Copper-Stripping Service

Noel Technologies

Campbell, CA

A proprietary scrub process uses spin cleaning to remove copper-material residue from 6-, 8-, and 12-in. wafers one at a time. The cleaning scrub and special chemical rinse are designed to remove copper while maintaining substrate integrity and wafer thickness, thus enabling wafer recycling. The wet-bench first stage of the process is performed on a dedicated copper line to prevent cross-contamination. Stripping of individual wafers is then repeated with continuously supplied fresh chemicals and deionized water in a Class 10 area of the fab. This process enhances gate oxide integrity and minimizes metallic particle contamination. SIMS analysis is conducted to measure sodium, iron, and copper on the surface of stripped wafers.

Nylon Tubing

Nelco Products

Pembroke, MA

New Age nylon tubing features a moisture-absorption rate of 1.9% maximum @ 73°F. The tubing does not become brittle or swell as a result of contact with water. It also resists solvents, alkaline substances, oils, greases, petroleum products, fungi, and mold. It can tolerate repeated flexing without suffering fatigue. Semirigid and flexible grades are available in sizes ranging from 1/8- to 1-in. OD, with tolerances of 0.001­0.003 in., depending on the size. Designed for use in instrumentation, the tubing offers an operating temperature range of 90° to 212°F.

Chemical Delivery System

Arch Chemicals

Norwalk, CT

The GenStream200 is a versatile delivery system for bulk ultrapure chemicals. Particularly suitable for large-scale process applications, the expandable system incorporates the controls that have been designed for the GenSystem family of chemical delivery systems. It offers seamless integration with existing refill systems. The reservoir has a capacity of 200 L, and containers are made for simple change-out.

Process Control Software

Yield Dynamics

Santa Clara, CA

Bogie advanced process control (APC) software enables users to meet the overlay threshold required for the achievement of 0.12-µm design rules by means of mix-and-match lithographic methods. Using modeled control parameters, it allows any lot to be directed to any capable exposure tool. The software automates the calculation of exposure tool alignment settings prior to exposure and automatically compensates for reticle, tool-matching, and process errors, thereby minimizing rework and maximizing exposure tool capacity. Bogie is an upgrade of the manufacturer's MAPA (model automated production applications) APC software.

RTP System

Steag Electronic Systems

San Jose, CA

Designed for 200- and 300-mm applications, an advanced rapid-thermal-processing tool for volume production of devices down to 0.10 µm uses externally generated steam in concentrations of 1 to 90%. The 3000 Steam system offers temperature control that is independent of ripple emissivity, providing repeatable results regardless of variations in wafer backside conditions. The system also maintains a total components of variance of ±2°C. The system features a slip-free ring that completely surrounds the wafer to eliminate edge effects, thus reducing wafer-slip defects. A dual-arm robot optimizes production throughput.

Quartz Heater Modules

Watlow Electric Manufacturing

St. Louis, MO

New ultrapure thick-film quartz heater modules are for use in aggressive chemical applications, such as those using ammonium hydrochloride, hydrochloric acid, hydrogen peroxide, phosphoric acid, and ultrapure 18-M deionized water. By utilizing semiconductor-grade quartz, these high-watt density heaters outperform infrared quartz heaters in terms of heat output while avoiding the permeability problems of Teflon-coated products. Their thick-film heating elements are applied directly onto the exterior surface of the quartz tubes, providing an efficient transfer of heat energy and enabling rapid response to changes in flow and temperature. The heaters have a maximum process temperature of 180°C, a maximum operating pressure of 75 psi, and a maximum flow rate of 35 L/min.

Flow Control Valve

NT International

Minneapolis, MN

The Model 6400 control valve is designed for UHP liquid chemical applications, including those that use highly corrosive chemicals and CMP slurries. Featuring all-PTFE wetted parts, the valve offers double-diaphragm construction for fluid containment and protection against contamination. The valve seat and diaphragm minimize dead volume and fluid shear. Closed-loop flow control is achieved by means of a flowmeter and the CM100 control module. The controller uses a PID control algorithm to maintain the flow rate between 50 ml/min and 5 L/min

Data-Mining Tools

Jon Goldman Associates

Orange, CA

A suite of Web browser­based analysis utilities enables data captured from the semiconductor manufacturing process to be accessed and viewed in graphical format, in real time, through a company's intranet. Instead of each PC running a separate program to allow the viewing of graphical data, the Internet browser on any PC can go to an intranet address and use the software manufacturer's data-mining tools from there. The data-mining suite includes tools for collecting, analyzing, and viewing equipment data. Version 5 of the software can monitor any fab process tool, provide charts and reports containing the result process data, and notify personnel when business rules have been violated.

