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Back Issues of MICRO
Magazine
January/February 2006 | March 2006 | April 2006 | May 2006
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January/February
2005 | March 2005
| April 2005 | May 2005
June 2005
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October/November 2005 | December 2005
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June 2006
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: FEOL challenges, new materials push surface-preparation agenda
- Lefty: Imprint roadmap
- The BIG Idea: Pure polysilicon furnaceware could pave way for Integrated materials success
- Chipworks Corner: TSMC fabbed Matrix 3-D memory array with unique 0.15-µm, seven-metal proces
- 'Round the Circuit: TEL launches VC unit; Micron, Photronics form joint venture
THE HOT BUTTON
- Lithography: If you want to improve CD control, you must identify sources of focus and dose errors
-
Columnist Bijan Moslehi discusses micro fuel cells for portable electronics
TECHNICAL ARTICLES
PRODUCT TECHNOLOGY NEWS
-
Products: Metal thin-film metrology tool, all-digital pressure transducers, butterfly valve, photolithography mask aligners, DRIE ICP system, polysilicon furnaceware, photoresists, remote particle counters, copper plating additives, cleanroom cabinetry, photoelectron spectroscopy, copper seed solution, exhaust-pressure controller, dry etch tool
-
Product Extra: Cleaning tool enhanced with eight double-side process modules; vendor offers remote capability for transmission electron microscopes; patent granted for method of increasing resolution in existing D/A convertors without additional hardware; maskless photolitho system projects master images directly onto substrate materials; supplier receives patent for use of silicon carbide barrier films between dielectric and metal layers
SEMICON WEST 2006
May 2006
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: California colleges, industry team to explore post-CMOS frontier
- Lefty: Sound the alarm
- The MICRO Interview: KLA-Tencor’s Rick Wallace
- 'Round the Circuit: Novellus donates 200-mm CMP tool to Tsinghua University; Renesas, Applied Materials join industry consortia; ChipMOS, Oracle Taiwan, and Taiwanese Institution of Engineering for Information Industry team up to develop a semiconductor supply-chain system; NanoMarkets sees new thin-film growth; IMEC VC fund capitalized; Foresight Nanotech Institute seeks nominees for 2006 Feynman prizes
THE HOT BUTTON
- BEOL Processing: Copper/low-k dielectric interconnect schemes have legs, but how long until alternatives are needed?
-
Columnist Bijan Moslehi illuminates the emergence of solid-state lighting
TECHNICAL ARTICLES
-
Transistorama: Developing a systematic approach to metal gates and high-k dielectrics in future-generation CMOS Sematech researchers present a terraced-oxide method for extracting the effective work function of metal gates in an effort to integrate metal gates and high-k dielectrics in CMOS devices
-
Tool/Fab Support Strategies: Achieving process utility conservation and cost reductions in a 300-mm fab environment; a case study details a DRAM fab’s successful multiyear effort to reduce exhaust while lowering consumption of clean dry air, UPW, cleanroom air, and process cooling water
- Wet Surface Technologies: Comparing single-wafer and batch polymer cleans using inorganic chemicals in BEOL applications; a fab case study demonstrates that the use of a single-wafer cleaning tool in conjunction with inorganic chemistry improves device yields and reduces defectivity levels in BEOL applications
PRODUCT TECHNOLOGY NEWS
-
Products: Mask-writing system, thin-film deposition controller, diaphragm valve, wet processing station, photoresist coating technology, ozone sensors, ion implanter, DI-water heater, miniature isolation valves, wafer-flatness metrology tool, servomotor, scatterometry acceleration tool, bonded door seals
-
Product Extra: Supplier receives patent for IC and optoelectronic chemistries; sensing tube and high-pressure options enhance mass-flow meters; CD measurement tool provides submicron resolution with machine-vision speed; vendor offers strained-silicon process control system for HRXRD measurements; Web site focuses on the Chinese market
April 2006
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: Despite silicon’s strengths, compound semi industry compounds growth
- Lefty: Wind-powered implant
