INDUSTRY NEWS

Automation info published

A new on-line document has been released that contains the basic tool requirements for automated processing of 300-mm wafers. Developed by International Sematech and the Japanese consortium Selete, the document provides base operation scenarios for fixed-buffer single-wafer process tools. The two consortia began work on the document in March. The goal is to support industry-wide standards for software functionality in 300-mm equipment. Randy Goodall, associate director of manufacturing methods and productivity at International Sematech, says the published requirements will make it easier for chipmakers to equip their fabs with 300-mm tools. Kenichi Kawashima, director and general manager of Selete manufacturing technology research, claims the guidelines "will reduce variation in requirements and encourage consistent implementation among all equipment makers." The guidelines are based on the CIM Global Joint Guidance and SEMI standards.

A forum covering the functionality requirements for internal buffer batch processing tools will be held July 14 during Semicon West 2000. Both International Sematech and Selete will publish the basic requirements that same month. SEMI Japan was scheduled to sponsor a workshop in June focusing on software requirements for automated manufacturing. In October the two consortia plan to release extended requirements and sample scenarios for more advanced operations covering the same tool types.

The Selete/International Sematech 300-mm functionality requirements document is available on Sematech's Web site at http://www.sematech.org. Selete plans to publish an abstract in Japanese at http://www.selete.co.jp/.

Large SOI wafers coming

A French manufacturer of silicon-on-insulator (SOI) wafers says it will make 300-mm versions of the substrates. Soitec of Bernin, France, will begin preproduction early in 2001 with full production set to start in 2002. Lacking the necessary equipment, Soitec will start making prototypes using outside gear in close collaboration with its strategic partner, Shin-Etsu Handotai. Eventually, the wafer producer will install 300-mm equipment in a dedicated extension of its plant in Bernin. Soitec says its wafer bonding technology called Smart Cut uses hydrogen implantation to cause splitting along the implanted area in order to form the SOI structure.

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