Fluid-Handling Components

Entegris

Chaska, MN

SpaceSaver fluid-handling components made of new Teflon PFA HP Plus can withstand the most aggressive chemistries used in semiconductor manufacturing. The construction material is characterized by excellent chemical and fluorosurfactant resistance and long flex life. Its melt-flow properties make it possible to mold fittings in configurations that consume little space in crowded equipment cabinets. The clarity of the material allows easy visual inspection of tubing. Components made of HP Plus include 1/4-, 3/8-, 1/2-, 3/4-, 1-, and 11/4-in. fittings and 3/8-, 1/2-, 3/4-, 1-, and 11/4-in. tubing.

Gas Purifier

Aeronex

San Diego, CA

The GateKeeper gas purifier controls moisture in HCl in order to minimize system corrosion. The purifier features a low-pressure-drop media consisting of high-surface-area silica zeolite with a silica binder. This technology enables facility managers to send HCl gas to process tools at safe low pressures that reduce pipe corrosion by minimizing Joule-Thomson effects. Since channeling through the media is virtually eliminated, moisture removal is highly efficient; the purifier reduces moisture to <100 ppb in corrosive gas. The media is available for point-of-use, area, and bulk applications.

IPA Drying System

AIO

Fremont, CA

The Sonic Fog liquid-phase isopropyl alcohol system can completely dry substrates ranging in size from 50-mm wafers to 1-m² glass panels used in making semiconductors, disk drives, and flat-panel displays. The process involves using liquid IPA at room temperature along with the application of ultrasonics. The drying system produces a low level of chemical emissions and consumes IPA efficiently.

Spin Processor

SEZ Group

Villach, Austria

Designed for wafer cleaning and thinning applications, the 304 spin processor 300-mm platform complies fully with SEMI 300-mm automation and communications standards. Seen as a replacement for batch wet-bench applications, the spin processor performs backside film removal preceding advanced lithography operations and provides silicon stress relief for die-strength enhancement in thinning operations. The spin processor can thin frontside film for 50-Å gates, clean the bevel, and remove postetch residue or polymer. It can also remove metallic, copper, organic, particulate, and other backside contaminants. The process tool incorporates an object-oriented, multitasking Windows NT software platform that facilitates factory integration

Thick-Film Photoresists

Clariant AZ Electronic Materials

Somerville, NJ

An advanced deep-UV thick-film positive photoresist is capable of high resolution with excellent aspect ratios, achieving critical dimensions with 15:1 aspect ratios even in isolated-space structures. In 3.0-µm-thick films, isolated spaces measuring 0.20 µm can be processed at 0.4 nA with an 88° (or better) sidewall angle using binary photomasks. The AZ DTF-8 resist is compatible with a variety of substrates, including bottom antireflective coatings. It is also easily stripped and performs well in plating applications.

Electro-Copper Deposition System

Ebara Technologies

Sacramento, CA

A damascene-type metal deposition system is based on a small-footprint platform already proven in use with the manufacturer's line of chemical-mechanical polishing systems. The Model DMP copper-plating system performs at throughput rates up to 70 wafers per hour. It is compatible with seed and barrier deposition, either sputtered or deposited by chemical vapor means. The system offers mean time between failures of >250 hours and mean time to repair of <2 hours. Through integrated cleaning, it provides convenient dry-in/dry-out processing.

Wafer-Testing Probe

Solid State Measurements

Pittsburgh, PA

The SSM 600 elastic probe acts as an MOS gate that can be tested for electrical characteristics in monitoring semiconductor fabrication. Unlike previous test technologies that required the use of monitor wafers, the probe measures product wafers nondestructively. The test takes 30­120 seconds and involves a test area of 30-µm diam. The elastic probe tests dielectric thickness, soft-dielectric breakdown, high-k dielectric constant, flat-band voltage, effective charge, and threshold voltage. It also measures interface trap density and average channel dopant density.

High-Purity Piping

George Fischer

Tustin, CA

High-temperature-resistant valves, a high-purity gasket, and a high-purity butterfly valve are offered for incorporation into the supplier's SYGEF high-purity PVDF semiconductor piping. The Type 315-HTR IR diaphragm valve and Type 319-HTR zero-static valve are designed with a secondary FPM O-ring and serve in applications involving wide temperature fluctuations. The zero-static valve is suited for eliminating dead legs in ultrapure water systems. This valve comes in 34 sizes. The low-torque high-purity gasket provides good compressibility, chemical resistance, and leak-free operation. The fiberglass Type 040 butterfly valve is made of ozone-compatible materials. The piping system has also been expanded to include pressure ratings of 232 psi for PVDF piping measuring 160­225 mm diam.