- The BIG Idea: UHP DI-water steam has thermal, cleaning applications in chipmaking, says start-up
- Chipworks Corner: Infineon uses vertical structure to optimize on-resistance in power MOS devices
- 'Round the Circuit: ASMC back in Boston; TSMC readies immersion; spintronics program started; SEMI issues standards
THE HOT BUTTON
- Factory Integration: Tool reliability, cycle times, other productivity metrics must improve in increasingly complex fabs
-
Columnist Bijan Moslehi investigates renewable power generation from photovoltaic solar cells
TECHNICAL ARTICLES
PRODUCT TECHNOLOGY NEWS
-
Products: E-beam inspection system, film-thickness measurement unit, ceramic vacuum wafer chucks, strip tool, absolute-pressure transducers, cleanroom paper, PCI-bus motion controller module, thermoelectric heater/chiller, vibration-isolation workstation, double-ferrule tube fittings, high-purity optical lens material, optical 3-D profiler, gallium nitride-on-diamond wafer, ammonia monitor, wafer-flip module, cleanroom oven, on-line TOC analyzer
-
Product Extra: Automation platform services multiple plasma process chambers; vendor offers thin-film coatings capability to customers needing optical coating services; supplier provides photolithography services and blanket resist coatings; Web site optimizes the efficiency of purchasing cleanroom consumables; six nonaqueous organic hydroxides and salts aid resist, stripper, and cleaner suppliers
March 2006
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: Polysilicon forecast is cloudy for solar cell, IC industries
- Lefty: Apple vs. The Postal Service
- Semicon Europa: Semicon Europa turns 30
- Breakout: ISMI program to develop 300 mm Prime, explore transition to 450-mm manufacturing
- 'Round the Circuit: CS Mantech hits Vancouver; Intrinsic licenses CMP process; MEMS market grows; UCLT scores financing; IEST updates air filtration handbook; Podesser joins Unaxis
THE HOT BUTTON
- Tech Emergent: Novel research materials, devices extend CMOS, suggest revolutionary post-CMOS approaches
-
Columnist Bijan Moslehi returns to survey the role of enabling technologies as emerging market drivers
TECHNICAL ARTICLES
Transistorama: Meeting the future challenges of high-k gate dielectrics and metal gates
-
APC/AEC: Implementing EDA to improve equipment performance and fab productivity
-
-
Critical Materials: Monitoring oxidation processes in-line using a novel characterization technique
PRODUCT TECHNOLOGY NEWS
- Products: Ion implanter, mask aligner, 3-D modeling software, reticle inspection system, photomask metrology tool, handheld particle counter, resist stripper/residue remover, variable-area flowmeter, ArF lithography light source, electric linear actuators, vacuum-pump inlet trap
January/February 2006
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
THE HOT BUTTON
FEATURED SERIES
- Chipworks Corner: Fujifilm maximizes charge-coupled device’s 0.35-µm, two-metal, double-poly process
- Transistorama: Accelerating flash product inspections using a novel E-beam inspection method
WET SURFACE TECHNOLOGIES
DEFECT/YIELD ANALYSIS, METROLOGY
DESIGN FOR MANUFACTURING
PRODUCT TECHNOLOGY NEWS
December 2005
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
October/November 2005
Selected Contents
EDITOR'S
PAGE
INDUSTRY
NEWS
- Lead
Story: Will
DFM become the lingua franca of the chip world?
- Lefty:
Prototype
this
- Chipworks
Corner: Texas
Instruments pushes MEMS
envelope with micromirror-based
DLP
- Expansions,
Acquisitions & Alliances: Freescale,
Photronics team up; TSMC
megafab approved; MEMC's 300-mm
Taiwan plant opens; Rohm
and Haas plans manufacturing and tech center in Hsinchu;
DuPont greenlights China site; SIA's nano initiative
scores funds
-
-
BEOL
Processing: Copper electroplating, CMP
challenges grow more complex at 65-nm
node and beyond
-
Columnist
Bijan Moslehi reviews
materials, cost, productivity, risk
management, and other technology challenges
TECHNICAL
ARTICLES
-
TechEmergent:
Filling
contacts using a pulsed nucleation
layer of tungsten nitride
- Wet
Surface Technologies: Performing
advanced post-CMP cleans
to reduce copper defectivity and
surface roughness
- Critical
Materials: Selecting
proper chamber-cleaning processes for installed-base CVD
tools
PRODUCT
TECHNOLOGY NEWS
-
Products:
X-ray inspection tool, dry ice cleaning system,
turbo pump, CD/profile mask metrology, UHP liquid-flow
sensor, acid-laden-air
exhaust duct, wet-processing-solution
