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NIST wafer improves RTP

A calibration wafer developed by NIST improves chipmakers' ability to accurately measure and control temperature during rapid thermal processing (RTP). The test wafer is designed to meet the semiconductor industry's need to reduce temperature measurement uncertainty to 2°C. Thin-film thermocouples linked to the wafer tie temperature measurements to the international temperature scale. This capability enables users to repeat the same process conditions in different RTP chambers and facilities. International Sematech and an unnamed U.S. manufacturer of RTP equipment are evaluating the NIST test wafer.

Using test wafers, semiconductor manufacturers record temperatures in RTP chambers with a light pipe radiation thermometer, the institute's researchers point out. The thermometer has an accuracy of 5°­6°C, they note, adding that the latest revision of the International Technology Roadmap for Semiconductors calls for a reduction to 2°C. The NIST approach replaces the wire thermocouples now in use with on-wafer thin-film components. This change eliminates large junctions caused by the pairing of thermocouple wires and prevents heat transfer at the junctions that can hinder temperature measurement. The team also developed methods for calibrating thin-film thermocouples on the international temperature scale, enabling the calibration of light pipe radiation thermometers to within 2°C. Information: kenneth.kreider@nist.gov.

Wiper standard set for release

A new standard described as a major improvement over previous cleanroom wiper test methods has been issued by ASTM. Test method E2090-00 enables users to count the complete number of particles and fibers likely to be released by a wiper used for surface cleaning. Previous test methods examined only a narrow range of particle sizes in conditions more theoretical than practical. The ASTM standard is titled "Standard Test Method for Size-Differentiated Counting of Particles and Fibers Released from Cleanroom Wipers Using Optical and Scanning Electron Microscopy." The publication date was set for August 2000.

The new benchmark contains three major advances, according to ASTM. The first is that sample preparation involves subjecting the wiper to the chemical environment in which it will be used. The second is that the test captures and measures all of the particles released by the test wiper. The captured particles are classified as small (<5 µm), large (between 5 and 100 µm), and fibers and particles at >100 µm. The third advance is the use of optical and scanning electron microscopy to count particles. Information: http:// www.astm.org.

Japanese FPD shows merge

SEMI has joined forces with two Japanese display associations to present a combined FPD trade show in spring 2001. The trade association describes the new event, called FPD Expo 2001, as a comprehensive exposition dedicated to display manufacturing technology. The show is scheduled for April 18­20 at the Tokyo International Exhibition Center. The combined event will showcase manufacturing technology, materials, components, equipment, electronic displays, and systems LSI technology, SEMI says. The event combines shows sponsored by SEMI, the Electronic Industry Association of Japan (EIAJ), and the Japan Electronic Industry Development Association (JEIDA). SEMI and EIAJ will cosponsor the Electronic Display Forum and the Electronic Display Tutorial during the run of the exposition. Information: tono@semi.org.

IEST gets ANSI okay

The American National Standards Institute (ANSI) has approved IEST as an accredited standards-writing organization. The accreditation means that IEST may submit documents to ANSI for consideration as national standards. Each submitted document must undergo the canvass method process. The canvass method permits any interested party to offer an opinion for consideration and to appeal adverse aspects of the document. The process guarantees that the document will not be dominated by any particular interest category. For this reason documents submitted by IEST must undergo a standards action public review. IEST credits the ANSI acceptance to its long-term practice of establishing its standards and practices program to meet the institute's own standards. Information: http://www.iest.org.

MRS issues call for papers

Materials Research Society (MRS) is seeking technical presentations on a broad range of interdisciplinary materials-related research for its spring 2001 meeting in San Francisco. Scheduled for April 16­20, the meeting includes 33 symposia covering advances in the synthesis and application of materials in advanced integrated circuits and other high-tech fields. Abstracts sent by fax or mail must arrive at MRS headquarters by October 18, 2000. The deadline for abstracts sent to the MRS Web site is November 1. The Web site will be activated for abstract submission on October 1. Templates and instructions can be viewed on the site at http://www.org/meetings/ spring2001/.

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