Nanoscale Profilometer

Surface/Interface

Sunnyvale, CA

The SNP 9000 nanoscale stylus profilometer performs two- and three-dimensional measurement of critical dimensions for photomask metrology and mask-repair characterization. The instrument nondestructively measures and characterizes clear and opaque defect repairs made by focused-ion-beam (FIB) systems and provides information about the dimensions and shapes of complex mask features in order to facilitate the repair process. Z-axis information from the system makes possible the more precise direction of FIB repair end-pointing of quartz bumps. Measurements can be made on such insulating materials as quartz without the charging problems associated with electron-beam techniques.

Flowmeters

Asahi/America

Malden, MA

The FloSonex line of thermoplastic ultrasonic vortex flowmeters can be used in wet-bench applications and in chemical distribution systems. The meters can handle rapid changes in fluid temperature without receiving erratic or erroneous signals. Accuracy and repeatability are 0.75 and 0.25%, respectively. A high turndown ratio of 25:1 enables very low flow rates. Because their replaceable sensors are mounted externally, the meters can be maintained without removal from the line. The flowmeters are available in sizes from 1/2 to 3 in.

CMP Metrology System

Sensys Instruments

Santa Clara, CA

The CMS 2000M metrology system for monitoring copper, tungsten, and dielectric CMP processes is capable of detecting metal residues and measuring barrier thickness, oxide erosion, and dishing. The self-calibrating system also performs comprehensive dielectric-film measurements on production and test wafers. Noncontact, nondestructive measurements are based on broadband UV/visible spectrophotometry. Five-point measurement of randomly oriented wafers typically takes 20 seconds per wafer. The Windows NT­based system can be configured for on-line or stand-alone monitoring. Wet and dry measurement options are available for each configuration.

Process Management Systems

FEI

Hillsboro, OR

The expanded DualBeam line of systems for process management in semiconductor manufacturing includes an automated system for 300-mm wafers. The systems integrate high-resolution scanning electron microscopy with advanced focused-ion-beam milling and deposition. The various systems enable users to cut, view, measure, analyze, and modify the structures of ICs during all stages of manufacturing. Mask repair, copper etch, 3-D metrology, critical dimension measurement, circuit edit, and TEM sample preparation are system capabilities. This range of functions provides complete control over the complex structures that result from shrinking device geometries and the introduction of new materials and processes.

Door Seal Technology

Greene, Tweed

Kulpsville, PA

The BSV (bonded slit valve) door consists of a seal made of the proprietary perfluoroelastomer compound Chemraz bonded to an aluminum-and-stainless-steel door. The bonded design minimizes abrasion in the gland and thus decreases particulation. Installation is a matter of removing and replacing a few bolts. The company says the life of the bonded door seal in an HDP-CVD application has tested out to 5000 wafers, compared with 600­800 wafers for an O-ring seal.

Orbital Welding System

Swagelok

Solon, OH

An advanced programmable orbital welding system provides high-purity welds for fluid-handling components. The system features a 37-lb power supply; Series 20 weld fixtures for one-step fit-up of short sanitary fittings for welding; a tube-facing tool that prepares the ends of tubing, fittings, and ferrules cleanly and consistently; and an arc-gap gauge that precisely positions the orbiting electrode relative to the weld joint to thousandths of an inch. Powered by a 486 microprocessor, the system can store hundreds of welding programs. New programs can be created via a computerized programming interface or can be generated automatically on the basis of user responses to system prompts.

High-Purity Power Supply

Arc Machines

Pacoima, CA

The Model 207-HP high-purity power supply is a 100-A microprocessor-controlled tube-welding power supply and controller specifically designed for use in areas where particulate shedding is of concern. Because of its design and construction, this component is more effective at reducing particulate contaminants than conventional tube-welding power supplies. It utilizes an all-stainless-steel gas system and an internal cooling system that eliminates the need for external airflow. High-purity, semiconductor-grade gas connections and polished stainless-steel housing make the 207-HP suitable for use in cleanrooms.

Chuck Thermometer

Luxtron

Santa Clara, CA

The 500-series Fluoroptic thermometer performs precise and repeatable temperature measurement of electrostatic chucks. Designed for OEM use, the thermometer is a compact board-level device for applications requiring immunity from aggressive electromagnetic environments. It offers a calibration and measurement range of ­195° to 300°C and an accuracy of ±0.5°C. An RS-232 interface and analog outputs are supplied with the thermometer. A wide variety of both contact- and noncontact-style fiber-optic probes are available. The company also supplies sensors for use in etch, deposition, epi, and RTP processes.

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