analyzer, tee valve, pressure-insensitive MFCs,
dielectric materials, optical inspection system,
charged-plate monitor, HFIP-NB photoresist
coatings, liquid particle counter, wafer edge-grinding
tool, all-plastic
degassing valve, spincoat dispenser
-
Product
Extra!: Vendor
offers Interface A–compliant EDA product
under open-source license; suppliers
incorporate MFCs into vaporizer used
to deposit high-k dielectrics; model-based yield-analysis
technology provides critical-area analysis,
enhances devices' physical design; software
enables users to size and select control valves;
compact sensors detect wafers and slotting errors
in cassettes or FOUPs
August/September
2005
Selected Contents
EDITOR'S
PAGE
INDUSTRY
NEWS
- Lead
Story: Pace of training
picks up again for the semiconductor industry
- Lefty:
Next-gen scope
- Market
Update: Fab tool, market materials to top $43B
- Expansions,
Acquisitions & Alliances: Intel to site new 300-mm
fab in Arizona; M&A activity rolls along; companies
expand in Asia
- Partnerships
and JDPs: Table lists companies that have entered into
a range of collaborative projects with industry partners
- 'Round
the Circuit:
Sematech offers sourcing info; Cymer, Zeiss form FPD team;
KT Venture Group funds start-ups; partners launch nano roadmap;
IEST joins ISO nano efforts; Kundert to lead SEMI Europe
- E-Manufacturing:
Implementing fabwide process control systems with
Interface-B APC solutions
-
Columnist
Bijan Moslehi examines the rising costs
of R&D
TECHNICAL
ARTICLES
-
- Special
Apps:
Raising yields of bonded silicon wafers with POU DI-water
microfiltration and purification
- Behind
the Mask: Performing
3-D metrology and advanced repairs on leading-edge photomasks
PRODUCT
TECHNOLOGY NEWS
-
Products:
Sub-90-nm
strip system, integrated flow controller, wafer
heater assembly, deep reactive ion etch tool,
hyper-NA immersion litho tool, electrochemical
plating system, miniature linear encoders, metal
thin-film metrology tool, advanced precursor
materials, high-temperature vacuum curing, x-ray
imaging system, EFEM ionization systems, PVD
copper/seed tool, multigas leak detector, CMP
metrology system, gas-pressure and flow-control
devices, trace-moisture analyzer
-
Product
Extra!:
Metrology tools incorporate advanced automation
software; vendor offers integral vacuum chamber
stage concept that reduces the size of vacuum
chambers; OEM provides online service to speed
tool recipe qualification and troubleshooting;
NIST-traceable calibration standards are available
for thin-film calibration; litho light-source-specific
ediagnostics and performance-monitoring software
supports litho light sources
July 2005
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: Special
report: Opportunities abound, but
funding is tight for start-ups
- Lefty: Virtual
storefront
- Market Trends:
Nanotube
boom times ahead
- Breakout:
Chipworks'
analysis finds high-k, recessed transistors in Samsung's
SDRAM
- Expansions, Acquisitions
& Alliances:IBM,
Toppan ink mask deal; Infineon, Nanya ramp 90
nm; Zeiss, investors nab NaWoTec; CVD
buys First Nano assets; Dimatix opens MEMS fab; Asyst, FACTS
sign agreement for conformance testing; Veeco joins AFM
program
- 'Round
the Circuit: WSTS
upgrades revenue forecast; Foresight
group retools; NIST site goes
3-D; ASMC calls for papers
-
FEOL
Processing: Resist removal, selectivity,
substrate damage top list of
surface preparation challenges
-
Columnist
Bijan Moslehi probes the
pros and cons of outsourcing
TECHNICAL
ARTICLES
PRODUCT
TECHNOLOGY NEWS
-
Products:Single-wafer
megasonic cleaner, RGA automation platform,
parts-cleanliness testing station, wafer inspection
tools, photolithography stepper, regulator mounting
manifold, STEM system, wafer-thinning materials,
liquid-dispense module, slurry blending/delivery
units, high-purity PVDF tubing, FOUP/carrier
cleaners, vibration-isolation system, backside
aligner
-
Product
Extra!: Lab
service deposits nanocluster films
onto customer samples; vendor to
integrate cluster boron source technology
on implant platforms; suppliers offer
third-generation implant dopant gas storage
and delivery system; patent granted for method
that improves the accuracy of quantification
results for micro-XRF analyses; operator-control
unit enhances CD measurement systems
June
2005
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: Midyear
forecast update: Ramp to
65 nm may offer sole relief after 2004
buying binge
- Lefty: MEMS
CMP A-OK?
