom anti-reflective coating, in situ mask open, and shallow-trench isolation. The TCP 9400DFM can process 46 wafers per hour in three chambers while providing process flexibility and particle control. Its designed-for-manufacture features optimize critical-dimension and profile uniformity as well as machine-to-machine, wafer-to-wafer, lot-to-lot, and etch repeatability. The system provides a maximum time between wet cleans of >20,000 RF minutes. Its broad process flexibility enables the tool to lower the cost of ownership while eliminating encroachments into the active area. TCP 9400PTX chambers can be upgraded to the TCP 9400DFM type to extend product lifetime.

Critical Dimension SEMs

KLA-Tencor

San Jose, CA

In-line critical dimension scanning electron microscopes (CD SEMs) address advanced lithography and etch monitoring needs for the 0.13-µm node and 300-mm manufacturing. The 8200-series CD SEMs for 200-mm wafers and 8400-series tools for 300-mm wafers provide fast, easy system setup. An optional high-precision laser stage interferometer and automated recipe-creation software reduce the time between measurements to 3­5 seconds. A new Windows NT­based platform simplifies setup and makes the system extendable. Advanced productivity and automation features minimize the amount of time engineers must dedicate to programming the system. Charge-equalization capability enables charge-sensitive materials to be measured precisely. Pattern-quality confirmation allows the tools to generate information about feature shapes and multidimensional profiles as well as traditional CD measurement data.

Flow Switches

Malema Flow Sensors

Boca Raton, FL

All-Teflon M-60 and M-200 flow switches with flare fittings can handle the aggressive fluids used in chemical-mechanical planarization (CMP) applications. In-line and right-angle switches come in 1/4-, 3/8-, and 1/2- in. sizes, and manage flows ranging from 3 cm³/min to 10 gal/min. The switches have all-Teflon wetted parts, including a Teflon-encapsulated piston, and their integral flare fittings provide minimal leak paths. The PFA flare compression fittings allow for quick leakproof installation of the switches on CMP and cleaning tools.

Web-Enabled Tool Connectivity

domainLogix

Austin, TX

A Web-enabled software solution based on the SEMI object-based equipment model (OBEM) standard helps resolve 300-mm semiconductor tool connectivity problems associated with SECS/GEM technology. OBEM XP software allows equipment suppliers and their customers to use object-based technologies that support Internet protocols for accessing equipment information; the hierarchical model accommodates cluster tools, diffusion systems, and photoresist coater-developers. The system's rich object model supports a variety of factory communication techniques and is compatible with legacy systems via SECS/GEM. It can be used to manage automation costs by eliminating custom software construction and promoting software reuse at both the tool and factory levels.

Metrology Tool

Schlumberger

Semiconductor Solutions

San Jose, CA

The IVS 135 advanced submicron metrology tool uses a combination of the FSF focus system and a new laser focusing system to provide fast, accurate measurements of overlay features. With enhanced overlay registration capabilities, the tool offers a high level of measurement precision even on such difficult layers as those produced in shallow-trench isolation and CMP processes, where step heights within a layer are small and step heights between layers are high and variable. Adaptive RG metrology software minimizes ramp-up time and accommodates process variations in ensuring accurate, repeatable measurements.

Plasma Etch Tool

Tegal

Petaluma, CA

The i900-series diode plasma etcher for noncritical volume etch applications incorporates advanced logic derived from the 6500 series of plasma etchers to enhance the functionality, productivity, and flexibility associated with the 900-series platform. The durable volume tool features a new graphical user interface and touch screen as well as a PC-based operating system. It offers on-line and off-line data logging for analysis via compact disc, floppy diskette, or on-screen diagnostics. Other capabilities include unlimited plasma recipes, redesigned motor drivers for transport efficiency, and upgrade-ready software.

MicroHome | Search | Current Issue | MicroArchives
Buyers Guide | Media Kit