INDUSTRY NEWS

ROUND THE CIRCUIT

Litho breakthrough promised

Working on a joint program, FSI International and ASML promise to create an integrated lithography cell that combines subwavelength capability and high throughputs. The two equipment manufacturers have integrated FSI's Polaris 2500 microlithography cluster tool with an ASML PAS 5500/750 deep-UV step-and-scan system. The partners say the deep-UV lithography cell can process 200-mm wafers at a rate of 120 per hour. They have installed the system at ASML's demonstration lab in Tempe, AZ. The cluster tool features Millipore's IntelliGen dispense system, and Shipley has agreed to supply deep-UV photoresist in order to establish a baseline process for testing throughput and quality control. In addition, the cluster tool uses a VaporSorb Profile 2500 filtration system from Extraction Systems for airborne molecular contaminants. ASML says it will use the cell to explore methods of extending optical lithography capabilities.

On-line chemical safety offered

A software company has launched an on-line program on workplace chemical safety that is designed to aid in hazardous materials management and OSHA compliance. Netward Software of Phoenix is making the program, called Safety Officer II (SOII), available on the Internet. The company describes SOII as a "comprehensive" chemical safety package giving customers access to material safety data sheets from chemical manufacturers. The program is based on the XML business-to-business platform. Netward says it will publish the XML schema so that chemical manufacturers can put their safety data on-line. Users of SOII can convert chemical data into safety information tailored to suit their particular workplace policies. A tutorial is designed to help companies comply with OSHA regulations on worker training and handling hazardous materials. SOII also comes in PC and client-server versions. Information: http://www.safetyofficer.com.

Sematech okays in-line tool

International Sematech has given thumbs up to a metrology system that can measure doping processes below 0.18 µm. The consortium says its evaluation of the Boxer Cross BX-10 source-drain and ultrashallow-junction measurement system shows the tool is capable of offering in-line measurement of annealed dopant layers on product wafers. "This capability gave us several key discoveries in our efforts to develop sub-130-nm doping technologies," says Rinn Cleavelin, International Sematech COO.

Boxer Cross notes that the International Technology Roadmap for Semiconductors calls for junction depths of 70 to 140 nm for source-drain implants and of 36 to 72 nm for extension implants. Because the depths are 50 to 100% shallower than they are for 250-nm devices, they require chipmakers to precisely control both ion implantation and rapid thermal annealing processes, the vendor points out. Current methods for monitoring implantation in the fab run into sensitivity limitations, require the use of test wafers, or require analytical lab work that can be slow and destructive. Boxer Cross says the BX-10 maps process variations on the wafer within minutes by making measurements automatically at sites selected by the operator.

In other news, International Sematech named Juergen Woehl director of its Advanced Tool Development Facility. A senior assignee from Infineon Technologies, Woehl came to the consortium in August 1999 as account and tech transfer manager.

Clariant found irresistible

IMEC, the Belgium-based R&D consortium, has selected a photoresist from Clariant's AZ electronic materials unit for its deep-UV research. The chemical, DX 5105P, will be used for critical gate levels in IMEC's 248-nm pilot line. The photoresist displayed "superior performance for imaging semidense and isolated 150-nm and smaller features and line-edge roughness," says Kurt Ronse, director of the lithography department. IMEC conducted the research through its industrial affiliates program on 248- and 193-nm lithography.

NIST picks technology director

Alan Balutis has been named by the U.S. Commerce Department as the director of NIST's Advanced Technology Program (ATP). Balutis replaces Lura Powell, who retired in September 1999 after directing the program since 1995. The new director is a 21-year veteran of the Commerce Department, most recently serving as director for budget, management, and information. The ATP, which shares the cost of advanced R&D with industry, is overseeing more than 200 projects.

Disaster book published

The ninth edition of a 350-page disaster recovery sourcebook is a guide to recovery services in the United States and Canada. The Disaster Recovery Yellow Pages contains more than 3000 vendors covering more than 270 categories. Services include drying and dehumidifying of paper and microfilm, emergency rentals, air testing, electric generators, and disposal of hazardous wastes. The publisher, Systems Audit Group, consulted more than 100 organizations for information on disaster recovery. Information: http://www.disaster-help.com.

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