- The MICRO
Interview: TSMC's
Burn Lin
- AEC/APC: Intel
fabs seek 100% FDC
- Expansions, Acquisitions
& Alliances: IBM
to sell or lease Fishkill campus; Air Products
to supply specialty gases to Samsung; Honeywell
opens radiation-hardened ASIC foundry; Cabot opens tantalum
sputtering target facility; Ponté to deliver
DFY software package; Silecs, Nagase partner; Chinese fab
chooses Membrana membrane contactor systems;
Unaxis supplies KANC
- 'Round
the Circuit: SEMI
forms DFM, nano partnerships; TSMC targets 65 nm; Intel
produces one-billionth
chip at Ireland fab; book demystifies chipmaking
-
Lithography:
Can't we all just get along? Designers
and manufacturers grapple with
DFM
-
Columnist
Bijan Moslehi considers
the growing importance of IP
-
The
special section highlights this year's
Technology Innovation Showcase.
TECHNICAL
ARTICLES
PRODUCT
TECHNOLOGY NEWS
-
Products:Patterned-wafer
inspection tools, portable cleanroom fogger,
spent-ultrapure-water
meters, ArF excimer laser, liquid-flow controller,
megasonic system, electrical flex-circuit seals,
miniature
screw rail, micro/macro defect
detection, strained-SOI wafers, diode-pumped
solid-state laser, wafer reader, laminar-flow
clean bench, linear motor stages, in-line chemical
metrology system, depth and CD measurement system,
motor control IC, extruded flat PVDF, valveless
piston pump, six-axis nanopositioning system
-
Product
Extra!: MEMS
design software adds all-angle design-rule
checking capability; analytical services
laboratory becomes ISO/CEI accredited; vendor
releases industrial electronics products catalog;
x-ray metrology system measures sub-100-µm
test pads in chips and scribe lines; supplier's
software upgrade expands particle
counter capabilities; brochure details
electric process heating and control products
May 2005
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: X-architecture
update: Diagonal design to yield production chips in 2005
- Lefty: A
piece of cake
- Breakout: Toolmakers
jump on China/Asia used-equipment bandwagon
- Tech Outlook:
Sematech's
top 10 tech challenges
- Photo Gallery:
Ultra
Clean Technology opens Shangahi plant
- 'Round
the Circuit: Fabless
revenues grow; Aixtron enters
novel metals R&D alliance; South
Dakota school offers FA; ReVera
scores funds; new SEMI standards
issued; litho book published
-
BEOL
Processing: Surface prep, cleaning,
stripping of low-k dielectrics, copper
interconnects
become more problematic
-
Columnist
Bijan Moslehi grapples
with managing profitability through
the cycles
TECHNICAL
ARTICLES
-
TechEmergent:
Using
a real-time, point-of-use sensor to control
liquid-chemical concentration
- Wet
Surface Technologies: Forming
an interfacial oxide layer for
high-k gate dielectrics using a single-wafer
wet tool
- Tool/Fab
Support Strategies: Analyzing
the effects of filter surface chemistry and morphology
on 193-nm litho applications
PRODUCT
TECHNOLOGY NEWS
-
Products:Optical
wafer-flatness system, total organic
carbon sensor, infrared sensor graphic interface,
nanopatterning stepper,
thin-film metrology tools, real-time
FDC system, PVC sheet material,
chemical mixer, piping and
fusion systems, semiconductor lamp,
full-chip verification tool, yield
management software
-
Product
Extra!: Spectral
engineering techniques minimize OPE
variations, enhance DOF; patent awarded
for hydrogen purification system;
supplier enhances EES platform; nickel-platinum
strip process enables 65-nm salicide formation;
thin-film analysis software supports ellipsometry,
reflectance, transmittance analysis;
vendor offers tantalum sputtering
target Web site
April
2005
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: Despite
advances, MEMS industry still feels growing pains
- Lefty: ABCs
of failed litho
- Semiconductor History:
Present
at the creation
- The MICRO
Interview: Novellus
Systems' Sass Somekh
- 'Round
the Circuit: Vitex
moves to commercialize transparent barrier coating
and flexible glass technologies; CNT tips grown
on SPM cantilevers; Frost & Sullivan chipmaking
report issued; immersion lithography, ISMI symposia
call for papers
-
E-Manufacturing:
Integrated metrology, e-diagnostics
have made inroads, but problems still hinder
widespread implementation
-
Columnist
Bijan Moslehi ponders lithography at the
crossroads
TECHNICAL
ARTICLES
-
- Defect/Yield
Metrology: Using an XPS-based metrology system
to determine film thickness and composition
- Special
Apps: Comparing the costs of photoresist coating
using spin, spray, and electrodeposition systems
PRODUCT
TECHNOLOGY NEWS
-
Products:
Ion
implantation tools, benchtop FTIR spectrometer,
hybrid ball screws, imprint lithography system,
spin track system, cleanroom wipes, ultrasonic
sensors, dc power systems, flaring
system, CMP pad conditioner, FTIR moisture analyzers
-
Product
Extra!: Supplier
offers upgrades for x-ray fluorescence
wafer analyzers; Web site provides on-line information
on water purification, wastewater treatment, water
analysis systems and services; patent awarded
for high-selectivity process for etching high-k
films; vendor offers free samples of polyimide
and high-performance thermoplastic materials;
catalog covers vacuum technology, including
equipment for producing, controlling,
and measuring vacuum
March 2005
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: Materials
update: Suppliers, OEMs, chipmakers must improve cooperation
- Lefty: Fab
owners, unite!
- Fab Outlook: Differing
300-mm opinions
- The MICRO
Interview: IBM's
Don Eigler
- Expansions, Acquisitions
& Alliances: Merck
sells electronics unit to BASF; DPI increases capacity in
Singapore; SMIC, TSMC settle; MKS grants Philips license for
high-speed IR thin-film metrology; Straatum scores funds;
Picogiga pumps up HEMTs
- Breakout:
Munich welcomes back Semicon Europa
- 'Round
the Circuit: Sandia
database offers IP; SIA, SEMI plan nano study; Actinix gets
NSF grant; IMT raises venture capital; SCP revives wafer-cleaning
symposium
-
FEOL
Processing: Strained silicon engineering
leads field of transistor technology improvements
-
Columnist
Bijan Moslehi comments on green manufacturing
TECHNICAL
ARTICLES
-
Tech
Emergent: Implementing a batch atomic layer
deposition approach for advanced DRAM dielectrics
- APC/AEC:
Controlling
etch tools using real-time fault detection and classification
- Critical
Materials: Eliminating etch-sequencing-induced dielectric
defects in high-volume manufacturing
- Green
Manufacturing: Maximizing
hydrogen pumping speed in cryopumps without compromising
safety
PRODUCT
TECHNOLOGY NEWS
-
Products:
Optical
thin-film metrology tool, trimethylsilane, temperature
transmitter, CD-SEM, overlay inspection system,
particle-counting manifold system, molecular-beam
epitaxy tool, macrodefect management system, 300-mm
overlay tool, sample preparation and transfer,
workstation/equipment monitor, helium leak detector,
direct-drive linear actuator, workstation Faraday
cages, autofocus linear stage, particle sensor,
absolute-pressure transducers, SPM sensor
-
Product
Extra!: Vendor
offers Web-based filter-life estimator for ASML
litho tools; technical flyer highlights PEEK material
for CMP processes; supplier provides reduced-footprint
process module for Novellus C2 tools; hierarchical
yield control patent supports neural control model
product line; program enhances and upgrades Applied
Materials automated impedance match system
January/February 2005
Selected Contents
EDITOR'S PAGE
INDUSTRY NEWS
- Lead Story: ITRS
update: Interim edition includes no surprises, sets stage
for 2005.
- Lefty: Einstein
cool
- Market Outlook:
Litho
chemical market develops
- Photo Gallery: Giant
robot attacks Makuhari!
- Expansions, Acquisitions
& Alliances: KLA-Tencor
teams up with Synopsys, DNS; IBM, AMD develop strained-silicon
process; SMIC, Fangtek collaborate; IBM, Schneider market
APC; Trazar unit targets RF service
- Breakout:
San
Jose hosts SPIE litho show
- 'Round
the Circuit: DOE
TEAM taps FEI; SEMI seeks innovators for Semicon West; Silicon
Border gets grant; Mattson ships flash-anneal tool to ATDF;
Bede hires McIntosh
-
Lithography:
Leaching, line-edge roughness, topcoats
among key challenges facing immersion photoresist
development
-
Columnist
Bijan Moslehi addresses the nanoscale
DFM challenge
TECHNICAL
ARTICLES
PRODUCT
TECHNOLOGY NEWS
-
Products:
Automated
AFM metrology, E-beam photomask repair tool, high-purity
controls, optical stylus profiler tool, dry vacuum
pump, chemical concentration system, color camera,
portable flowmeters, tungsten deposition tool,
dry leak detector, hydrogen purification systems,
germanium-free sSOI wafers, high-current ion implanter,
barrier slurry
-
Product
Extra!: U.S.
patent granted for I/O technology; vendor modifies
MEMS Web site; supplier increases bulk acids packaging
capability; servomotors are available with high-resolution
sine-absolute encoders; free catalog highlights
inch-series linear ball bearings, pillow block
units, shafting
MicroHome |
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© 2007 Tom Cheyney
All rights reserved.
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